A manufacturing method of a housing includes the following steps: a preformed housing is provided. The preformed housing includes a body and a sidewall connected to the edge of the body, and a decoration film disposed on the body and the sidewall. A portion of the sidewall is exposed from the decoration film. The body includes a first surface. The sidewall includes a second surface. The second surface extends from the first surface. The first surface and the second surface are non-coplanar. A decoration layer is formed on the exposed portion of the sidewall by a surface processing treatment.

A method for manufacturing an electromechanical structure, including producing conductors on a flat film; estimating a strain a plurality of locations of the flat film will undergo during formation thereof into a three-dimensional film; attaching electronic elements on the flat film at selected locations of the plurality of locations of the flat film, wherein the estimated strain of the selected locations of the plurality of locations is less than the estimated strain in other locations of the plurality of locations; forming the flat film into the three-dimensional film; and injection molding material on the three-dimensional film.

A method for manufacturing an electromechanical structure, includes producing conductors and/or graphics on a substantially flat film, attaching electronic elements on the said film in relation to the desired three-dimensional shape of the film, forming the said film housing the electronic elements into a substantially three-dimensional shape, and using the substantially three-dimensional film as an insert in an injection molding process by molding substantially on said film, wherein a preferred layer of material is attached on the surface of the film. A corresponding arrangement for carrying out the method is also presented.

A decoration panel of the present invention includes an outer layer having a through hole formed thereon which is opened to a front surface to be decorated and a back surface on a side opposite to the front surface, and a decoration layer including an inlay pattern portion which is part of the decoration layer entering the inside of the through hole from the back surface side being curved and deformed, the decoration layer being arranged on the entire back surface of the outer layer and having an approximately uniform layer thickness.

A housing structure including a first part, a second part, and a film is provided. The second part is combined to the first part by injection molding, and a seam exists between the first part and the second part. The film is attached onto the first part and the second part to shield the seam. A manufacturing method of the housing structure is also provided.

A method for manufacturing a strain gauge device and a strain gauge device are presented. The method includes obtaining a first substrate, preferably a first formable substrate film for accommodating electronic components, printing by a printed electronics method, such as by screen printing or inkjet printing, a strain gauge on the first substrate, and molding, preferably by utilizing injection molding, a molded material layer embedding the strain gauge. The strain gauge device may comprise two, preferably formable, substrate films between which the strain gauge and the molded material layer may be arranged.

An apparatus for carrying out a manufacturing method of an electromechanical structure apparatus includes an entity for producing conductors on a flat film, an entity for attaching electronic elements at locations on the flat film in relation to the desired three-dimensional shape of the flat film, the electronic elements including a number of SMT components, the locations of the electronic elements on the flat film selected such that the locations omit substantial deformation during subsequent 3D forming of the flat film, an entity for forming the flat film into a three-dimensional film and an entity for injection molding.

In a method for manufacturing a structural component for motor vehicles by hot forming of a plate-shaped semi-finished product reinforced of thermoplastic material with embedded continuous fibers several layers of a thermoplastic plastic matrix with and without embedded continuous fibers are formed to a compound.

A fastener for improved electrical contact with a composite structure and improved distribution of electric current to the composite structure. The fastener includes an elongated shaft having a first end with a head portion, a second end with a threaded portion, and a shaft body therebetween. At least one feed channel extends from an opening at the threaded portion, through the shaft body, and terminates proximal to the head portion. The shaft body radially expands upon pressure injection of a resin filler into the feed channel, when the fastener is installed in a corresponding fastener hole formed in the composite structure. Upon radially expanding, the outer surface of the shaft body makes contact with an inner hole surface of the corresponding fastener hole, resulting in the fastener providing electrical contact with the composite structure and providing distribution of electric current.

A housing structure of an electronic device including a transparent housing and an opaque film is provided. The transparent housing has an inner surface and an outer surface opposite to each other, and the transparent housing has at least one opening connecting the inner and the outer surfaces. The opaque film is attached to the inner surface by vacuuming and discharging air out of the opaque film and the transparent housing through the opening. The opaque film is visually exposed via the transparent housing. A manufacturing method of the housing structure is also provided.