According to certain embodiments, a cover plate of an electronic device, comprises: a first pattern formed in a first region of the cover plate; and a second pattern formed in a second region of the cover plate, wherein the first pattern has a first flat part and a first protrusion part protruding at a first height with respect to the first flat part, the first flat part and the first protrusion part being repeatedly arranged, the second pattern has a second flat part and a second protrusion part protruding at a second height with respect to the second flat part, the second flat part and the second protrusion part being repeatedly arranged, and the first flat part of the first pattern and the second flat part of the second pattern are continuously joined to each other at a portion at which the first pattern and the second pattern are connected.

According to the present invention, provided are a liquid crystal film for three-dimensional molding from which a three-dimensional molded body which is excellent in reproducibility of image light can be obtained during image light irradiation, a three-dimensional molded body, and a method of manufacturing the three-dimensional molded body. A liquid crystal film for three-dimensional molding includes: a substrate; and a functional layer, the functional layer includes a liquid crystal layer, the liquid crystal layer is made from a liquid crystal composition, and a rubbing haze variation of an outermost surface of the functional layer is 0.80% or less.

According to the present invention, provided are a liquid crystal film for three-dimensional molding from which a three-dimensional molded body which is excellent in reproducibility of image light can be obtained during image light irradiation, a three-dimensional molded body, and a method of manufacturing the three-dimensional molded body. A liquid crystal film for three-dimensional molding includes: a substrate; and a functional layer, the functional layer includes a liquid crystal layer, the liquid crystal layer is made from a liquid crystal composition, and a rubbing haze variation of an outermost surface of the functional layer is 0.80% or less.

Exemplary embodiments are provided of molding designs and methods for helical antennas. In an exemplary embodiment, a method generally includes placing an antenna element between a top mold core and a first bottom mold core, and injecting molding material into a first mold cavity defined by at least the top mold core, thereby forming a top portion of a helical antenna housing and two opposite side portions of the helical antenna housing. The method also includes removing the first bottom mold core and placing a second bottom mold core about the antenna element, and injecting molding material into a second mold cavity defined by at least the second bottom mold core, thereby forming a bottom portion of the helical antenna housing.

The invention concerns a super hydrophobic surface for handling a liquid and/or able to be contacted by a liquid, said surface comprising at least one hydrophobic liquid contact surface portion, wherein said hydrophobic liquid contact surface portion presents a micro- and nano-meter hierarchical patterned structure, the structure comprising: —homogeneously distributed micrometre-sized pillars (1), and—homogeneously distributed nanometre-sized pillars (2), preferably said pillars (2) having a dimension below 1 micrometer, at the upper surface of the micrometre-sized pillars, and—nanometre-sized protrusions (3) at the upper surface of the nanometre-sized pillars, the protrusions being positioned in a non-periodic, irregular pattern. The invention also relates to the use of such surfaces with micro- and nano-meter hierarchical patterned structure, for example in handling hot liquids, and a corresponding manufacturing process, e.g. using an injection moulding process for producing the component in polymer.

Methods and apparatuses are provided for manufacturing a transaction card. The disclosed methods and apparatuses may be used to form a transaction card frame within a mold. The transaction card frame may include one or more recessed portions formed within a first surface of the transaction card frame. The one or more recessed portions may be configured for affixing one or more electronic components.

Methods and apparatuses are provided for manufacturing a transaction card. The disclosed methods and apparatuses may be used to form a transaction card frame within a mold. The transaction card frame may include one or more recessed portions formed within a first surface of the transaction card frame. The one or more recessed portions may be configured for affixing one or more electronic components.

A micro-structured mold-core of a microfluidic chip and its manufacturing method, which includes the steps of: installing a mold-core on a worktable of a five-axis machining center, and installing a micro-milling cutter and a fine milling-grinding tool on a tool holder of the five-axis machining center; rough-milling a surface of the mold-core using the micro-milling cutter according to a preset first machining track, to form a micro-projection array structure with a specific shape; finishing a surface of the micro-projection array structure formed by rough-milling using the fine milling-grinding tool according to a preset second machining track, to form a desired micro-projection array structure; and installing the mold-core on an injection molding machine, and adding particle material of polymer for micro injection molding to form a microfluidic chip, or installing the mold-core on a hot-embossing machine, and adding block material of polymer for hot embossing to form a microfluidic chip.

Thermoset ceramic compositions and a method of preparation of such compositions. The compositions are advanced organic/inorganic hybrid composite polymer ceramic alloys. The material combines strength, hardness and high temperature performance of technical ceramics with the strength, ductility, thermal shock resistance, density, and easy processing of the polymer. Consisting of a branched backbone of silicon, and alumina, with highly coordinated Si—O—Si or Al—O—Al bonds, the material undergoes sintering at 7 to 300 centigrade for 2 to 94 hours from water at a pH between 0 to 14, humidity of 0 to 100%, with or without vaporous solvents.

Thermoset ceramic compositions and a method of preparation of such compositions. The compositions are advanced organic/inorganic hybrid composite polymer ceramic alloys. The material combines strength, hardness and high temperature performance of technical ceramics with the strength, ductility, thermal shock resistance, density, and easy processing of the polymer. Consisting of a branched backbone of silicon, and alumina, with highly coordinated Si—O—Si or Al—O—Al bonds, the material undergoes sintering at 7 to 300 centigrade for 2 to 94 hours from water at a pH between 0 to 14, humidity of 0 to 100%, with or without vaporous solvents.