The unit (1) for processing hollow-body plastic blanks (2) includes a chamber (6) wherein the blanks (2) move along a predetermined path. The chamber (6) is defined, on both sides of the path, by two side walls (3, 4) having inner surfaces (5) that face each other. The chamber (6) includes a main section (9) wherein at least one of the walls (3, 4) is provided with a plurality of electromagnetic radiation sources (10). The side walls (3, 4) define therebetween, on at least one end of the chamber, an opening (8) for the preforms to pass therethrough. The chamber (6) includes at least one optical confinement section (12) that extends between the main section (9) and the opening (8) and wherein the inner surfaces (5) of the side walls (3, 4) are optically reflective and converge toward the opening (8).

The invention relates to the use of compounds of formulae (I) and/or (II) as colorless 1R absorbers wherein M is Ni, Pd, Pt, Au, Ir, Fe, Zn, W, Cu, Mo, In, Mn, Co, Mg, V, Cr or Ti, X.sub.1, X.sub.2 and X.sub.3 are each independently of the others sulfur or oxygen, R.sub.1, R.sub.2, R.sub.3, R.sub.4, R.sub.5 and R.sub.6 are each independently of the others hydrogen, NR.sub.7R.sub.8, unsubstituted or substituted C.sub.1-C.sub.18alkyl, C.sub.1-C.sub.18 alkyl wherein the alkylene chain is interrupted with oxygen, unsubstituted or substituted C.sub.1-C.sub.18alkenyl, unsubstituted or substituted aryl, unsubstituted or substituted arylalkyl or unsubstituted or substituted heteroarylalkyl, R.sub.7 and R.sub.8, each independently of the other, being unsubstituted or substituted C.sub.1-C.sub.18alkyl, unsubstituted or substituted aryl, unsubstituted or substituted arylalkyl or unsubstituted or substituted heteroarylalkyl, a further IR absorber optionally being added to the compounds of formulae (I) and (II). The invention relates also to novel dithiolene compounds of formulae (I) and (II) wherein X.sub.1 is oxygen and X.sub.2 and X.sub.3 are oxygen or sulfur. The invention relates furthermore to novel dithiolene compounds of formulae (I) and (II) wherein R.sub.1 to R.sub.6 are NR.sub.7R.sub.8. ##STR00001##

Methods and systems are provided for heating a dielectric preform material. An exemplary method includes inserting the preform material into a microwave cavity along a longitudinal axis of the microwave cavity and supplying the microwave cavity with microwave power having a frequency that corresponds to an axial wavelength along the longitudinal axis of the microwave cavity. The axial wavelength is greater than a length of the preform material along the longitudinal axis. The method includes heating the preform material within the microwave cavity by the microwave power and determining temperatures of the preform material at one or more locations on a surface of the preform material. The method further includes adjusting, based on the temperatures of the preform material, the microwave frequency to achieve substantially uniform heating at least on a sidewall of the preform material along the longitudinal axis.

In one embodiment, a system for conditioning a preform for molding includes a heating cavity for receiving the preform, a heater configured to heat a gas, and a blower configured to force the gas heated by the heater into the heating cavity. In another embodiment, a method of conditioning a preform for molding includes positioning the preform in a heating cavity and forcing a heated gas into the heating cavity onto an exterior surface of the preform.

An actuator system for use in a mold system includes a first actuator operatively coupled to a first mold portion and configured to move the first mold portion along an axis in a first direction from a first molding position toward a first ejecting position. The system also includes a second actuator operatively coupled to a second mold portion and configured to move the second mold portion along the axis in the first direction from a second molding position toward a second ejecting position. The system further includes a controller in communication with the first and second actuators and configured to independently activate the first and second actuators.

A system for molding an object includes an articulated mold having an axis and a plurality of mold portions configured to collectively define a molding cavity for shaping the object when arranged in respective molding positions. The system includes a plurality of actuators, each operatively coupled to a respective mold portion and configured to move the respective mold portion along the axis from the respective molding position toward a respective ejecting position for releasing the object. The system includes a controller in communication with each of the plurality of actuators and configured to independently activate each of the plurality of actuators such that one of the plurality of mold portions moves along the axis from the respective molding position toward the respective ejecting position while at least one other of the plurality of mold portions remains stationary relative to the object in order to at least partially support the object.

Apparatus for heating plastic parisons, with a transport device which transports the plastic parisons along a predetermined transport path, and with at least one heating device, wherein the heating device has at least one first radiation source which emits thermal radiation as well as at least one reflector device which reflects at least a proportion of the thermal radiation emitted by the radiation source in the direction of the plastic parisons. The reflector device can be attached to the radiation source and has a support and a reflection component which bears against the support on at least one region and is suitable for reflection of the radiation.

Disclosed is a processing unit for an electromagnetic processing of plastic parisons and including a series of processing modules, each including a hollow housing, a light emitting assembly and a dehydration circuit for preventing each hollow housing from moisture via a dehydrated fluid. The dehydration circuit extends outside the main body, where the circuit can be in fluid communication with a source of pressurized fluid, on which are disposed a fluid dehydration unit and fluid circulation unit for forcing the dehydrated fluid to feed the respective hollow housings.

An apparatus for reheating and conditioning an elongate preform for forming a blow molded container, said apparatus comprising: a receiver including an elongate annular non-cylindrical inner surface portion, wherein the surface portion defines a cavity and is adapted to engage with an elongate outer surface of an elongate preform to transfer heat thereto by conduction from said surface portion, wherein the surface portion includes a three-dimensional relief to provide substantially non-uniform contact between the receiver and the elongate preform; and means for heating said receiver.

The invention relates to the use of compounds of formulae (I) and/or (II) as colorless 1R absorbers wherein M is Ni, Pd, Pt, Au, Ir, Fe, Zn, W, Cu, Mo, In, Mn, Co, Mg, V, Cr or Ti, X.sub.1, X.sub.2 and X.sub.3 are each independently of the others sulfur or oxygen, R.sub.1, R.sub.2, R.sub.3, R.sub.4, R.sub.5 and R.sub.6 are each independently of the others hydrogen, NR.sub.7R.sub.8, unsubstituted or substituted C.sub.1-C.sub.18alkyl, C.sub.1-C.sub.18 alkyl wherein the alkylene chain is interrupted with oxygen, unsubstituted or substituted C.sub.1-C.sub.18alkenyl, unsubstituted or substituted aryl, unsubstituted or substituted arylalkyl or unsubstituted or substituted heteroarylalkyl, R.sub.7 and R.sub.8, each independently of the other, being unsubstituted or substituted C.sub.1-C.sub.18alkyl, unsubstituted or substituted aryl, un substituted or substituted arylalkyl or unsubstituted or substituted heteroarylalkyl, a further IR absorber optionally being added to the compounds of formulae (I) and (II). The invention relates also to novel dithiolene compounds of formulae (I) and (II) wherein X.sub.1 is oxygen and X.sub.2 and X.sub.3 are oxygen or sulfur. The invention relates furthermore to novel dithiolene compounds of formulae (I) and (II) wherein R.sub.1 to R.sub.6 arc NR.sub.7R.sub.8.

##STR00001##