A method for manufacturing an electromechanical structure includes producing conductors on a flat film and estimating a strain that a plurality of locations on the flat film will undergo during formation of the flat film into a three-dimensional film. The method further includes attaching electronic elements on the flat film at selected locations of the plurality of locations on the flat film. The estimated strain of the selected locations of the plurality of locations is less than the estimated strain in other locations of the plurality of locations. The method further includes forming the flat film into the three-dimensional film and injection molding material on the three-dimensional film.

A process produces a composite component, which includes an insert and a plastics part made of a thermoplastic polymer. The plastics part at least partly encloses the insert. The process includes (a) placing at least one part of the insert or the insert into an injection mold, (b) closing the injection mold, and (c) injecting the thermoplastic polymer into the mold thereby overmolding the insert at least partly. The insert is modified before placing it into the injection mold or the insert is modified in the injection mold before the injection mold is opened to remove the composite component.

A multilayer film and a decorative film, each of which is excellent in chipping resistance, exhibits favorable adhesive properties to a variety of resin materials, such as polypropylene and ABS, and a molded body provided with such a film. The multilayer film includes three layers of an impact absorption layer (a), a base material layer (b), and a pressure sensitive adhesive layer (c) disposed in this order, wherein a thermoplastic polymer composition constituting the impact absorption layer (a) is composed of at least one block copolymer containing a polymer block (X) containing a structural unit derived from an aromatic vinyl compound and a polymer block (Y) containing a structural unit derived from a conjugated diene compound, or a hydrogenated product thereof; and has a loss tangent (tan δ) at 11 Hz in a range of −50 to −20° C. of 3×10.sup.−2 or more.

A method for manufacturing an electromechanical structure, includes producing conductors and/or graphics on a substantially flat film, attaching electronic elements on the said film in relation to the desired three-dimensional shape of the film, forming the said film housing the electronic elements into a substantially three-dimensional shape, and using the substantially three-dimensional film as an insert in an injection molding process by molding substantially on said film, wherein a preferred layer of material is attached on the surface of the film. A corresponding arrangement for carrying out the method is also presented.

In a method for manufacturing a structural component for motor vehicles by hot forming of a plate-shaped semi-finished product reinforced of thermoplastic material with embedded continuous fibers several layers of a thermoplastic plastic matrix with and without embedded continuous fibers are formed to a compound.

A method for producing a decorated molded part, a decorated molded part, as well as the use of a transfer film for producing a decorated molded part includes:

Producing an intermediate product in the form of a composite body by applying a transfer ply of a transfer film to a first surface of a polypropylene film, wherein the transfer ply of the transfer film has at least one decorative layer. Forming the composite body having the polymer film with applied transfer ply of the transfer film. Inserting the formed composite body into an injection mold and back injection molding and/or overmolding and/or insert molding the formed composite body with a plastic material, containing or consisting of polypropylene. Optionally, the back injection-molded and/or overmolded and/or insert-molded formed composite body is coated, in a step, over the whole surface or over part of the surface with one or more primer layers and/or one or more varnish layers.

A manufacturing method of a housing includes the following steps: a preformed housing is provided. The preformed housing includes a body and a sidewall connected to the edge of the body, and a decoration film disposed on the body and the sidewall. A portion of the sidewall is exposed from the decoration film. The body includes a first surface. The sidewall includes a second surface. The second surface extends from the first surface. The first surface and the second surface are non-coplanar. A decoration layer is formed on the exposed portion of the sidewall by a surface processing treatment.

A system for manufacturing an electromechanical structure includes first, second, and third entities. The first entity produces conductors on a planar, flat film. The second entity attaches electronic elements at locations on the film in relation to a three-dimensional shape of the film. The electronic elements include a number of surface mount technology components. The locations of the electronic elements are selected to omit substantial deformation during subsequent forming of the film into the three-dimensional shape. The third entity forms the film into the three-dimensional shape when the electronic elements are supported on the film. The third entity includes one or more machines that are continuously roll-fed, automatically in-precut-pieces-fed, computer numerical control, thermoforming, vacuum former, pressure forming, or blow molding. The first, second, and third entities are arranged relative to one another to manufacture the electromechanical structure.

In a method for manufacturing a structural component for motor vehicles by hot forming of a plate-shaped semi-finished product reinforced of thermoplastic material with embedded continuous fibers (organo-sheet) regions of the organo-sheet (2) provided for accommodating the organo-sheet (2) in a hot forming device (1) and/or portions (21, 22) of the structural component (5) manufactured from the organo-sheet (2), which are exposed to an increased load, are structured more strongly and/or are subjected to a particular thermal treatment during hot forming.

A system for manufacturing an electromechanical structure includes first, second, and third entities. The first entity produces conductors on a planar, flat film. The second entity attaches electronic elements at locations on the film in relation to a three-dimensional shape of the film. The electronic elements include a number of surface mount technology components. The locations of the electronic elements are selected to omit substantial deformation during subsequent forming of the film into the three-dimensional shape. The third entity forms the film into the three-dimensional shape when the electronic elements are supported on the film. The third entity includes one or more machines that are continuously roll-fed, automatically in-precut-pieces-fed, computer numerical control, thermoforming, vacuum former, pressure forming, or blow molding. The first, second, and third entities are arranged relative to one another to manufacture the electromechanical structure.