A method of producing a cover for optionally opening or tightly closing an opening in a vehicle roof, the cover having a sheet and a peripheral overmolding. According to the method, a coating is applied in a region which is later visible and which is to be covered, to a portion on the transparent sheet adjacent to the peripheral overmolding to be applied, and the coating is removed once the peripheral overmolding has been applied.

An assembly of a first and second constructional part is provided, wherein the first constructional part has a first end and an opposite second end connected by a central part extending substantially perpendicularly to a surface of the second constructional part. The first end of the first constructional part is connected to said surface of the second constructional part with an encapsulating material at least partly surrounding said first end and adhering to said surface of the second constructional part. The first constructional part between its first and second ends is provided with at least one protruding part. The first constructional part in contact the encapsulating material is provided with a flange of which the vertical projection on said surface of the second constructive part completely covers the vertical projection of the protruding part on said surface. A method for making the assembly is provided.

A resin molded article includes a thermosetting resin member and a thermoplastic resin member sealing a sealed surface of the thermosetting resin member. An exposed surface of the thermosetting resin member is exposed to an outside of the thermoplastic resin member. An additive having a functional group is added to the thermoplastic resin member. The thermosetting resin member has a surface layer on at least a part of the sealed surface, and the surface layer is made of a thermosetting resin higher in concentration of a carboxyl group or concentration of a phenol group than the underlying thermosetting resin. The carboxyl group or the phenol group present in the surface layer is chemically bonded to the functional group present in the additive.

The mold device according to the present invention is a mold device to resin-seal the semiconductor device including an insert electrode, and in the semiconductor device, the insert electrode is provided with an insert hole, a nut having a screw hole is disposed in the insert electrode so that the insert hole and the screw hole communicate with each other, the mold device includes a mold body into which resin is injected to resin-seal the semiconductor device, including a side of the insert electrode where the nut is disposed, and a rod-like member that is inserted into the insert hole, and the rod-like member is inserted into the screw hole of the nut through the insert hole of the insert electrode to draw the nut to the side of the insert electrode.

The present disclosure involves a method and apparatus for attaching two electrical dies by wire bonding and then encasing the assembly in a protective casting that works by arranging two dies into a fixture conducive to wire bonding. Doped epoxy may be immediately dispensed over the assembly to form a near-net-shape protective cover, or Drive Can.

A resin molding method for forming a resin molding (24) on a surface of a panel (1) includes: a molding die installation step of installing a molding die (3) formed of an elastic body on the panel (1) in such a manner as to form a cavity (7) by a molding face (10) thereof; a resistance increasing step of increasing resistance to pressure applied from the cavity (7) side with respect to the molding face (10); a resin injection step of injecting resin into the cavity (7); and a resin curing step of curing the injected resin.

A molded article 1 is configured such that an insert 2 is made of a steel plate and includes a cylindrical part 2A and an annular part 2B, a plastic 4 is annular in shape so as to be joined to the annular part 2B, inner diameter D1 of the plastic 4 is larger than inner diameter D2 of the annular part 2B so that no burrs at a gate mark E protrude to the inner diameter side of the molded article 1, the injection molding is conducted with a disc gate arranged on an inner peripheral surface F of the plastic 4 at a position separated from a surface of the annular part 2B, and the gate mark E resides on the inner peripheral surface F of the plastic 4 at a position separated from the surface of the annular part 2B.

A molded article 1 is configured such that an insert 2 is made of a steel plate and includes a cylindrical part 2A and an annular part 2B, a plastic 4 is annular in shape so as to be joined to the annular part 2B, inner diameter D1 of the plastic 4 is larger than inner diameter D2 of the annular part 2B so that no burrs at a gate mark E protrude to the inner diameter side of the molded article 1, the injection molding is conducted with a disc gate arranged on an inner peripheral surface F of the plastic 4 at a position separated from a surface of the annular part 2B, and the gate mark E resides on the inner peripheral surface F of the plastic 4 at a position separated from the surface of the annular part 2B.

A wiring incorporated resin pipe includes a tubular shaped sheet formed in an approximately tubular shape at an interval so that a slit is formed between both ends in a transverse direction, a wiring unit arranged in the tubular shaped sheet along a longitudinal direction of the slit in an inner side of the slit and a resin material filled in a gap formed by matching surfaces of the slit of the tubular shaped sheet and the wiring unit to thereby seal the matching surfaces of the slit of the tubular shape sheet, in which conductive wires for wiring are laid inside the wiring unit in the longitudinal direction.

In a terminal-attached electric wire (1), a resin portion (4) which covers a conductor-exposed portion of a terminal (3) to which a conductor is connected is formed by molding resin in the conductor-exposed portion. In the terminal-attached electric wire (1), the resin portion (4) has a peeling preventive portion (14) which prevents the resin portion (4) from peeing off in a release direction of a die when the die is released.