An injection molded part is formed of a base part and a soft component which includes a cushioning shaped part fastened thereto. Injection (molding is performed without additional connection steps by having the cushioning shaped part have a soft, cast gel body completely covered on its boundary surface with a hard component that is a flexible and elastically deformable material which forms a circumferential flange-like rim protruding laterally beyond the cast gel body. During injection molding the hard component is being surrounded by the material of the base part while shielding the cast gel body from the injected material used to form the base part.

A cartridge for a medium to be dispensed includes a head part having a dispensing outlet and a film forming a cartridge wall, with the film surrounding a cartridge chamber for the medium to be dispensed, extending at least partially (along an axial extension) in a longitudinal direction of the cartridge and having a front end being connected to the head part. The film is preferably a multilayer film having at least two layers formed from different materials, and the front end of the film is sealingly and non-releasably embedded in the head part of the cartridge, so that an end face of the front end of the film is covered, in particular completely covered, by the head part.

A metal casting method and a plastic injection molding method in which an insert is molded in molten material such that no molten material enters the interior of the insert. The usage of a wire thread insert as insert has the advantage that for example in an aluminum cast part thread holes can be produced already as part of the casting process. For this purpose, the casting mold, the insert, as well as the casting method are described.

There are provided a method of manufacturing a molded product for a power module capable of integrally molding terminals and a substrate, and a terminal in a particular shape used for the manufacturing method. The method of manufacturing the molded product for a power module includes the steps of: inserting a first tip portion of each of terminals having a particular shape into a substrate; arranging the substrate in a mold such that the second tip portion is inserted into a terminal insertion portion inside the mold; and integrally molding the substrate and the terminals by flowing resin into the mold.

A method has the steps of forming a lot of potting portions made of a rubber-like elastic material at appropriate intervals in respect of an extending direction of the gasket main body in the one side in the thickness direction in the peripheral edge portion of the plate in such a manner as to be positioned in a forming area of the gasket main body, next, pinching a portion constructed by the peripheral edge portion of the plate and the potting portion between inner surfaces of a gasket forming cavity of the metal mold and bringing the other side in the thickness direction of the peripheral edge portion into close contact with the one inner surface of the cavity by positioning and arranging the plate within the metal mold and clamping the mold, and filling a liquid rubber material into the cavity and curing the liquid rubber material.

Pipe joints and more particularly circular push-on type pipe joints including a flexible gasket having both hard and soft portions and where the soft portion overlaps a flange and an inner curved section of the hard portion.

An article includes a hollow enclosure defining a void. The void has a first section and a second section separate from the first section. An electronic component is housed in the first section and the second section of the void. A low pressure mold material is molded into the first section of the void and cured around a first segment of the electronic component to encapsulate the first segment of the electronic component. A support seal is inserted into the second section of the void adjacent a second segment of the electronic component. The support seal defines a sealing barrier on one side of the low pressure mold material that limits the flow of low pressure mold material out of the first section of the void.

A manufacturing equipment, for manufacturing a molded circuit board assembly of a camera module, includes an upper mould, a lower mould, a mould fixing arrangement, and a temperature controlling arrangement, wherein the mould fixing arrangement controls opening and closing of the upper mould and the lower mound. When a substrate board is placed between the upper mould and the lower mound, a molding cavity is further formed between the upper mould and the lower mound, wherein in the molding cavity, a supporting frame forming groove is formed for forming the module support, and a light window forming element is used for forming a light window. The temperature controlling arrangement provides a molding temperature, the module supporting frame is integrally molded on the substrate board to form the molded circuit board assembly.

A method for overmolding at least one line (40) comprises the steps: receiving the at least one line (40) in an opening (14) of a sealing element (10), wherein the opening (34) of the sealing element (10) is substantially complementary in shape to a peripheral geometry of the at least one line (40); mounting the sealing element (10) on a mold (30); overmolding the at least one line (40) received in the sealing element in a region (42) that is adjacent to the sealing element (10) and delimited by the sealing element (10); and removing from the mold (30) the sealing element (10) and the at least one line (40) received therein and overmolded in a region.

An injection molding tool is provided, comprising a base carrier that is suitable to accommodate an insert component, wherein at least one separate part of the base carrier forms a contact surface with the insert component after it has been inserted into the base carrier, wherein at least the contact surface features a high-temperature material. Furthermore, a method for the sealing of insert components is provided.