B29C2045/14844

Electronic medical device including a protective inner shell encasing a battery and electronic components and an outer shell encasing the inner shell

An electronic medical device is disclosed here. An exemplary embodiment of the medical device includes a printed circuit board assembly, a protective inner shell surrounding at least a portion of the printed circuit board assembly, and an outer shell surrounding at least a portion of the protective inner shell. The printed circuit board assembly has a printed circuit board, electronic components mounted to the printed circuit board, a battery mounted to the printed circuit board, and an interface compatible with a physiological characteristic sensor component. The protective inner shell is formed by overmolding the printed circuit board assembly with a first material having low pressure and low temperature molding properties. The outer shell is formed by overmolding the protective inner shell with a second material that is different than the first material.

FULLY ENCAPSULATED ELECTRONICS AND PRINTED CIRCUIT BOARDS

A method of encapsulating and hermetically sealing a printed circuit board of a flex cable includes: positioning a printed circuit board portion of a flex cable into a channel defined in a first mold half of a mold, the printed circuit board portion including a substrate and electronic components mounted on the substrate; mounting a second mold half onto the first mold half to enclose the channel of the first mold half and form a cavity within the mold; and filling the cavity of the mold with an encapsulation material through an inlet opening defined through the mold.

INSERT MOLDING METHOD AND INSERT MOLDING COMPONENT
20190105820 · 2019-04-11 · ·

An insert molding component includes a primary molding section with a concave portion formed on one surface thereof, an insert component disposed on a bottom side of the concave portion of the primary molding section, a heat-insulating component disposed in the concave portion of the primary molding section and disposed on a top of the insert component, and a secondary molding section disposed in contact with the one surface of the primary molding section.

COVER WINDOW AND MANUFACTURING METHOD OF THE SAME
20180210502 · 2018-07-26 ·

A method of manufacturing the cover window includes a film layer and a resin layer disposed on the film layer to surround an edge of the film layer.

METHOD OF PRODUCING A COVER FOR A VEHICLE ROOF
20240342969 · 2024-10-17 ·

A method of producing a cover for optionally opening or tightly closing an opening in a vehicle roof, the cover having a sheet and a peripheral overmolding. According to the method, a coating is applied in a region which is later visible and which is to be covered, to a portion on the transparent sheet adjacent to the peripheral overmolding to be applied, and the coating is removed once the peripheral overmolding has been applied.

TEXTILE-LIKE IN-MOLD SHEET, PRODUCTION METHOD OF THE SAME, PREFORM MOLDED BODY, TEXTILE-LIKE RESIN MOLDED BODY, AND PRODUCTION METHOD OF THE SAME

Disclosed herein is a textile-like in-mold sheet that is to be integrated with a resin molded body molded by injection of a molten resin by in-molding. The textile-like in-mold sheet includes a first surface that is to be integrated with the resin molded body, and a second surface that will serve as a back side of the first surface, such that the textile-like in-mold sheet contains at least a textile material layer and a temporary surface protection layer temporarily bonded to the textile material layer, in this order from the first surface toward the second surface.

Cover window and manufacturing method of the same
09958900 · 2018-05-01 · ·

A cover window and a method of manufacturing the cover window include a film layer and a resin layer disposed on the film layer to surround an edge of the film layer.

Corrosion sensor having double-encapsulated wire connections and manufacturing method for it

A sensor (1) and a method of manufacturing the sensor (1), the sensor (1) including a number of metallic strips (5,6,7) mounted on a non-conducting substrate (4) and a module (3) for forming electrical connections to the strips (5,6,7) whereby to enable communication between the strips (5,6,7) and monitoring equipment for the sensor (4), the module including a number of wire connections (16), the method including the steps of encapsulating the wire connections within a flexible chemical and heat resistant sealing compound, and subsequently, encapsulating the flexible sealing compound within a second sealing compound (34) by an injection molding process.

PROCESS FOR PRODUCING A HOLLOW ITEM BY INJECTION- MOULDING AND OBJECT OBTAINED BY USING SAID PROCESS
20170050356 · 2017-02-23 · ·

A process of producing a hollow item by injection-moulding thermoplastic material, which has a rigid external shell and at least one soft internal portion, which uses a mould comprising a matrix, a first semi-mould including a first cavity and a second semi-mould including a second cavity counter-shaped to the matrix to reproduce a respective semi-shell of said rigid external shell. The process includes the phases of positioning at least one insert made of a soft material, constituting the soft internal portion, on the matrix; covering the insert with a connecting layer; hermetically sealing the first and second semi-moulds onto the matrix along the edges of the cavities; injecting into the space between the cavities and the connecting layer a thermoplastic material that forms the rigid external shell to create a permanent connection of the soft insert to the shell. The connecting layer substantially retains the characteristics of the soft insert.