A method includes placing a package structure into a mold chase, with top surfaces of device dies in the package structure contacting a release film in the mold chase. A molding compound is injected into an inner space of the mold chase through an injection port, with the injection port on a side of the mold chase. During the injection of the molding compound, a venting step is performed through a first venting port and a second venting port of the mold chase. The first venting port has a first flow rate, and the second port has a second flow rate different from the first flow rate.

A device and a method are provided for measuring the moisture in die cast molds, the cavity of which is connected via an evacuation conduit to an evacuation device. The modular assembly of the device is connectable to the evacuation conduit and includes a sensor assembly to measure the moisture of gases evacuated from the mold cavity. The sensor assembly includes an emitter emitting electromagnetic radiation and a detector detecting electromagnetic radiation. On the basis of the measured values obtained during the evacuation action it can be determined whether the amount of a water/release agent mixture jetted into the mold cavity needs to be altered before the actual casting action.

A device and a method are provided for measuring the moisture in die cast molds, the cavity of which is connected via an evacuation conduit to an evacuation device. The modular assembly of the device is connectable to the evacuation conduit and includes a sensor assembly to measure the moisture of gases evacuated from the mold cavity. The sensor assembly includes an emitter emitting electromagnetic radiation and a detector detecting electromagnetic radiation. On the basis of the measured values obtained during the evacuation action it can be determined whether the amount of a water/release agent mixture jetted into the mold cavity needs to be altered before the actual casting action.

A semiconductor die is attached to a die pad of a leadframe. The semiconductor die attached to the die pad is arranged in a molding cavity between complementary first and second mold portions. Package material is injected into the molding cavity via at least one injection channel provided in one of the complementary first and second mold portions. Air is evacuated from the molding cavity via at least one air venting channel provided in the other of the complementary first and second mold portions. An exit from the at least one air venting channel may be blocked by a retractable stopper during the injection of the package material.

An insert of a die for molding a speaker grille includes a forming member. The forming member defines a forming surface, from which a plurality of pins extend for forming apertures in a speaker grille. The forming surface defines a plurality of apertures disposed at spaced locations between the pins. The apertures are interconnected with a plurality vent channels communicating the apertures with the vent channels for venting air disposed in a die when melted polymer used to form the speaker grill is injected into the die. The forming member and the vent channels are formed as a monolithic construction.

An insert of a die for molding a speaker grille includes a forming member. The forming member defines a forming surface, from which a plurality of pins extend for forming apertures in a speaker grille. The forming surface defines a plurality of apertures disposed at spaced locations between the pins. The apertures are interconnected with a plurality vent channels communicating the apertures with the vent channels for venting air disposed in a die when melted polymer used to form the speaker grill is injected into the die. The forming member and the vent channels are formed as a monolithic construction.

A mold insert has at least one filament cavity and a stack of at least a first and second insert plates, wherein the first plate has a front face that closely abuts a front face of the second insert plate. A portion of the a filament cavity is provided in at least one of the front faces of the first and second insert plates such that the filament cavity is open at a top surface of the mold insert but does not extend to a bottom surface of the mold insert. A venting cavity is provided in the same front face of the insert plate in which the portion of the at least one filament cavity is provided. The venting cavity, which is in air-conducting connection with the blind-hole end of the filament cavity, has a depth between 1 μm and 20 μm. A method of manufacturing the mold insert includes providing first and second insert plates, forming a portion of a filament cavity into at least one of the front faces of the insert plates, forming a venting cavity into the front face with the filament cavity, and bringing the front faces of the plates into close abutment to form a filament cavity.

A mold insert has at least one filament cavity and a stack of at least a first and second insert plates, wherein the first plate has a front face that closely abuts a front face of the second insert plate. A portion of the a filament cavity is provided in at least one of the front faces of the first and second insert plates such that the filament cavity is open at a top surface of the mold insert but does not extend to a bottom surface of the mold insert. A venting cavity is provided in the same front face of the insert plate in which the portion of the at least one filament cavity is provided. The venting cavity, which is in air-conducting connection with the blind-hole end of the filament cavity, has a depth between 1 μm and 20 μm. A method of manufacturing the mold insert includes providing first and second insert plates, forming a portion of a filament cavity into at least one of the front faces of the insert plates, forming a venting cavity into the front face with the filament cavity, and bringing the front faces of the plates into close abutment to form a filament cavity.

An air vent is formed in a substrate of an electronic device such that air in a cavity of a metal mold can be released through the air vent when a resin is molded. Solder resist is disposed on a second surface of the substrate and has an opening portion at a position corresponding to the air vent. As such, the air can be also released from a clearance between a lower mold and the solder resist resulting from a rough surface of the solder resist. The resin can be held in a space provided between the second surface of the substrate and the lower mold. Therefore, the resin having passed through the air vent can be restricted from flowing out, and the air vent can be restricted from losing its function due to the substrate and the metal mold closely contacting with each other.

An application element and an applicator comprising pluralities of said application elements on a molded support is provided for applying a product such as a cosmetic, a medicinal or a care product. At least one application element of the applicator includes a base portion and at least one thin projection. The thin projection includes at least one surface and wherein the at least one outer surface flushes with at least a portion of an outer surface of the base portion.