A manufacturing method of a coil component comprising the steps of: preparing a coil assembly body in which a coil is attached on a magnetic core and a mold body which is formed with a cavity portion in the inside thereof and which includes at least one opening portion, putting a viscous admixture including magnetic powders and thermosetting resin and the coil assembly body in the cavity portion, pushing the put-in viscous admixture in the mold body, and thermally-curing the pushed-in viscous admixture and forming a magnetic exterior body which covers the coil assembly body.

A manufacturing method of a coil component comprising the steps of: preparing a coil assembly body in which a coil is attached on a magnetic core and a mold body which is formed with a cavity portion in the inside thereof and which includes at least one opening portion, putting a viscous admixture including magnetic powders and thermosetting resin and the coil assembly body in the cavity portion, pushing the put-in viscous admixture in the mold body, and thermally-curing the pushed-in viscous admixture and forming a magnetic exterior body which covers the coil assembly body.

A tableted epoxy resin composition for encapsulation of semiconductor devices and a semiconductor device encapsulated using the tableted epoxy resin composition, the tableted epoxy resin composition satisfying the following conditions (i) a proportion of tablets of the tableted epoxy resin composition having a diameter of greater than or equal to 0.1 mm and less than 2.8 mm and a height of greater than or equal to 0.1 mm and less than 2.8 mm is about 97 wt % or more, as measured by sieve analysis using ASTM standard sieves; (ii) the tablets have a packed density of greater than about 1.7 g/mL; and (iii) a ratio of packed density to cured density of the tablets is about 0.6 to about 0.87.

A flexible elastomeric grip for the shaft of a golf club having an end cap with a cavity for receiving a sensor and/or counterweight. The cap has a durometer hardness equal to or greater than the tubular body portion of the grip and a flange sized to match the larger diameter of the body, with a sleeve engaging the inner periphery of the larger end of the tubular body. In one version of the cap, the sleeve portion is extended in length and has stiffening ribs on the outer surface of the sleeve; and, in another version, the sleeve is shorter and may also have stiffening ribs on the outer surface of the sleeve. In another version of the cap, fibrous material is disposed in the flange and sleeve to increase lateral stiffness without increasing durometer.

A method for applying a sealing member to a capsule intended for the preparation of a beverage in a device for making beverages, where the capsule includes a body having a bottom wall, a side wall and a flange-like rim which extends from the side wall, comprises a step of applying a charge of sealing composition in a viscous state on the flange-like rim and a step of compression moulding the charge of sealing composition against the flange-like rim.

A method of protecting a repair joint having at least two workpieces joined by a fastener includes selecting a preformed functional body based on at least one joint characteristic and applying the preformed functional body to cover the fastener and at least a portion of one of the workpieces. Generally, the preformed functional body inhibits contamination or moisture ingress at a joint interface, and especially in a repair operation. The preformed functional body in one form defines a material that undergoes a color change to indicate a state of cure, and in another form is cured by UV light, moisture, or heat after application.

Mold compound transfer systems and methods for making mold compound transfer systems are disclosed herein. A method configured in accordance with a particular embodiment includes providing a sheet mold compound, and dispensing a granular mold compound directly on the sheet mold compound. The sheet mold compound can have a first density and the overall granular mold compound can have a second density less than the first density. The method further comprises transferring the solid sheet carrying the dispensed granular mold compound to a molding machine without using a release film.

Methods and structures are provided for wafer-level packaging of light-emitting diodes (LEDs). An array of LED die are mounted on a packaging substrate. The substrate may include an array of patterned metal contacts on a front side. The metal contacts may be in electrical communication with control logic formed in the substrate. The LEDs mounted on the packaging substrate may also be encapsulated individually or in groups and then singulated, or the LEDs mounted on the packaging substrate may be integrated with a micro-mirror array or an array of lenses.

A flexible elastomeric grip for the shaft of a golf club having an end cap with a cavity for receiving a sensor and/or counterweight. The cap has a durometer hardness equal to or greater than the tubular body portion of the grip and a flange sized to match the larger diameter of the body, with a sleeve engaging the inner periphery of the larger end of the tubular body. In one version of the cap, the sleeve portion is extended in length and has stiffening ribs on the outer surface of the sleeve; and, in another version, the sleeve is shorter and may also have stiffening ribs on the outer surface of the sleeve. In another version of the cap, fibrous material is disposed in the flange and sleeve to increase lateral stiffness without increasing durometer.

A method for manufacturing a resin sheet includes a coating step; a heating step; and a pressurizing step. In the coating step, linear metal nanomaterial is coated on a surface of a resin film having thermal plasticity. In the heating step, the resin film having the linear metal nanomaterial coated on the surface thereof is heated and softened. In the pressurizing step, the resin film having the linear metal nanomaterial coated on the surface thereof is pressurized to press the linear metal nanomaterial along a direction orthogonal to the surface on which the linear metal nanomaterial is coated. Thus, the coated linear metal nanomaterial penetrates the resin film to obtain the resin sheet containing the linear metal nanomaterial.