One aspect is a method of manufacturing a lead connector for an implantable medical device. The method includes connecting proximal ends of a plurality of conductive pins to a corresponding one of a plurality of ring contacts to form a plurality of ring-pin subassemblies, assembling each of the plurality of ring-pin subassemblies on an assembly frame, including inserting the plurality of conductive pins in a corresponding plurality of openings within the assembly frame such that the corresponding plurality of ring contacts are spaced along a longitudinal dimension of the assembly frame, arranging the assembly frame along with the conductive pins and corresponding ring contacts within a mold cavity, filling the mold cavity with a mold material that surrounds the assembly frame, and removing a resulting lead connector from the mold cavity.