The mold device according to the present invention is a mold device to resin-seal the semiconductor device including an insert electrode, and in the semiconductor device, the insert electrode is provided with an insert hole, a nut having a screw hole is disposed in the insert electrode so that the insert hole and the screw hole communicate with each other, the mold device includes a mold body into which resin is injected to resin-seal the semiconductor device, including a side of the insert electrode where the nut is disposed, and a rod-like member that is inserted into the insert hole, and the rod-like member is inserted into the screw hole of the nut through the insert hole of the insert electrode to draw the nut to the side of the insert electrode.

An article includes a hollow enclosure defining a void. The void has a first section and a second section separate from the first section. An electronic component is housed in the first section and the second section of the void. A low pressure mold material is molded into the first section of the void and cured around a first segment of the electronic component to encapsulate the first segment of the electronic component. A support seal is inserted into the second section of the void adjacent a second segment of the electronic component. The support seal defines a sealing barrier on one side of the low pressure mold material that limits the flow of low pressure mold material out of the first section of the void.

A mounting element, i.e., a retaining element or clip, for mounting a terminal element at a component housing of a component body by extrusion-coating the component body at least in part with a coating material, which is designed (i) for holding and positioning a terminal element at a component housing of a component body while the component body is being extrusion-coated with a coating material, and (ii) for accommodating at least in part in the interior of a molding tool during the coating, (iii) which includes at least two support elements, and (iv) in which the at least two support elements are designed so that they are supported at an inner surface of the molding tool when the mounting element is held at the component housing of the component body while the component body and the mounting element are accommodated in the interior of the molding tool.

A spray tip comprises a tip body, a tip piece, and a pre-orifice piece. The tip body has a fluid channel along a channel axis (A.sub.C). The tip piece is disposed within the fluid channel, and has a stepped, narrowing passage that terminates in an outlet orifice. The pre-orifice piece has an inlet passage, and is disposed within the fluid channel, abutting and immediately upstream of the tip piece. The pre-orifice piece and the tip piece together define a turbulating chamber therebetween.

A tubing including an overmold is connected to a fitting by welding the overmold to the fitting. Methods for doing the same are also provided. Also provided are methods for forming an overmold on a tubing or on a tubing and fitting assembly.

In one illustrative embodiment of a coated feeder, a coating is integrated into the structural components of the feeder. The coated feeder may include a base, ridge, and back, which may all be integrally formed with one another. The coating may include an exterior surface opposite concrete. The surface of the coating adjacent the concrete may include at least one tab, at least one linear protrusion, at least one hook, and at least one channel.

A tubing including an overmold is connected to a fitting by welding the overmold to the fitting. Methods for doing the same are also provided. Also provided are methods for forming an overmold on a tubing or on a tubing and fitting assembly.

An injection molding method for a product with a connection elastic sheet, a loudspeaker and an electronic device are provided. The method comprises: providing a blank material comprising at least one connection piece and a material connection strip, and each connection piece comprising an elastic arm portion and a wire portion; positioning the blank material as an insert in a first injection mold by means of the material connection strip; injecting a first injection plastic part into the first injection cavity to obtain a first injection product; processing the first injection product for bending up the elastic arm portion toward an outer surface of the first injection plastic part; placing the processed first injection product into a second injection cavity of a second injection mold, and sealing the elastic arm portion; and injecting a second injection plastic part into the second injection cavity.

A spray tip (22) comprises a tip body (100), a tip piece (102), and a pre-orifice piece (104). The tip body has a fluid channel (114) along a channel axis (Ac). The tip piece is disposed within the fluid channel, and has a stepped, narrowing passage (124) that terminates in an outlet orifice (24). The pre-orifice piece has an inlet passage (112), and is disposed within the fluid channel, abutting and immediately upstream of the tip piece. The pre-orifice piece and the tip piece together define a turbulating chamber (106) therebetween.

An article includes a hollow enclosure defining a void. The void has a first section and a second section separate from the first section. An electronic component is housed in the first section and the second section of the void. A low pressure mold material is molded into the first section of the void and cured around a first segment of the electronic component to encapsulate the first segment of the electronic component. A support seal is inserted into the second section of the void adjacent a second segment of the electronic component. The support seal defines a sealing barrier on one side of the low pressure mold material that limits the flow of low pressure mold material out of the first section of the void.