Patent classifications
B29C45/2673
DIE INSERT FOR MOLDING A SPEAKER GRILLE AND METHOD OF FORMING SAME
An insert of a die for molding a speaker grille includes a forming portion. The forming portion defines a forming surface, from which a plurality of pins extend for forming apertures in a speaker grille. The forming surface defines a plurality of apertures disposed at spaced locations between the pins. The apertures are interconnected with a plurality vent channels interconnecting the apertures with the vent channels for venting air disposed in a die when melted polymer used to form the speaker grille is injected into a die cavity defined by the die. The forming member and the vent channels are formed as a monolithic construction.
TUNABLE INJECTION MOLDED RESONATOR
A method including providing a mold cavity to produce an outer contour of an acoustic resonator and providing a mold core to produce an inner contour of the resonator. The inner contour corresponds to a plenum, and a connecting channel in fluid communication with the plenum. An insert fitting adjacent to the mold core defines a length of the connecting channel during injection molding of the resonator.
Small format reaction injection molding machines and components for use therein
The present disclosure relates to machines and methods for reaction injection molding. In particular, the present disclosure provides small format reaction injection molding machines having exchangeable molds and reactant material tanks, as well as molds configured for use therein and associated componentry.
Mold thermal controlling device and hot press system
A mold thermal controlling device including a first trench, a first temperature control layer and at least a temperature control tunnel is provided. The first temperature control layer includes a first temperature control face, and the first temperature control layer forms a first temperature control trench forming at least a part of the inner surface of the first trench. The first temperature control trench is configured to accommodate a mold and touch with the mold through the first temperature control face. The temperature control tunnel is disposed in the first temperature control layer, and the temperature control tunnel is configured to inject a heated fluid or a cold fluid. When the mold is contained in the first temperature control trench, the first temperature control surface is located between the mold and the temperature control tunnel. A hot press system is also provided.
Optic and apparatus for making an optic
An optic can manage light emitted by a light emitting diode. The optic can comprise a backside that faces the light emitting diode and a front side opposite the backside. The front side can be convex. The backside can have a central region that is adjacent the light emitting diode and that is either concave or convex. One or more grooves can extend peripherally about the central region. An injection molding system can produce optics in which the backside comprises the concave central region as well as optics in which the backside comprises the convex central region. The molding system can utilize one molding member shaped according to the front side of the optic. That molding member can be compatible with two other molding members that are shaped according to the different backsides of the optic. Thus, two different optic forms can be produced with three molding members.
Method and apparatus for manufacturing contact lenses
Apparatus and methods are described for manufacturing contact lenses by forming a contact lens mold half, and removing the mold half. The mold half can then be combined with a complementary mold half and used to cast-mold a contact lens. The apparatus includes first and second plates each carrying tool halves. The plates reciprocate between an open, spaced apart configuration, and a closed configuration in which they hold complementary tool halves in contact with one another. When the plates are opened after forming a mold half, a gripper plate removes the mold half from the first plate or the second plate.
MOLD INSERT WITH CONDUITS FOR COOLING INJECTION MOLDED ITEM
A mold insert having a main body including a first surface and an opposed second surface, the first surface defining a plane. The mold insert also has a mold core extending from the first surface and a gas inlet port connectable to a supply of pressurized gas. Further, the mold insert has two or more gas outlet ports arranged to direct a gas flow towards an uncovered surface of an injection molded item located on the mold core, after the mold core and the mold cavity are separated from each other. Further, the mold insert has a gas conduit system extending inside the main body connecting the two or more gas outlet ports with the gas inlet port. Each of the two or more gas outlet ports are arranged through the first surface. The gas conduit system is provided in the main body below the first surface.
Molding device
A molding device includes an insert mold and a base mold. The insert mold is attached to the base mold in a replaceable manner. The base mold includes a frame and a pipe. Inside the frame, the insert mold is inserted. Inside the pipe, a fluid for temperature adjustment flows. Between the insert mold and the base mold, an elastically deformable heat transfer member is arranged. The heat transfer member is in contact with both the insert mold and the base mold at least during molding.
Method Of Building An Insulation System Around A Naked Conductor Section Of A Power Cable
A method of building an insulation system around a naked conductor section of a power cable. The insulation system includes an inner semiconducting layer arranged around the conductor, an insulation layer arranged around the inner semiconducting layer, and an outer semiconducting layer arranged around the insulation layer. The method includes: a) placing the naked conductor section in a mold, and b) molding an insulation system around the naked conductor section, wherein the molding of the insulation system involves injecting a first semiconducting compound into a first mold cavity to form an inner semiconducting layer around the naked conductor section, injecting an insulation compound into a second mold cavity to form an insulation layer around the inner semiconducting layer, and injecting a second semiconducting compound into a third mold cavity to form an outer semiconducting layer around the insulation layer.
SYSTEM FOR INJECTION MOLDING AND MOLD BASE THEREFOR
The invention relates to a mold base for a system for injection molding of plastic parts, in particular for automotive body and/or structure components, preferably for baffle and/or reinforcing structures, comprising at least one, namely first, bridge manifold with at least a first and a second bridge manifold opening for feeding material to at least a first and a second sub-manifold of at least one mold insert assembly and at least a first and a second control valve, wherein the first control valve is provided and configured for controlling the material feed through the first bridge manifold opening and the second control valve is provided and configured for controlling the material feed through the second bridge manifold opening.