An electronic component to be encapsulated is introduced into a mold cavity. The mold cavity includes at least first and second halves, and at least one of the halves is formed with a negative of a thermal-interface-material engaging pattern thereon. An encapsulating material, which encapsulates the electronic component and engages the negative of the thermal-interface-material engaging pattern, is introduced into the mold cavity. The encapsulating material is allowed to solidify such that a thermal-interface-material engaging surface of the encapsulant solidifies with the thermal-interface-material engaging pattern thereon. During subsequent assembly, the thermal-interface-material engaging pattern engages thermal interface material to resist lateral motion of the thermal interface material.

An injection mold including a gate and a cavity, where a weld portion is formed inside the cavity by injecting molten resin containing reinforcing fibers from the gate into the cavity, the injection mold has a resin reservoir open to the cavity, and in a first cross section along an opening end surface 110S of the resin reservoir 110 to the cavity, a distance CLD between a width center line CL11 of the resin reservoir and a width center line of the cavity, which is measured along a perpendicular line n12 of the width center line CL12 of the cavity, changes at least in part along the width center line of the cavity.

An injection mold including a gate and a cavity, where a weld portion is formed inside the cavity by injecting molten resin containing reinforcing fibers from the gate into the cavity, the injection mold has a resin reservoir open to the cavity, and in a first cross section along an opening end surface 110S of the resin reservoir 110 to the cavity, a distance CLD between a width center line CL11 of the resin reservoir and a width center line of the cavity, which is measured along a perpendicular line n12 of the width center line CL12 of the cavity, changes at least in part along the width center line of the cavity.

Provided are a production method of a mold having a recessed pattern, and a manufacturing method of a pattern sheet having good accuracy and excellent productivity. The production method of a mold includes: a step of preparing an electroform having a protruding pattern and a mold having a first mold and a second mold forming a cavity; a step of fixing the electroform excluding an end portion of the electroform to the first mold; a clamping step of clamping the electroform excluding the end portion of the electroform and a region of the protruding pattern between the first mold and the second mold to form the cavity; and an injection step of filling the cavity with a resin.

Methods and apparatuses are provided for manufacturing a transaction card. The disclosed methods and apparatuses may be used to form a transaction card frame within a mold. The transaction card frame may include one or more recessed portions formed within a first surface of the transaction card frame. The one or more recessed portions may be configured for affixing one or more electronic components.

Methods and apparatuses are provided for manufacturing a transaction card. The disclosed methods and apparatuses may be used to form a transaction card frame within a mold. The transaction card frame may include one or more recessed portions formed within a first surface of the transaction card frame. The one or more recessed portions may be configured for affixing one or more electronic components.

A method for forming a part in an injection mold, includes: heating a molding material to a molding temperature; injecting the molding material through a gate and into a molding cavity of the injection molding apparatus of any of the preceding claims; pressing the stationary half and the moving half together to form the molding cavity between the resin mold surface and the insert molding surface; moving the movable mold insert, and thereby moving the insert molding surface and adjusting the molding cavity shape, the molding cavity depth, the molding cavity volume, or a combination comprising at least one of the foregoing along at least a portion of the molding cavity; cooling a surface of the molding cavity with the cooling system; separating the resin mold surface and the moving half mold surface; and ejecting the part from the injection molding apparatus.

In one embodiment, a system for conditioning a preform for molding includes a heating cavity for receiving the preform, a heater configured to heat a gas, and a blower configured to force the gas heated by the heater into the heating cavity. In another embodiment, a method of conditioning a preform for molding includes positioning the preform in a heating cavity and forcing a heated gas into the heating cavity onto an exterior surface of the preform.

A system for molding an object includes an articulated mold having an axis and a plurality of mold portions configured to collectively define a molding cavity for shaping the object when arranged in respective molding positions. The system includes a plurality of actuators, each operatively coupled to a respective mold portion and configured to move the respective mold portion along the axis from the respective molding position toward a respective ejecting position for releasing the object. The system includes a controller in communication with each of the plurality of actuators and configured to independently activate each of the plurality of actuators such that one of the plurality of mold portions moves along the axis from the respective molding position toward the respective ejecting position while at least one other of the plurality of mold portions remains stationary relative to the object in order to at least partially support the object.

A mold for casting a polymeric aircraft window panel includes a first mold half (12) having a first mold surface (24), and a second mold half (14) having a second mold surface (50). The first mold surface (24) and/or the second mold surface (50) have a shape conforming to a final shape for the major surfaces of the aircraft window panel. The first mold half (12) and/or the second mold half (14) can be formed of rolled, hydroformed, or stamped metal.