An array imaging module includes at least two optical lenses and a molded photosensitive assembly, wherein the molded photosensitive assembly includes at least two photosensitive units, a circuit board that electrically couples to the photosensitive units, and a molded base having at least two optical windows. The molded base is integrally coupled at the circuit board at a peripheral portion thereof, wherein the photosensitive units are aligned with the optical windows respectively. The optical lenses are located along two photosensitive paths of the photosensitive units respectively, such that each of the optical windows forms a light channel through the corresponding photosensitive unit and the corresponding optical lens.

A semiconductor package including a circuit substrate, an interposer structure, a plurality of dies, and an insulating encapsulant is provided. The interposer structure is disposed on the circuit substrate. The plurality of dies is disposed on the interposer structure, wherein the plurality of dies is electrically connected to the circuit substrate through the interposer structure. The insulating encapsulant is disposed on the circuit substrate, wherein the insulating encapsulant surrounds the plurality of dies and the interposer structure and encapsulates at least the interposer structure, the insulating encapsulant has a groove that surrounds the interposer structure and the plurality of dies, and the interposer structure and the plurality of dies are confined to be located within the groove.

Provided is a molded product manufacturing method, including attachment of attaching a partially exposed member that extends from inside a sealed portion in the molded product to be exposed to outside to a sealing target member that is to be sealed inside the sealed portion in the molded product; injecting of inserting the sealing target member having the partially exposed member attached thereto in a die and injecting a sealing material into the die; adjustment of, in a first time period during which the sealing material is injected, holding the partially exposed member at a position differing from a final position in the molded product and adjusting a flow of the sealing material with an adjusting member attached to the partially exposed member; and hardening the sealing material after the first time period.

According to one embodiment, a mold includes a substrate clamping surface, a cavity, a suction part, a vent, an intermediate cavity, and an opening/closing part. The substrate clamping surface contacts a surface of a processing substrate. The cavity is recessed from the substrate clamping surface. The suction part is recessed from the substrate clamping surface. The vent is provided on a path between the cavity and the suction part, communicates with the cavity, is recessed from the substrate clamping surface to a vent depth. The intermediate cavity is provided between the vent and the suction part on the path, communicates with the vent, and is recessed from the substrate clamping surface to an intermediate cavity depth deeper than the vent depth. The opening/closing part opens and closes the path and is provided between the intermediate cavity and the suction part on the path.

According to one embodiment, a mold device includes a first mold. The first mold includes a substrate clamping surface, a cavity, a suction part, a vent, first and second intermediate cavities and an opening/closing part. The substrate clamping surface contacts a surface of a processing substrate. The cavity is recessed from the substrate clamping surface. The suction part is recessed from the substrate clamping surface. The vent is provided on a path between the cavity and the suction part, and is recessed from the substrate clamping surface to a vent depth. The first intermediate cavity is provided between the vent and the suction part, and is recessed from the substrate clamping surface. The second intermediate cavity is provided between the first intermediate cavity and the suction part, and is recessed from the substrate clamping surface to a second intermediate cavity depth. The opening/closing part opens and closes the path.

A semiconductor package includes a pad and leads having a planar profile shaped from a planar base metal, a semiconductor die attached to the pad, a wire bond extending from the semiconductor die to a respective lead, and mold compound covering the semiconductor die, the wire bond, and a first portion of the respective lead, wherein a second portion of the respective lead extends beyond the mold compound. A shape of the respective lead within the planar profile includes a notch indented relative to a first elongated side of the shape of the respective lead and a protrusion protruding outwardly relative to a second elongated side of the shape of the respective lead. The notch and the protrusion are each partially covered by the mold compound and partially outside the mold compound.

A connector includes a cable including at least one core wire and a shielding wire arranged around the core wire with an insulating member interposed therebetween, a plug part connected to the cable and capable of fitting with a receptacle, a primary molded part including a connection portion between the core wire and a conductive member of the plug part, and a secondary molded part arranged at a lead-out portion of the cable. The dimension of the primary molded part is an outer diameter or a thickness of the plug part.

A connector may include: at least one electrically conductive connector pin; a pre-mold formed such that the connector pin penetrates the pre-mold and both ends of the connector pin respectively protrude from a first surface and a second surface of the pre-mold; and a housing configured to expose at least one end of the connector pin to outside and accommodate the pre-mold therein, wherein the housing has a shape surrounding the pre-mold in all directions.

The present invention relates to a mould half for a mould for transfer moulding encapsulating electronic components mounted on a carrier, where the mould part to support the carrier has a contact surface that includes a primary carrier support surface and a the primary carrier support surface surrounding secondary surface, which surrounding secondary surface is supported by a drive for height adjustment of the secondary surface relative to the height of the primary carrier support surface. Such mould half may be used for transfer moulding of electronic components while relatively easy providing a levelled support for the carrier and compensating for any thickness variations in the carrier. The invention also provides a mould with at least two mould parts and a method for transfer moulding encapsulating electronic components mounted on a carrier using such a mould.

The present disclosure relates to a method for manufacturing a light-emitting apparatus, comprising carrying out a first injection molding process around each of a plurality of light sources disposed on a circuit board to form a lens holder surrounding the light source; and disposing a lens in the lens holder to form the light-emitting apparatus capable of emitting light when the circuit board is energized. In accordance with the method of the present disclosure, installation accuracy and precision of lenses can be effectively ensured, and requirements on thickness and hardness of a circuit board can be reduced.