The claimed invention provides a method for molding a decorative cup with a hard exterior shell and a molded cup with a hard exterior shell such that the ink of the decoration and the adhesive are encapsulated between the molding material and the hard exterior shell.

A method for manufacturing a strain gauge device and a strain gauge device are presented. The method includes obtaining a first substrate, preferably a first formable substrate film for accommodating electronic components, printing by a printed electronics method, such as by screen printing or inkjet printing, a strain gauge on the first substrate, and molding, preferably by utilizing injection molding, a molded material layer embedding the strain gauge. The strain gauge device may comprise two, preferably formable, substrate films between which the strain gauge and the molded material layer may be arranged.

A method for manufacturing an electronic assembly and electronic assemblies are presented. The method includes obtaining a substrate film for accommodating electronics, providing at least an electrical contact pad to the substrate film, coupling an electrically conductive member to the electrical contact pad, and molding, such as injection molding, a material layer onto the substrate film to embed the elastic electrically conductive member utilizing a mold structure defining a cavity for molding. The elastic electrically conductive member is arranged to extend during the molding from the electrical contact pad through the cavity to be in contact with an element on a different side of the cavity with respect to the electrical contact pad for maintaining at least a part of the elastic electrically conductive member accessible after the molding to provide an electrical connection through the material layer to the electrical contact pad.

A method for manufacturing an electronic assembly and electronic assemblies are presented. The method includes obtaining a substrate film for accommodating electronics, providing at least an electrical contact pad to the substrate film, coupling an electrically conductive member to the electrical contact pad, and molding, such as injection molding, a material layer onto the substrate film to embed the elastic electrically conductive member utilizing a mold structure defining a cavity for molding. The elastic electrically conductive member is arranged to extend during the molding from the electrical contact pad through the cavity to be in contact with an element on a different side of the cavity with respect to the electrical contact pad for maintaining at least a part of the elastic electrically conductive member accessible after the molding to provide an electrical connection through the material layer to the electrical contact pad.

In a decorative molding method a film having an uneven shape printed thereon and a film having a pattern printed thereon are separately supplied to a metal mold, the films are positioned separately, and a molding material is simultaneously injected into the metal mold to carry out injection molding. In a decorative molding apparatus for realizing the above method, a suction circuit for adsorbing each of the films on a film adsorption surface of the metal mold and an air blowing circuit for peeling off the films are disposed, and, after the injection molding, air blowing on each film is started separately from the start of opening of the metal mold, and the metal mold and the films are brought into a positive pressure state, then the molded article is taken out, a clamp jig is released to release the films, and the air blowing continues until the following patterns of the films are placed inside the metal mold.

A method for in-mold transferring of electronics from a film includes creating an electronics layer including both active and passive components connected to conductive inks defining electrical traces and electrical contacts. At least one light source is electrically mounted on the conductive inks. A connector is mounted on the conductive inks using a conductive adhesive on the connector. A decorative film structure is connected to the electronics layer having a protective coating covering a graphics printed film. A carrier film is releasably coupled to the protective coating of the decorative film structure with a release agent. The decorative film structure and the electronics layer are placed into an injection mold. A polymeric material is injected into the injection mold encasing the decorative film structure and the electronics layer, with the polymeric material contacting a portion of the carrier film. The carrier film is then removed.

A method for making a thin wall component comprise: locating a film (40) in a mold cavity of a mold, wherein the mold cavity has an initial mold thickness, wherein the film comprises a base layer (41) and a pattern layer (42); injecting a molding material (60) into the mold cavity such that the molding material contacts the pattern layer, wherein the molding material comprises a polymeric material and a filler; compressing the mold to a final mold thickness that is less than the initial mold thickness, to form a molded product, wherein the pattern layer forms a surface of the molded product; and removing the molded product from the mold. A molded product formed by the method. The method produce a thin walled component without warpage, inner stresses, poor surface quality, or washout defects.

The object of the present invention is to provide an image formation method that can give an image that is excellent in terms of adhesion to a substrate, blocking resistance of a resulting printed material, and molding suitability, in particular vacuum forming properties, and that can suppress post-molding cracking of a molding. Disclosed is an image formation method comprising, in order, Step a: a step of applying Liquid A to a substrate, Step b: a step of irradiating the applied Liquid A with actinic radiation so as to carry out complete curing or semi-curing up to a degree of cure of at least 90%, Step c: a step of applying Liquid B to a cured layer of the completely cured or semi-cured Liquid A, and Step d: a step of completely curing Liquid A and Liquid B.

A method of manufacturing can comprise: introducing a first polymeric material to a mold, wherein the first polymeric material resists metallization; introducing a second polymeric material to the mold, wherein the second polymeric material accepts metallization; molding an article from the first polymeric material and the second polymeric material, wherein the second polymeric material extends along a surface portion of the article; coupling a metallic material to the surface portion of the article to form a part having a metallic surface finish by exposing the article to the metallic material in a metallizing process, wherein the metallic material is not coupled to the first polymeric material.

A method for producing a plastic vehicle attachment part is described, wherein a polymeric film is laid in an injection mold, the polymeric film having an opaque or semi-opaque imprint or a color pigmentation. The polymeric film is back injected with a polymeric covering part. wherein the polymeric covering part is optically transparent. A polymeric carrier part is sprayed at least on a part of the surface of the polymeric covering part facing away from the polymeric film. A protective layer is applied at least on the polymeric film.