The invention relates to a hybrid structure comprising a first component having a base and an upstanding wall extending from the base, the first component having an interior enclosed between the upstanding wall and the base, and a thermoplastic second component moulded to the first component, the second component comprising a reinforcing portion for structurally reinforcing the first component, the reinforcing portion extending in a longitudinal direction of the first component and located in the interior of the first component, the thermoplastic second component further comprising a locking portion that extends adjacently over at least part of an exterior of the first component, wherein the reinforcing portion and the locking portion are integrally formed, thus interlocking the first component in the thermoplastic second component. The invention relates as well to a method for manufacturing such a hybrid structure, and to a vehicle comprising such a hybrid structure.

In one example, an electronic device housing may include a metal substrate defining an opening and a shock absorber in-mold molded with the metal substrate. Further, shock absorber may include a supporting portion formed on a surface of the metal substrate and a protruding portion that extends from the supporting portion through the opening. Further, the electronic device housing may include a metal layer disposed on the supporting portion.

An adhesive injection method is for injecting an adhesive that bonds an outer plate and a reinforcing member. The reinforcing member has through holes bored through the reinforcing member in a direction intersecting a bonding surface facing the outer plate. The method includes positioning the outer plate and the reinforcing member; disposing a sealing material covering a gap between the outer plate and the reinforcing member; and injecting the adhesive into the through holes in order from one end to the other end of the bonding surface. At the injecting, while the adhesive is injected into the through hole, when the adhesive is recognized through another through hole formed adjacent to the through hole into which the adhesive is being injected, a through hole into which the adhesive is to be injected is shifted from the through hole into which the adhesive is being injected to the other through hole.

A metal component has a shape including a flat plate-shaped part, and the flat plate-shaped part has a through-hole formed therein. A resin component has a shape including a covering part that covers a surface of the flat plate-shaped part, and the covering part has a surface in which a gate mark is present. The through-hole formed in the flat plate-shaped part of the metal component is located opposite to the gate mark. The resin component has a filler part with which the through-hole is filled.

A method for manufacturing a rear cover is provided. A housing is provided. The housing has a metal layer and a plastic layer. The metal layer has a first surface and a second surface. The plastic layer is formed on the first surface. A slot is defined in the metal layer. The slot passes through the first surface and the second surface of the metal layer. An unshielded portion is formed in the slot. A rear cover and an electronic device having the rear cover are also provided.

The invention relates to a manufacturing process for a reinforced conveyor belt and product thereby obtained comprising a plurality of plastic modules wherein each module comprises at least one opening that houses a roller and is configured to rotate with respect to a shaft, which consists of a metal tube able to be filled with plastic material; and which comprises the stages of (i) inserting the shaft in an injection mold for a plastic module in the region corresponding to the opening; and (ii) a single stage of injecting the plastic module such that said injected plastic fills the inside of the shafts forming a single assembly or structure with the body of the module.

An injection mould and an injection moulding method are provided. The injection mould includes a base plate used to place a packaged chip to be injection moulded including a substrate and at least one of the chips fixed on the front substrate by a flip chip process. The substrate has a gas hole. Two or more gas ducts that extend in at least two intersected directions and connect with one another are formed in the base plate. Two ends of each one of gas ducts are open, and at least one of the gas ducts is buried into the base plate. Each one of gas ducts is provided with a gas outlet. When the packaged chip is placed on the base plate, the gas outlet connects with the gas hole of the substrate.

A shock-absorbing or vibration-absorbing assembly includes a metal base and an elastic shock-absorbing or vibration-absorbing material secured to the metal base. A top surface of the metal base has at least one orifice extending from the top surface to at least one hollow chamber beneath the top surface. The hollow chamber occupies a planar area of the metal base parallel to the top surface that is larger than a planar area of the metal base that is occupied by the orifice at the top surface. The elastic material is secured to the metal base by the elastic material filling the orifice and the hollow chamber of the metal base and the elastic material filling a region above the top surface of the metal base that has a cross-sectional area parallel to the top surface of the metal base that is larger than the planar area of the metal base that is occupied by the orifice at the top surface of the metal base. The elastic material is secured to the metal base by placing the metal base against a mold having a hollow space to be filled with the elastic material. The elastic material is injected into the hollow chamber and orifice of the metal base and into the hollow space of the mold. The mold is removed from the metal base, so that the elastic material is secured to the metal base by the elastic material filling the orifice and the hollow chamber of the metal base and the elastic material filling a region above the top surface of the metal base that corresponds to the hollow space of the mold.

A roof module for forming a vehicle roof on a motor vehicle, the roof module having a panel component, which forms at least sections of a roof cladding of the vehicle roof, and having an opening in which at least one environment sensor is disposed within a casing, the environment sensor being able to transmit and/or receive electromagnetic signals for charting the vehicle environment and being displaceable between a retracted position and an extracted position, wherein the roof module may have a sealing assembly which surrounds the opening and has a sealing area which extends in a movably flexible manner between the panel component and at least one section of the casing and is injection-molded on one side on the panel component and/or the casing.

An injection mould and an injection moulding method are provided. The injection mould includes a base plate used to place a packaged chip to be injection moulded including a substrate and at least one of the chips fixed on the front substrate by a flip chip process. The substrate has a gas hole. Two or more gas ducts that extend in at least two intersected directions and connect with one another are formed in the base plate. Two ends of each one of gas ducts are open, and at least one of the gas ducts is buried into the base plate. Each one of gas ducts is provided with a gas outlet. When the packaged chip is placed on the base plate, the gas outlet connects with the gas hole of the substrate.