A method of manufacturing an in-mold decorative molded article capable of transferring a decorative pattern with target dimensions at a target position of a decorative molded article according to the present disclosure includes supplying an in-mold transfer foil to a metal mold, in which a clear layer having transparency and lower extensibility than a base material film is formed in the first layer on an in-mold raw fabric configured by forming a mold releasing layer and a primer layer on the base material film and a decorative figure is printed in the second and subsequent layers on the in-mold raw fabric, clamping the metal mold, injecting and cooling a molding resin and taking out an molded article formed of the molding resin cooled and cured in the metal mold in which the clear layer and a transfer layer having the decorative figure in the in-mold transfer foil are integrated on the surface by opening the mold, molding the molded article integrally with a cutting portion not necessary for a target product inside the metal mold by the molding resin at an outer periphery of the product and arranging a boundary of a printing region of the clear layer in the in-mold transfer foil in the cutting portion so as to be larger than the outer periphery of the product.

A method for decorative molding capable of reducing a preparation time at the time of replacing a mold and expecting improvement in positioning accuracy of a decorative pattern in a molded article includes supplying a film on which a decorative pattern is formed between a first mold and a second mold in a mold open state of a mold, imaging a mold-side alignment mark recorded in the mold and a film-side alignment mark recorded in the film by a camera, positioning the film with respect to the mold by moving the film so that the film-side alignment mark comes close to the mold-side alignment mark, injecting resin into the mold in a mold closed state in which the film is sandwiched between the first mold and the second mold and cooling the resin to form a molded article and opening the mold and taking out the molded article in which the decorative pattern of the film is transferred to the surface.

An objective is to provide a hitherto not-existing retention component that is for a wiring bundle and can be manufactured without tying the wiring bundle, a wire harness including the retention component, and a manufacturing method and a manufacturing device for the wire harness. A metal mold that is used has a penetration hole in which a wiring bundle is to be penetratingly disposed, an annular retention portion-molding space for surrounding the outer circumference of the wiring bundle, and an engagement portion-molding space communicatively connected with the retention portion-molding space. The wiring bundle is disposed in the penetration hole, a melt resin is poured in the retention portion-molding space from the engagement portion-molding space, and solidified through cooling to mold a retention portion integrally with a engagement portion in a state of being closely adhered to an outer circumference of the wiring bundle.

A process for producing a sensor for a biomedical electrode (e.g. an ECG electrode) involves injection molding an electrically conductive resin through a film of a backing material to form the sensor directly in the backing material and coating the contact face of the sensor with a non-polarizable conductive material (e.g. silver-containing material). Additional steps of applying an electrolyte over the non-polarizable conductive material coated on the contact face and applying a liner over the electrolyte results in the biomedical electrode. Biomedical electrode produced thereby have the sensor secured in a film of the backing material with a contact face of the sensor disposed on a first side of the film and a post of the sensor protruding from a second side of the film opposite the first side. The process permits production of one-piece sensors for bioelectrodes in a continuous fashion without the need for studs to retain sensors in a film of the backing material.

A mould system for producing a tufted body having a curved outer surface, for example one hemispherical half of a spherical toothbrush head, the mould system comprising a mould form having a receptacle and an annular flange circumscribing an open end of the receptacle and at least one slot formed substantially radially in the flange and extending into a sidewall of the receptacle.

An apparatus for manufacturing an integral emblem, may include a mold including a first mold and a second mold and formed to have a cavity formed therein when the mold is closed; an In-Mold Decoration (IMD) film supplier disposed to the first mold and configured for supplying an IMD film; a position detector disposed in the mold and configured for detecting a position of the IMD film; and an injection material injector disposed on a rear of the second mold and combined with a fluid path in the second mold when the mold is closed.

A vacuum carrier module includes a substrate having at least one hole and an edge region. There is at least one support on a top surface of the substrate. Further, a gel film is adhered to the edge region of the substrate. The at least one hole fluidly connects a reservoir located above the top surface of the substrate. A method of using a vacuum carrier module includes planarizing a gel film by passing an alignment material through a hole in a substrate to contact a first surface of the gel film, positioning at least one chip on a second surface of the gel film opposite the first surface. The method further includes encasing the at least one chip in a molding material and applying a vacuum to the first surface of the gel film.

In a decorative molding method a film having an uneven shape printed thereon and a film having a pattern printed thereon are separately supplied to a metal mold, the films are positioned separately, and a molding material is simultaneously injected into the metal mold to carry out injection molding. In a decorative molding apparatus for realizing the above method, a suction circuit for adsorbing each of the films on a film adsorption surface of the metal mold and an air blowing circuit for peeling off the films are disposed, and, after the injection molding, air blowing on each film is started separately from the start of opening of the metal mold, and the metal mold and the films are brought into a positive pressure state, then the molded article is taken out, a clamp jig is released to release the films, and the air blowing continues until the following patterns of the films are placed inside the metal mold.

[Object] To provide a molding with an integrated electrode pattern in which a band-shaped second film including an electric connecting portion to be connected to an external substrate can be securely fixed to an inner surface of a resin molded body, and to provide a method for manufacturing the molding with an integrated electrode pattern.

[Solution] A molding with an integrated electrode pattern includes a resin molded body; a first film 11 that is formed on an inner surface of the resin molded body and that includes an electrode pattern 13 and a first lead-out wire 63 electrically connected to the electrode pattern; and a second film 4 that is band-shaped, that stands on the inner surface of the resin molded body, and that includes a second lead-out wire 15 electrically connected to the first lead-out wire. The resin molded body includes a pair of support wall portions 3 formed integrally with the inner surface of the resin molded body so as to stand on the inner surface of the resin molded body and clamp both ends of a base part 4a of the second film.

A vacuum carrier module includes a substrate having at least one hole and an edge region. There is at least one support on a top surface of the substrate. Further, a gel film is adhered to the edge region of the substrate. The at least one hole fluidly connects a reservoir located above the top surface of the substrate. A method of using a vacuum carrier module includes planarizing a gel film by passing an alignment material through a hole in a substrate to contact a first surface of the gel film, positioning at least one chip on a second surface of the gel film opposite the first surface. The method further includes encasing the at least one chip in a molding material and applying a vacuum to the first surface of the gel film.