A radiation-hard electronic device including a package structure, a semiconductor chip in a cavity within the package structure, an integrated circuit in the semiconductor chip, and structures for protection from radiation for protecting the integrated circuit from ionizing radiation. The structures for protection from radiation include a protective layer of gel, which occupies at least in part the cavity and coats the semiconductor chip.

A resin molding apparatus includes: a resin supply mechanism including a nozzle for ejecting liquid resin to a supply target; a resin collection unit including: a resin-receiving member configured to receive a portion of the liquid resin which portion has dropped from the nozzle; and a movement mechanism configured to cause the resin-receiving member to move in such a manner as to follow the nozzle while keeping the resin-receiving member under the nozzle; a mold die including an upper die and a lower die facing the upper die; a mold clamp mechanism configured to clamp the mold die with the supply target between the upper die and the lower die; and a control section configured to control at least respective operations of the resin supply mechanism and the resin collection unit.

Mold compound transfer systems and methods for making mold compound transfer systems are disclosed herein. A method configured in accordance with a particular embodiment includes providing a sheet mold compound, and dispensing a granular mold compound directly on the sheet mold compound. The sheet mold compound can have a first density and the overall granular mold compound can have a second density less than the first density. The method further comprises transferring the solid sheet carrying the dispensed granular mold compound to a molding machine without using a release film.

Methods and apparatuses are provided for manufacturing a transaction card. The disclosed methods and apparatuses may be used to form a transaction card frame within a mold. The transaction card frame may include one or more recessed portions formed within a first surface of the transaction card frame. The one or more recessed portions may be configured for affixing one or more electronic components.

Methods and apparatuses are provided for manufacturing a transaction card. The disclosed methods and apparatuses may be used to form a transaction card frame within a mold. The transaction card frame may include one or more recessed portions formed within a first surface of the transaction card frame. The one or more recessed portions may be configured for affixing one or more electronic components.

A composite assembly that can be cured to form a multi-component composite structure which does not have micro cracks along the boundaries between the various components. The composite assembly includes a structural component and a moldable component wherein the coefficients of thermal expansion of the structural component and the moldable component at the interface or boundary between the two components are such that micro cracks do not form along the interface when the composite assembly is cured to form the multi-component composite structure.

A method may involve positioning a structure on a plurality of protrusions that extend from a surface of a molding piece, wherein the structure comprises a sensor or an electronic component; forming, using the molding piece, a body-mountable device by forming a polymer layer around the structure positioned on the plurality of protrusions, such that the structure is at least partially enclosed by the polymer layer, wherein the polymer layer defines a first side of the body-mountable device and a second side of the body-mountable device opposite the first side, and wherein the surface of the molding piece supports the polymer layer as the polymer layer is being formed; and removing the body-mountable device from the molding piece.

Methods and apparatuses are provided for manufacturing a transaction card. The disclosed methods and apparatuses may be used to form a transaction card frame within a mold. The transaction card frame may include one or more recessed portions formed within a first surface of the transaction card frame. The one or more recessed portions may be configured for affixing one or more electronic components.

Mold compound transfer systems and methods for making mold compound transfer systems are disclosed herein. A method configured in accordance with a particular embodiment includes placing a sheet mold compound in a containment area defined by a tray cover, and dispensing a granular mold compound over the sheet mold compound. The sheet mold compound can have a first density and the overall granular mold compound can have a second density less than the first density. The method further comprises transferring the solid sheet carrying the dispensed grains to a molding machine without using a release film.

Mold compound transfer systems and methods for making mold compound transfer systems are disclosed herein. A method configured in accordance with a particular embodiment includes placing a sheet mold compound in a containment area defined by a tray cover, and dispensing a granular mold compound over the sheet mold compound. The sheet mold compound can have a first density and the overall granular mold compound can have a second density less than the first density. The method further comprises transferring the solid sheet carrying the dispensed grains to a molding machine without using a release film.