Provided is an imprint apparatus for contacting a resin applied to a substrate with a mold to perform patterning on the substrate. The imprint apparatus includes a substrate holding unit for holding the substrate, wherein the substrate holding unit comprises a plurality of holding areas arranged in a predetermined direction, the plurality of holding areas has different width dimension in the direction respectively based on positions in the direction, a surface ratio between two holding areas of the plurality of holding areas with different width dimension respectively is within a range of 0.8 to 1.2.

An apparatus includes a fixed assembly and a reciprocating assembly. The fixed assembly includes a hopper, a first gas manifold, and a dispensing chamber, and the reciprocating assembly includes a channel assembly defining a channel conduit, a shield plate vertically aligned therewith, and a second gas manifold. The reciprocating assembly may move, in relation to the fixed assembly, to a first position to enable the channel conduit to be filled with bulk compressible material from the hopper, a second position to enable compressible material to be pushed from the channel conduit to the dispensing conduit and to be compressed in the dispensing chamber according to a first gas directed through the channel conduit by the first gas manifold, and a third position to enable the compressed material to be pushed out of the dispensing conduit according to a second gas directed through the dispensing conduit by the second gas manifold.