Patent classifications
B28D1/124
WIRE SAW EXCAVATION APPARATUS CAPABLE OF CHANGING CUTTING LINE IN ACCORDANCE WITH CUTTING SECTION AND TUNNEL EXCAVATION METHOD USING SAME
The present invention relates to a wire saw excavation apparatus that is installed on a plurality of entry holes drilled according to a cutting section of a target surface of rock to be excavated so that the target surface is excavated by using wire saws, and more particularly, to a wire saw excavation apparatus that mounts N pulleys on one entry arm to cut the rock in N directions all at once, thereby remarkably improving the work efficiency.
Self-hammering cutting tool
A cutting tool with a plurality of cutting elements connected to a support structure wherein a portion of the support structure is configured to flex or bend based on the rotational frequency of the cutting tool. The rotational frequency of the cutting tool is a product of the design and composition of the tool.
Cutting Chain for Cutting Mineral or Metallic Materials
A cutting chain for cutting mineral or metallic materials has central drive links with a projection. Pairs of two side members are positioned laterally at the central drive links. The central drive links and the side member pairs are pivotably connected to each other. At least two cutting members are arranged sequentially in running direction of the cutting chain and each have one pair of side members and an abrasive cutting element connecting the two side members to each other. A drive link is arranged between the two cutting members and the projection of the drive link projects into a space between the cutting elements. The cutting chain has a cutout arranged such that a maximum sag of the cutting chain, at which the projection of the drive link comes into contact with one of the cutting elements, is enlarged compared to the same cutting chain without cutout.
Self-Hammering Cutting Tool
A cutting tool with a plurality of cutting elements connected to a support structure wherein a portion of the support structure is configured to flex or bend based on the rotational frequency of the cutting tool. The rotational frequency of the cutting tool is a product of the design and composition of the tool.
Cutting bead for a saw rope
A cutting bead (13) for a saw rope (15) comprises a geometrically defined cutting portion (2) and tapers from the geometrically defined cutting portion (2) contrary to a sawing direction. With such cutting beads (13), a saw rope (15) is formed. In a method for manufacturing a saw rope (15), a cutting element (1) with a geometrically defined cutting portion (2) and an abrasive element (6) with a geometrically undefined cutting portion (14) or a neutral element (8) are joined. With the cutting element (1) and the abrasive element (6) or the neutral element (8), a cutting bead (13) is formed. The cutting bead (13) is joined onto the support rope (16).
CHAIN OF CHAIN SAW
Provided is a chain of a chain saw. In a chin saw including a chain which cuts an object to be cut while being rotated in an infinite trajectory, the chain includes a drive link in which an abrasive is mounted on an upper portion thereof, a pair of side links which are fastened to connect neighboring drive links, and a connection pin which is mounted by passing through overlapping portions of the drive link and the side links. The drive link and the side links may absorb rotational friction so that a rivet can withstand well. By a technical configuration for simply replacing, removing and assembling the assembly of the drive link and side links which become loose, power transmitted to the drive link may be provided as cutting force as it is, thereby improving cutting efficiency.
METHOD FOR PRODUCING DISCS FROM A CYLINDRICAL ROD MADE OF A SEMICONDUCTOR MATERIAL
A method produces wafers from a cylindrical ingot of semiconductor material having an axis and an indexing notch in an outer surface of the cylindrical ingot and parallel to the axis. The method includes, in the order specified: (a) simultaneous removal of a multiplicity of sliced wafers from the cylindrical ingot by multi-wire slicing in the presence of a cutting agent; (b) etching of the sliced wafers with an alkaline etchant in an etching bath at a temperature of 20? C. to 50? C. and for a residence time, such that the material removed from each of the sliced wafers is less than 5/1000 of an initial wafer thickness; and (c) grinding of the etched wafers by simultaneous double-disk grinding using an annular abrasive covering.
Cutting apparatus and method
A plurality of bushings are coupled to one another via a series of bolts to provide an interlocking, articulating cutter. The bolts have a cylindrical end and a convex end. The convex ends are seated inside a concave socket coupled to the bushings. The cylindrical ends are coupled to a convex nut seated inside another concave socket coupled to an adjacent bushing. The convex ends of the bolts are configured to articulate inside the seat of the concave sockets. A washer may be placed between the bushings to provide a desired amount of flexibility and/or rigidity. The outer surface of the bushing comprises a cutting structure, such as a milled or clad cutting structure.
Utility Chain For Cutting Ductile Materials
A utility chain for cutting ductile materials includes a plurality of cutting links. Each of the cutting links includes a sintered cutting segment, a first side plate, and a second side plate. Each of the sintered cutting segments includes abrading particles embedded in a bonding matrix. The utility chain further includes a plurality of drive links, each of which is connected to a cutting link, and a plurality of connectors, each of which maintains the attachment of a cutting link to a drive link.
High stability saw chain
Embodiments herein provide a high stability saw chain comprising a first drive link including a first mating surface; a second drive link including a second mating surface; a first tie strap coupling the first drive link to the second drive link; wherein the first mating surface of the first drive link is configured to contact the second mating surface of the second drive link when the first and second drive links traverse an elongate portion of a guide bar to prevent reverse articulation of the saw chain less than a minimum radius of 20 inches.