An automated production line for the production of ophthalmic lenses comprises: a production line front end (1) comprising: a first injection-molding machine (10) and a second injection-molding machine (12) a casting module (14) comprising a filling station (144) and a capping station (145); a stacking module (15) and a curing module (16); a destacking module (17) and a demolding and delensing module a production line back end (2) comprising: a scalable treatment module (20) comprising a number of liquid baths for a liquid bath treatment of the cured lenses (CL) carried by the treatment carrier tray (200) to obtain the ophthalmic lenses, wherein the number of liquid baths are reduced or increased pending on the number of ophthalmic lenses concurrently produced by the production lines.

A mold assembly (100) for making tubular articles. The mold assembly includes a core plate (210), core inserts (230) mounted to the core plate (210) by fasteners (B), a cavity plate (410) with holes (413) through its thickness and cavity inserts (420) mounted to the cavity plate (410). Each core insert (230) has a molding surface (234a) and an engagement taper (233) between the molding surface and its mounting surface (236). At least part of the engagement taper (233) is located closer to the mounting surface (236) than it is to the molding surface (234a) for inhibiting the core insert (230) from tipping when the engagement taper (233) is engaged to move or slide the core insert (230) along the core plate (210). The assembly (100) has an assembled configuration, in which the core plate (210) is mounted to the a cavity plate (410), such that each core insert (230) describes with a respective cavity insert (420) a hollow body and each cavity plate hole (413) is aligned with a respective core insert fastener (B) for allowing a tool to be inserted therethrough to access the core insert fastener (B).

A mold assembly (100) for making tubular articles. The mold assembly includes a core plate (210), core inserts (230) mounted to the core plate (210) by fasteners (B), a cavity plate (410) with holes (413) through its thickness and cavity inserts (420) mounted to the cavity plate (410). Each core insert (230) has a molding surface (234a) and an engagement taper (233) between the molding surface and its mounting surface (236). At least part of the engagement taper (233) is located closer to the mounting surface (236) than it is to the molding surface (234a) for inhibiting the core insert (230) from tipping when the engagement taper (233) is engaged to move or slide the core insert (230) along the core plate (210). The assembly (100) has an assembled configuration, in which the core plate (210) is mounted to the a cavity plate (410), such that each core insert (230) describes with a respective cavity insert (420) a hollow body and each cavity plate hole (413) is aligned with a respective core insert fastener (B) for allowing a tool to be inserted therethrough to access the core insert fastener (B).

A hollow article such as an active bolster for an automobile is formed of an injection molded panel having a ridge and furrow adjacent a panel perimeter and an injection molded sheet having a bonding section at a sheet outer periphery, wherein the bonding section is within the furrow. An injection molded bond is formed between the bonding section and furrow, wherein a compression area where the sheet overlies a region of the panel adjacent the furrow is configured to constrain the bond to the furrow. An associated process and system facilitates mold alignment, part alignment, material strength, design adaptability, efficient processing, reduced labor, increased production rates, reduced energy consumption per part, aesthetically pleasing surfaces, and reduces or eliminates the need for a separate welding operation.

A semiconductor device manufacturing apparatus for encapsulating with a resin a semiconductor chip includes upper and lower molds configured to receive therebetween a lead frame on which the semiconductor chip is mounted. A positioning pin provided to the lower mold is configured to be received by a positioning hole provided in the lead frame. Ejector pins provided in proximity to the positioning pin are arranged so as to be symmetrical with respect to the positioning pin.

A semiconductor device manufacturing apparatus for encapsulating with a resin a semiconductor chip includes upper and lower molds configured to receive therebetween a lead frame on which the semiconductor chip is mounted. A positioning pin provided to the lower mold is configured to be received by a positioning hole provided in the lead frame. Ejector pins provided in proximity to the positioning pin are arranged so as to be symmetrical with respect to the positioning pin.

A tandem mold for creating injection-molded parts from synthetic material includes a first part (2), a second part (4), a third part (6), and a guide (20, 22, 26, 28). A first parting surface is defined between the first part (2) and the third part (6), and a second parting surface is defined between the second part (4) and the third part (6). The mold also includes, for each parting surface, at least one mechanical stop (44) that is movable between a first position, where said stop prevents a drive mechanism from reaching the closed position of the mold, and a second position, or retracted position, where the mold can reach its closed position.

A tandem mold for creating injection-molded parts from synthetic material includes a first part (2), a second part (4), a third part (6), and a guide (20, 22, 26, 28). A first parting surface is defined between the first part (2) and the third part (6), and a second parting surface is defined between the second part (4) and the third part (6). The mold also includes, for each parting surface, at least one mechanical stop (44) that is movable between a first position, where said stop prevents a drive mechanism from reaching the closed position of the mold, and a second position, or retracted position, where the mold can reach its closed position.

Described are joint designs, tooling, and molding methods for a hollow object, such as an automobile bolster. The methods and structures provide a process and system that facilitates mold alignment, part alignment, material strength, design adaptability, efficient processing, reduced labor, increased production rates, reduced energy consumption per part, aesthetically pleasing surfaces, and reduces or eliminates the need for welding.

The invention relates to a method for the production of form parts from multi-component reactive plastic material, especially from polyurethane, wherein a plurality of moulds are moved by means of mould carriages (1) at least temporarily along a closed, preferably oval, production line (2). To allow a simple and quick import and export of mould carriages in the respectively out of the production line the invention proposes that the mould carriages (1) are provided with rolls (3) and are moved on a stationary ground (4) by the same and that a plurality of supply carriages (6) are arranged along the closed production line (2) at a conveying element (5), which supply carriages (6) are moved by means of the conveying elements (5), wherein a mould carriage (1) is approached to a not occupied supply carriage (6) and is coupled with the same to introduce the mould carriage (1) into the production line (2), wherein for the movement along the production line (2) the mould carriage (1) is guided and moved by the supply carriage (6) in a coupled state between the mould carriage (1) and the supply carriage (6) and wherein the mould carriage (1) is decoupled from the supply carriage (6) and is moved away from the production line (2) for taking the mould carriage (1) out of the production line (2), wherein here the mould carriage (1) is moved with its roils (3) on the stationary ground (4). Furthermore, the invention relates to a respective device.