Patent classifications
B29C2043/185
FLOOR TILE WITH VIBRATION AND SHOCK CONTROL
A floor panel with shock and vibration control and method of manufacture. A first sound dampening layer is positioned between a top layer and a bottom layer of the floor panel. The first sound dampening layer has a series of hills and valleys and is made of material which provides a low natural frequency in response to a dynamic impact and transforms energy into heat in response to a high energy impact. The second sound dampening layer extends from the bottom layer in a direction away from the top layer. The second sound dampening layer is a plurality of preformed rings. The first sound dampening layer and the second sound dampening layer reduce the amount of energy transferred from the floor panel to a structure on which the floor panel is positioned.
FLOOR TILE WITH VIBRATION AND SHOCK CONTROL
A floor panel with shock and vibration control and method of manufacture. The floor panel includes a top layer, a bottom layer, an intermediate layer and a preformed sound dampening layer. The intermediate layer is positioned between the first layer and the second layer. The intermediate layer provides a low natural frequency in response to a dynamic impact and transforms energy into heat in response to a high energy impact. The intermediate layer has a density which is less than a density of the bottom layer. The preformed sound dampening layer extends from the bottom layer in a direction away from the top layer. The sound dampening layer has a density which is less than the density of the bottom layer. The intermediate layer and the sound dampening layer reduce the amount of energy transferred from the floor panel to a structure on which the floor panel is positioned.
Method and device for applying a material to a support
Methods and apparatuses for mounting a material (1) on a carrier (6) are provided. To this end, the material is arranged on a porous layer (2) of an air bearing arrangement (2, 3).
APPARATUS AND METHOD FOR MANUFACTURING CHANNEL-COUPLED SCAFFOLD
The present disclosure relates to an apparatus and a method for manufacturing a channel-coupled scaffold. The present disclosure provides a method for manufacturing a channel-coupled scaffold, which includes: (1) a step of compressing a first elastic substrate which includes a groove on the surface of the substrate to close the groove; (2) a step of loading a scaffold composition onto the closed groove; and (3) a step of restoring the elastic substrate. The present disclosure also provides an apparatus for manufacturing a channel-coupled scaffold, which includes: a first elastic substrate which includes a groove on the surface of the substrate and onto which a scaffold composition is loaded: and a compression module which compresses the width of the groove of the elastic substrate to close it. The apparatus or method may accumulate a microchannel controlling local mass transfer, and align a collagen fiber in the scaffold at the same time.
METAL CAP AND MANUFACTURING METHOD THEREFOR
A metal cap in which a linear to be held to a cap body and separable from the cap body can be formed by a series of operations for forming the cap body and press molding the liner. The liner of the metal cap has a double-layer structure including a barrier layer on a top panel wall side and a sealing layer on the inner side of the cap body, and the barrier layer is temporarily bonded to the top panel wall with a weak adhesive at the time of molding the barrier layer and separated from the top panel wall by the natural cooling of the barrier layer after molding.
METHOD FOR PRODUCING AN OPTOELECTRONIC COMPONENT AND OPTOELECTRONIC COMPONENT
In an embodiment a method includes introducing a semiconductor chip and a cover body, arranged on an upper side of the semiconductor chip, into a mold, enclosing the semiconductor chip and the cover body in the mold with a molding compound, wherein side faces of the semiconductor chip, side faces of the cover body, and a top face of the cover body, which faces away from the semiconductor chip, are covered by the molding compound, at least partially curing the molding compound in order to form a molded body, removing the mold and thinning the molded body by a jet/beam process, wherein the molded body is removed from the top face of the cover body, and wherein the molded body has a cavity in a region of the projection after removing the mold.
METHOD AND DEVICE FOR APPLYING A MATERIAL TO A SUPPORT
Methods and apparatuses for mounting a material (1) on a carrier (6) are provided. To this end, the material is arranged on a porous layer (2) of an air bearing arrangement (2, 3).
FOAM MAT AND METHOD FOR MANUFACTURING A FOAM MAT
Foam edge waste may be shredded or ground into foam particles rather than discarding them. The particles may be mixed with an adhesive and subject to high temperature and high pressure to form into new foam bodies with configurable densities. Utilizing discarded foam sections this way reduces the waste of foam, reduces environmental pollution caused by foam waste combustion, offers more environmental protection and saves resources. The resulting foam articles have reduced water retention and provide superior comfort by making a foam with consistent properties from inconsistent materials.
Method for Producing a Structuring Means for Texturing an Embossable Material Surface, in Particular a Resin-Containing Laminate Surface, and Structuring Means of this Kind
A method for producing a structuring means for texturing an embossable material surface, in particular a resin-containing laminate surface, including the steps of providing a web-shaped carrier material made of paper and/or plastic, applying a UV-curable lacquer layer made of acrylated oligomer to the carrier material, forming a three-dimensional embossed structure into the lacquer layer applied to the carrier material and curing the lacquer layer by irradiation with high-energy radiation, preferably UV light, during the molding of the embossed structure. The invention provides that before the UV-curable lacquer layer is applied at least one adhesion promoter layer including acrylated oligomer, a reactive diluent and a photoinitiator which reacts to high-energy radiation, preferably UV radiation, is applied onto the carrier material, and that the lacquer layer having the embossed structure is cured by irradiation with high-energy radiation, preferably UV light, to such an extent that, in the finished state, the structuring means has an average Martens hardness according to DIN EN ISO 14577 in the range from 10 to 80 N/mm.sup.2, preferably in the range from 30 to 80 N/mm.sup.2, the indenter used as a test body for measuring the Martens hardness being pressed into the surface of the lacquer layer having the embossed structure. A structure means is also disclosed.
METHOD OF PRODUCING A CELLULOSE-BASED PRODUCT
The present invention relates to a method of producing a cellulose-based product (103,700), wherein the method comprises the steps of: (i) providing at least two layers including one first (104a) and one second (104b) layer, and wherein said first (104a) and second layer (104b) each comprise cellulose fibers, and wherein at least one side of said first (104a) and/or said second (104b) layer is pre-treated with an adhesive coating, (ii) arranging said at least two layers including the one first (104a) and the one second (104b) layers in a superimposed relationship to each other in a forming mold (102) of a form press (101), thereby generating a stack (104) of said at least two layers including the one first (104a) and the one second (104b) layers, wherein said first (104a) and second (104b) layers are oriented within the stack (104) such that said at least one pre-treated side of said respective first (104a) and/or second (104b) layer is facing towards the superimposed layer, (iii) form pressing said stack (104) of at least two layers including the one first (104a) and the one second (104b) layers in a forming mold (102) at a forming temperature of at least 50 C. up to a forming end-pressure of at most 1100 MPa, into a cellulose based product (103, 700) of a predetermined shape and a single layer configuration, wherein in said step (iii) said layers including said one first (104a) and said one second (104b) layers are moveable with respect to each other until said forming end-pressure is reached.