Methods and apparatuses for disassembling components are described. An apparatus in accordance with an aspect of the present disclosure comprises a first component including a first adhesive interface, a second component including a second adhesive interface, a joint between the first and second adhesive interfaces, the joint comprising an adhesive bonding to the first adhesive interface and to the second adhesive interface, such that the first component and the second component are joined together, and at least one thermal element in the adhesive, wherein the at least one thermal element is configured to weaken the joint by heating the adhesive when an energy is applied to the thermal element.

The present disclosure provides a method and a system for separating a touch panel from a display module of a touch display device. The system includes a carrying unit configured to secure a to-be-processed touch display device, and a disassembling unit configured to soften an adhesive between the touch panel and the display module so as to separate the touch panel from the display module, thereby to disassemble the touch display device secured on the carrying unit.

The present disclosure provides a method and a system for separating a touch panel from a display module of a touch display device. The system includes a carrying unit configured to secure a to-be-processed touch display device, and a disassembling unit configured to soften an adhesive between the touch panel and the display module so as to separate the touch panel from the display module, thereby to disassemble the touch display device secured on the carrying unit.

A hot-wire cutter machine comprises a mount (1) that extends in a plane for carrying flat a panel (9) for cutting, and a cutter structure (4) fastened to the mount, which cutter structure is a frame having four sides (4A, 4B, 4C, 4D) between which two crossed cutter wires (5, 6) are tensioned, the frame being fastened inside the mount at two fastening points (P1, P2) that are offset on a line (L) that crosses the frame.

A hot-wire cutter machine comprises a mount (1) that extends in a plane for carrying flat a panel (9) for cutting, and a cutter structure (4) fastened to the mount, which cutter structure is a frame having four sides (4A, 4B, 4C, 4D) between which two crossed cutter wires (5, 6) are tensioned, the frame being fastened inside the mount at two fastening points (P1, P2) that are offset on a line (L) that crosses the frame.

Methods and apparatus relating to provision and/or utilization of a hidden feature for accessing and/or repairing mobile devices are described. An embodiment includes a wire physically adjacent to an adhesive. The adhesive bonds a first portion of a computing device and a second portion of the computing device. The wire is capable of being heated in response to application of electrical voltage or current. In turn, the heated wire causes cutting of the adhesive to allow for physical separation of the first portion of the computing device and the second portion of the computing device. Another embodiment utilizes a hidden end of an opening in a computing device to hide a fastener. Other embodiments are also disclosed and claimed.

Methods and apparatus relating to provision and/or utilization of a hidden feature for accessing and/or repairing mobile devices are described. An embodiment includes a wire physically adjacent to an adhesive. The adhesive bonds a first portion of a computing device and a second portion of the computing device. The wire is capable of being heated in response to application of electrical voltage or current. In turn, the heated wire causes cutting of the adhesive to allow for physical separation of the first portion of the computing device and the second portion of the computing device. Another embodiment utilizes a hidden end of an opening in a computing device to hide a fastener. Other embodiments are also disclosed and claimed.

Systems and methods utilizing stationary and/or moveable cutting components provide limited interference with web processing operations, such as pad spin and pitch alteration. Heat, laser, fluid, or mechanical cutting operations may be used, including respectively, a heated element (e.g., wire, ribbon, bar, or embossing or perforating element) that may be triggered inductively, water or steam jets, or improved knife/anvil cooperation.

Systems and methods utilizing stationary and/or moveable cutting components provide limited interference with web processing operations, such as pad spin and pitch alteration. Heat, laser, fluid, or mechanical cutting operations may be used, including respectively, a heated element (e.g., wire, ribbon, bar, or embossing or perforating element) that may be triggered inductively, water or steam jets, or improved knife/anvil cooperation.

A cutting mechanism (30) for a safety belt (10), the cutting mechanism (30) including a case (32), a passage (34) running through the case and making it possible to mount the cutting mechanism (30) on the belt (10) to be cut, and cutting elements (42) for the seatbelt (10), situated inside the case, the cutting elements (42) include a wire (44) and elements for heating (46) the wire. A process for cutting a safety belt (10), includes using a wire (44) and elements for heating (46) the wire in order to cut the belt with the heated wire.