In one instance, a method of manufacturing an integrated circuit includes a method for dicing a semiconductor wafer that includes disposing the semiconductor wafer on a moveable cutting table, cutting the semiconductor wafer, and ejecting a clearing fluid across an exposed side of the semiconductor wafer, with full coverage across the semiconductor wafer, at least during the cutting of the semiconductor wafer. The ejecting clearing fluid is ejected to form a layer or membrane of fluid that clears or reduces other fluids from the exposed side or surface of the semiconductor wafer. Other aspects are presented.

A sample preparation saw (10) has a base (130, 146, 14, 47), a housing (12, 76), a saw (10) assembly (30, 58) mounted to the base (130, 146, 14, 47), a dressing assembly (58), a sample clamping assembly (100) mounted to the base (130, 146, 14, 47), and a reservoir assembly (30, 58). The saw (10) assembly (30, 58) includes a blade assembly (30) with a rotating blade (24). The blade assembly (30) is movable along x-, y- and z-axes by at least two drives (27, 36). The dressing assembly (58) is operable to dress the rotating blade (24). The sample clamping assembly (100) includes a rail (102), a sample mount (104) removably positioned on the rail (102) and a saddle (106) operable to hold a sample. The reservoir assembly (30, 58) is operable to recirculate a rinse fluid sprayed on the rotating blade (24), and includes a basin (178) having a pump (180) and a series of weirs (188A, 188).

In one instance, a method of manufacturing an integrated circuit includes a method for dicing a semiconductor wafer that includes disposing the semiconductor wafer on a moveable cutting table, cutting the semiconductor wafer, and ejecting a clearing fluid across an exposed side of the semiconductor wafer, with full coverage across the semiconductor wafer, at least during the cutting of the semiconductor wafer. The ejecting clearing fluid is ejected to form a layer or membrane of fluid that clears or reduces other fluids from the exposed side or surface of the semiconductor wafer. Other aspects are presented.

The invention relates to a cutting system. The cutting system (1) is designed to extend in the direction of a first system axis (7) which extends horizontally along a width (B) of the cutting system (1), in the direction of a second system axis (8) which extends vertically relative to the first system axis (7), and in the direction of a third system axis (9) which extends along the depth (T) of the cutting system orthogonally to the first system axis (7) and the second system axis (8). The cutting system has a support (2), a tool (3; 4) which is received on the support (2) in the form of a saw with a spindle shaft (13; 14), the operating direction of the tool following the direction of the first system axis (7), and an additional tool (5) which is received on the support (2) in the form of a chop saw with a third spindle shaft (15), the operating direction of the additional tool following the direction of the first system axis (7). The tools (3; 4; 5) are used to machine a blank, and the tools (3; 4; 5) are arranged in series in the direction of the first system axis (7). The cutting system (1) has a support element (10) which is received on the support (2) in a movable manner along the first system axis (7) and the second system axis (8), and the support element (10) is provided for supporting the blank. The support element (10) can be rotated about the second system axis (8), and according to the invention, the spindle shaft (13; 14) is orthogonal to the third spindle shaft (15).

A cutting apparatus includes a management unit having a measuring unit for measuring an amount of light emitted from a light emitter and received by a light receiver while a cutting blade is positioned between the light emitter and the light receiver, a measured waveform forming section for forming a measured waveform representing the configuration of an outer circumferential region of the cutting blade, and an ideal waveform recognizing section for recognizing one of the comparative waveforms that has the greatest number of waveform regions similar to the measured waveform as an ideal waveform, a difference calculating section for calculating the area of a region where there is a difference between the measured waveform and the ideal waveform.

A cutting apparatus includes a cutting unit that cuts a workpiece included in a frame unit, an ultraviolet ray irradiation unit that irradiates the frame unit with ultraviolet rays, and a control unit. The control unit includes a processing mode registration section in which commands to be output to components. The processing mode registration section registers therein a command in a cutting apparatus mode that causes the cutting unit to cut the workpiece and a command in an ultraviolet ray irradiation apparatus mode that causes the ultraviolet ray irradiation unit to irradiate the frame unit with ultraviolet rays.

A cutting apparatus includes a blade changing apparatus. The blade changing apparatus includes a blade mounting and removal portion, which in turn includes: a holding portion that removably holds a circular base of a cutting blade; a moving support portion that supports the holding portion and moves the holding portion to a removal and mounting position at which an insertion hole in the blade faces a boss of a blade mount; and a coupling mechanism that couples the holding portion with the moving support portion such that the holding portion is freely tiltable with respect to the moving support portion. The coupling mechanism includes a plurality of elastic member pairs, each pair, while tensioning the holding portion in opposite directions, fixing the holding portion to the moving support portion. Forces acting from the elastic member pairs balance each other to thereby support the holding portion tiltably and aerially.

A chuck table having a holding portion for holding a workpiece and a frame for supporting the holding portion. The holding portion includes a substrate having a plurality of fine holes arranged like a matrix at given intervals and a plurality of acoustic emission sensors arranged like a matrix on the substrate and spaced from each other so that each fine hole of the substrate is located between any adjacent ones of the acoustic emission sensors. The plurality of fine holes are connected through the frame to a vacuum source, thereby holding the workpiece on the acoustic emission sensors under suction. An elastic wave generated from the workpiece in processing the workpiece is collected at a plurality of positions by the plurality of acoustic emission sensors.

A sample preparation saw (10) has a base (130, 146, 14, 47), a housing (12, 76), a saw (10) assembly (30, 58) mounted to the base (130, 146, 14, 47), a dressing assembly (58), a sample clamping assembly (100) mounted to the base (130, 146, 14, 47), and a reservoir assembly (30, 58). The saw (10) assembly (30, 58) includes a blade assembly (30) with a rotating blade (24). The blade assembly (30) is movable along x-, y- and z-axes by at least two drives (27, 36). The dressing assembly (58) is operable to dress the rotating blade (24). The sample clamping assembly (100) includes a rail (102), a sample mount (104) removably positioned on the rail (102) and a saddle (106) operable to hold a sample. The reservoir assembly (30, 58) is operable to recirculate a rinse fluid sprayed on the rotating blade (24), and includes a basin (178) having a pump (180) and a series of weirs (188A, 188).

A workpiece support jig includes a support plate supporting a workpiece on a first surface while covering a support surface of a chuck table with a second surface opposite to the first surface and a retainer plate including an area sufficient to cover the whole of the workpiece and sandwiching the workpiece, held on the first surface of the support plate, between the support plate and itself. The support plate includes a plurality of groove parts corresponding to projected division lines of the supported workpiece and a plurality of through holes formed in chip-holding regions demarcated and divided by the intersecting groove parts. When the workpiece divided by a processing unit into chips is unloaded from the chuck table, the workpiece is unloaded while being sandwiched between the support plate and the retainer plate.