According to one embodiment, a template for imprint patterning processes comprises a template substrate having a first surface and a pedestal on the first surface of the template substrate, the pedestal having a second surface spaced from the first surface in a first direction perpendicular to the first surface. A pattern is disposed on the second surface. The pedestal has a sidewall between the first surface and the second surface that is at an angle of less than 90° to the second surface.

Molding optical components with fine (e.g., micron-scale) features from optical adhesive or polymer can be difficult because the optical components often stick to the mold. If the component sticks to the mold, then either the component or the mold may be damaged or destroyed as the component is removed from the mold. This damage can be reduced or avoided altogether by illuminating the interface between the component and the mold with ultraviolet (UV) light before releasing the component from the mold. The UV light reduces the adhesive forces that cause the component and the mold to stick together, making it easier to remove the component from mold without damaging either the mold or the component.

A resin amount for forming each first-stage resin layer portion (a first-stage resin replica portion) 41da in a first process is defined to be greater than a resin amount for forming each second-stage resin layer portion (a second-stage resin replica portion) 41db in a second process. Therefore, at a boundary between the first-stage resin layer portion 41da and the second-stage resin layer portion 41db, a joint portion 48 at which resin overlaps is formed, whereby occurrence of an undercut shape can be avoided. Therefore, in a molding process using a sub-master die 40 and a sub-sub-master die 50 obtained from the sub-master die 40, occurrence of an undesired shape can be avoided, whereby mold release resistance can be reduced or eliminated.

The invention relates to a method and to a module (I) for applying a viscous medium (19), in particular an adhesive or lacquer, to a surface (16) wherein the module (I) comprises a reservoir (2) that can be fed with the viscous medium (19), wherein the outer surface (4) of the module (I) comprises an outlet region (5) for the viscous medium (19), wherein the module (I) comprises at least one nozzle channel (6) which fluidly connects the reservoir (2) to the outlet region (5), wherein a smallest diameter (dmin) of the at least one nozzle channel (6) is smaller than 0.8 mm and wherein the module (I) does not comprise any movable parts for closing the at least one nozzle channel (6).

A device for lacquer transfer includes a frame, transfer roller with circumferential lateral wall, nozzle for dispensing lacquer, and hardening unit, the hardening unit formed as a UV-light unit for hardening the lacquer in a contactless way by emitting UV-light, and is within an interior space defined by the transfer roller. The lateral wall of the transfer roller is transparent for UV-light, and the hardening unit is arranged such that UV-light is emitted towards the work surface upon which the lateral wall of the transfer roller rolls, to harden the lacquer after it being transferred to the work surface. Using the device, lacquer transfer can occur from the transfer roller to the work surface more reliably. The device includes a light shield between the hardening unit and outside contact surface with at least a portion of the outside contact surface provided with lacquer is shielded from UV-light emitted from the hardening unit.

Methods, apparatus and systems are disclosed by which patterned layers can be formed in a roll-to-roll process using a variable and programmable means for applying liquids and solutions used in the patterning process.

A method of forming a three-dimensional object, is carried out by (a) providing a carrier and a build plate, the build plate comprising a semipermeable member, the semipermeable member comprising a build surface with the build surface and the carrier defining a build region therebetween, and with the build surface in fluid communication by way of the semipermeable member with a source of polymerization inhibitor; (b) filling the build region with a polymerizable liquid, the polymerizable liquid contacting the build surface, (c) irradiating the build region through the build plate to produce a solid polymerized region in the build region, while forming or maintaining a liquid film release layer comprised of the polymerizable liquid formed between the solid polymerized region and the build surface, wherein the polymerization of which liquid film is inhibited by the polymerization inhibitor; and (d) advancing the carrier with the polymerized region adhered thereto away from the build surface on the build plate to create a subsequent build region between the polymerized region and the build surface while concurrently filling the subsequent build region with polymerizable liquid as in step (b). Apparatus for carrying out the method is also described.

Device and method for producing a plurality of microlenses from a lens material. The method includes: applying lens material intended for the embossing of the microlenses to a plurality of first lens molds distributed on a first embossing side of a first die for embossing of the microlenses, moving the first die and a second die located essentially parallel, in an X-Y plane, and opposite the first die, on top of one another in a Z-direction running essentially perpendicular to the X-Y plane, embossing the microlenses by shaping and curing the lens material, the shaping taking place by moving the first and second embossing sides on top of one another, up to a thickness D.sub.1 of the lens material in the Z-direction, wherein the lens material of each microlens at least during curing is separate from the lens material of each microlens which is adjacent in the X-Y plane.

Provided is a silicone mold with which a curable composition containing an epoxy resin can be molded with good precision even if used repeatedly. The silicone mold according to an embodiment of the present invention is a silicone mold for use in molding a curable composition containing an epoxy resin, the silicone mold including a cured product of a silicone resin composition, wherein the cured product has a light transmittance at a wavelength of 400 nm of 80% or higher at a thickness of 1 mm, an elongation at break in accordance with JIS K 7161 of 250% or less, and a thermal linear expansion coefficient of 350 ppm/° C. or less at 20 to 40° C.

A nanostructure die with a concavely curved nanostructured die surface for seamless embossing of at least one peripheral ring of a jacket surface of an embossing roll in a step-and-repeat process and an embossing roll for continuous embossing of nanostructures with an embossing layer, which has been applied on a body of revolution, with a jacket surface with at least one peripheral ring which is made seamless at least in the peripheral direction and which is embossed in the step-and-repeat process. Furthermore, the invention relates to a method and a device for producing such an embossing roll for continuous embossing of nanostructures as well as a method for producing such a nanostructure die and a method for producing an embossing substrate.