A method of making a saddle having a shell and a padding involves arranging the shell in thermoplastic polymer inside a mould for injection moulding having a die and a punch, the shell having a support surface, which in use faces the padding, and a supporting surface coupled to an inner wall of the punch or of the die, the support surface forming a wall of the moulding cavity; closing the mould; and making the padding by injection moulding a thermoplastic polymer over the shell, between the support surface and the mould.

The disclosure relates to a method for injection-molding a device, in particular a cable tie, with an integrated wireless tag, comprising the method steps of a) putting a tagging foil with two main surfaces which are separated by an edge, into a mold cavity of an open mold, where the tagging foil is held in place by a supporting device; b) closing the mold; c) injecting an injection material into the mold cavity parts adjoining the two main surfaces of the tagging foil simultaneously and symmetrically with respect to a main extension plane of the tagging foil which is parallel to the two main surfaces of the tagging foil so as to simplify and speed up the manufacturing process of a device with an integrated wireless tag or label. The disclosure furthermore relates to a corresponding molding device as well as a corresponding device with an integrated wireless tag.

A method of forming a molded polymer part having a screw boss includes positioning a screw boss insert on a pin of a mold tool. The screw boss insert may contact guide surfaces of the mold tool. During molding, polymer material flows along the screw boss insert while the screw boss insert is positioned on the pin. The polymer material may bond to the screw boss insert. The screw boss insert may include one or more geometric features that prevent rotation and/or axial movement of the screw boss insert relative to the surrounding polymer material.

A method for producing an electronic device, the method including: encasing an electronic assembly with a first casing material; holding the first electronic assembly encased by the first casing material over a holding element such that the holding element is spaced apart from the electronic assembly above the first casing material, and encasing the assembly retained on the holding element with a second casing material.

The invention relates to a method for producing primary packaging having an integrated septum characterised by: a) providing a septum, b) providing an injection-molding die having two die halves, c) positioning the septum in the injection-molding die, d) moving the two die halves of the injection-molding die to form a cavity corresponding to the shape of the primary packaging to be produced, e) injecting a material into the cavity via an injection opening, where the two die halves of the injection-molding die pretensioningly holding the septum, and a rim of the septum is overmolded by the material, f) cooling the injected material while maintaining a holding pressure, g) moving the two die halves of the injection-molding die such that the produced primary packaging means having the integrated septum can be removed from the injection-molding die, and h) removing the produced primary packaging having the integrated septum from the injection-molding die.

A method for manufacturing a cutting electrode for a surgical instrument. The method involves starting with a material blank that is provided with a rated break location. The material blank is dimensioned to allow for separation with forces sufficiently low that they can also be transmitted by the plastic body. The rated break location separates the material blank in a first section serving exclusively for handling and positioning of the material blank in a mold as well as in a second section that self-supportingly projects in a mold hollow space and is overmolded by plastic. After removal, the first section can be easily broken off the cutting electrode. The created breaking edge forms a cutting edge.

According to an embodiment of the present disclosure, provided is a method for manufacturing a bus bar in which a frame including a sensing part and a body part connected to the sensing part is prepared, the frame is inserted into and fixed to an injection molding mold, and an enhanced part enhancing the strength at a position where fatigue is concentrated by an enhancing injection material injected into the injection molding mold is formed in the frame.

A molded article may include a composite wall portion that is composed of a resin substrate and a wood insert embedded in the resin substrate. The wood insert is integrated with the resin substrate in a boundary portion defined as a joining portion of an end surface of the wood insert and an end surface of the resin substrate with its inner and outer surfaces substantially exposed on inner and outer surfaces of the composite wall portion.

A semiconductor package is provided which addresses problems of mold cap heel cracking. The package may made by using a cavity die and a gate insertion tool. The gate insertion tool, which fits into the cavity die, has an elongated body and includes a nozzle head with an edge which is contoured in relation to a mold cap formed on a substrate. The edge defines a curved border, for the mold cap, from a plane above the substrate to a plane lying on the substrate. The nozzle head includes a slot, for admitting a cull runner tip, centered on an axis of the elongated body.

According to an embodiment of the present disclosure, provided is a method for manufacturing a bus bar in which a frame including a sensing part and a body part connected to the sensing part is prepared, the frame is inserted into and fixed to an injection molding mold, and an enhanced part enhancing the strength at a position where fatigue is concentrated by an enhancing injection material injected into the injection molding mold is formed in the frame.