In a method for forming a microelectronic device, a substrate is loaded into a mold press. The substrate has a first surface and a second surface. The second surface is placed on an interior lower surface of the mold press. The substrate has a plurality of wire bond wires extending from the first surface toward an interior upper surface of the mold press. An upper surface of a mold film is indexed to the interior upper surface of the mold press. A lower surface of the mold film is punctured with tips of the plurality of wire bond wires for having the tips of the plurality of wire bond wires extending above the lower surface of the mold film into the mold film. The tips of the plurality of wire bond wires are pressed down toward the lower surface of the mold film to bend the tips over.

A printed film with mounted light emitting diodes encapsulated in a light guide includes a printed film assembly. The printed film assembly includes multiple light emitting diodes. A light guide is injection molded onto a first side of the body covering the light emitting diodes. A light transmissive polymeric material coating layer is applied by injection molding to a second side of the body opposite to the first side. An overmolded component has the printed film assembly embedded therein, with the coating layer exposed for visibility of light from the light emitting diodes when at least one of the light emitting diodes is energized.

A package of a heat-bent polarizing sheet for producing an injection-molded polarizing lens and an injection-molded polarizing lens that uses said sheet is provided. The heat-bent polarizing sheet is cumulatively packaged by a non-adhesive isolation film so as to withstand moisture and then stored or transported and can be used in injection molding without performing preliminary drying as a pretreatment of injection molding and without substantial protective-film removal work.

An encapsulation cover for an electronic package includes a cover body having a frontal wall provided with at least one optical element allowing light to pass through. The optical element is inserted into the encapsulation cover by overmolding into a through-passage of the frontal wall. A front face of the optical element is set back with respect to a front face of the frontal wall. The process for fabricating the encapsulation cover includes forming a stack of a sacrificial spacer on top of an optical element, with the stack placed into a cavity of a mold.

The purpose of the present invention is to make it possible to shorten the time required for a burr removal step and make it difficult for the burrs to detach from a sheet member in a step for removing the burrs together with the sheet member. For removal, by making the burrs to adhere to a pliable sheet member such as paper or nonwoven fabric that has been incorporated beforehand in the molding die and stripping the sheet member from the molding die, the burrs are removed together with the sheet member. The present invention is characterized in that in order to make it difficult for the burrs to detach from the sheet member during the stripping, a radiused shape with an arc-shaped cross-section is formed by the molding die on the areas surrounding the sections where the burrs adhere to the sheet member.

The object of the invention can be a method of manufacturing a product in the form of a sandwich comprising a core and outer layers. The outer layers may be composed of composite material comprising a fiber-reinforced polymeric matrix. The method uses an insert of heat-resistant material, for example silicone. The object of this invention can be to provide a method of manufacturing a sandwich that dissociates the choice of material of the core of the sandwich from the choice of the material of the outer layers.

The present invention improves the handling properties of a rubber-only gasket and the affixability thereof to an attachment position. To this end, the provided gasket is: obtained by combining a gasket body of the rubber-only type, and a carrier sheet that comprises a resin film and holds the gasket body in an un-adhered state; and characterized in that the gasket body is provided with an adhesive section or bonding section for adhering or bonding the gasket body to an attachment position when attaching the gasket body to the attachment position. The adhesive section or bonding section is prepared by providing the lateral surface of the gasket body with a projecting section, and coating the surface of the projecting section with an adhesive or bonding agent. The gasket body is to be used as a gasket for a fuel cell to be incorporated into a fuel cell stack.

The invention relates to a film body, a method for the back-injection molding of a film body and a back-injection molding tool therefor. In particular, the invention relates to a method for the back-injection molding of layer electrodes (1) for producing touch-sensitive sensors for example for touch screens. Parts of the layer electrode (1), which after the back-injection molding should still be able to move freely, are covered by a sacrificial film (3) before and during the back-injection molding.

The purpose of the present invention is to improve the handling and usability of rubber only-type gaskets. To achieve said purpose, a gasket molding is obtained by combining a rubber only-type gasket body with a film carrier obtained from a resin film that holds the gasket body in an unbonded state. The gasket molding is characterized in that: in addition to a gasket-holding section for holding the gasket body, the film carrier has temporary tacking sections that are surface-treated to temporarily tack the gasket body to said film carrier; the gasket body has temporary tack-receiving sections that are temporarily tacked to the temporary tacking sections; and the temporary tacking sections and temporary tack-receiving sections are removed from the film carrier and the gasket body when the film carrier and gasket body are punched into the product shapes.

A system and method including a fastener clip, including inserting a fastener clip inside an injection mold cavity to use as part of the injection mold cavity. The fastener clip is inserted into the injection mold cavity where a blade is to be formed on a plastic component. The fastener clip is configured to engage and couple to the blade and to the plastic component and to engage and couple to a slot in a structure. Also included is injecting flowing plastic into the fastener clip and the injection mold to form the lade. At least a portion of a contour of a surface of the blade follows a contour of an inner surface of the fastener clip.