An apparatus may include a substrate holder configured to hold a substrate. The substrate holder may include a first chucking region having a first area and an adjacent region extending from the chucking region. The apparatus may also include a superstrate holder configured to hold a superstrate. The superstrate holder may include a second chucking region having a second area. The second area may be larger than the first area and the superstrate holder faces the substrate holder forming a first gap between the adjacent region surface and the superstrate and a second gap between the substrate and the superstrate. The apparatus may also include a gas supply system between the first gap and the second gap. The superstrate holder may alter a shape of the held superstrate to decrease the first gap and increase the second gap.

An imprint apparatus performs pressing of an imprint material on a substrate with a mold to form a pattern on the substrate. The imprint apparatus includes a supply device configured to supply a condensable gas to a space between the imprint material and the mold. The condensable gas is liquefied by the pressing. The apparatus further includes a pipe for transferring the condensable gas in a gas state to the supply device and a storage connected to the pipe. The storage stores the condensable gas in a liquid state. The supply device is configured to supply the condensable gas vaporized in the storage and transferred through the pipe from the storage.

An imprint apparatus cures an imprint material by irradiating the imprint material with light while the imprint material on a substrate is in contact with a pattern region of a mold. The imprint apparatus includes a first supply unit configured to supply a first gas to a gap between the substrate and the mold, the first gas accelerating filling of recessed portions of the pattern region with the imprint material, and a second supply unit configured to supply a second gas to the gap, the second gas inhibiting curing of the imprint material.

The present invention belongs to the technical field of polyurethane elastomer application, and discloses a secondary moulding process for preparing high resilience materials using E-TPU particles. An E-TPU rough blank is prepared by using E-TPU particles through a steam compression moulding process, and then a position for an accessory is reserved on the E-TPU rough blank; the E-TPU rough blank pretreated by the adhesive and the accessory are put correspondingly into the mould, the steam or electrothermal compression moulding process is performed, and then a cooling shaping process is performed to obtain the finished product; and the finished product is trimmed, arranged and packaged. The process flow of the present invention greatly improves the appearance, reduces subsequent labor costs, and improves limitations to the design space of the product diversity (including complexity of the pattern and various accessory combinations, etc.).

A tool for fabrication of a thermoplastic panel includes a sealed vessel, a membrane and a heater. The sealed vessel defines a volume. The sealed vessel includes first and second fluid ports. The membrane is disposed within the volume to define first and second chambers. The first chamber receives a skin and a core of the thermoplastic panel. The first chamber selectively applies a first fluidic pressure to the skin and the core in response to receiving a first fluid via the first fluid port. The membrane abuts a major surface of the thermoplastic panel. The second chamber selectively applies a second fluidic pressure to the membrane in response to receiving a second fluid via the second fluid port. The heater selectively directs heat toward the first chamber. A method for fabrication of the thermoplastic panel is provided. Various examples of thermoplastic panels are also provided.

The present disclosure provides a material processing method and a molding machine used therein. The molding machine includes a pressing module, a heating module, and an air supplying module. The method includes: placing material to be processed within a material molding space of the molding machine, and supplying air to an air passage provided in the material by the air supplying module; heating the material by the heating module according to a preset heating parameter; and pressing the material by the pressing module according to a preset pressing parameter. The present disclosure can avoid abnormal shape changes caused during secondary processing operations and ensure the molding effect to a greatest extent.

An imprint apparatus performs pressing of an imprint material on a substrate with a mold to form a pattern on the substrate. The imprint apparatus includes a supply device configured to supply a condensable gas to a space between the imprint material and the mold. The condensable gas is liquefied by the pressing. The apparatus further includes a pipe for transferring the condensable gas in a gas state to the supply device and a storage connected to the pipe. The storage stores the condensable gas in a liquid state. The supply device is configured to supply the condensable gas vaporized in the storage and transferred through the pipe from the storage.

An imprint apparatus of the present invention that molds and cures an imprint material on a substrate using a mold to form a pattern on the substrate. The imprint apparatus includes a supply unit configured to supply a gas into a gap between the imprint material on the substrate and the mold. The supply unit is configured to supply a mixed gas in which a permeable gas, which permeates at least one of the mold, the imprint material and the substrate, and a condensable gas, which is liquefied under a pressure generated by the molding, is mixed with each other.

An object is to provide a polyether nitrile molding material having high flowability during melt molding. As a solution, a polyether nitrile molding material having a melt flow rate (MFR) in the range of 2 to 50 g/10 min as measured at 390 C. under a load of 5000 g in accordance with ISO 1133 is provided.

A film forming apparatus includes a substrate stage including a substrate holder configured to hold a substrate, a mold holder configured to hold a mold, a driving mechanism configured to change an interval between the substrate holder and the mold holder, and a curing device configured to cure a curable composition in a state in which the curable composition arranged on the substrate and the mold contact each other. The substrate stage includes a gas blower configured to supply, to the substrate held by the substrate holder, a gas for inhibiting curing of the curable composition.