A serving tray comprised of at least one synthetic material and an insert which provides a non-slip top surface of the serving tray. The textured relief is preferably made of thermoplastic polyurethane (TPU) which allows a glass or other item to be placed on the serving tray without the item sliding or slipping while the tray is in motion. As the tray is being fabricated, the TPU is mechanically bonded with the top surface of the tray while a textured relief is simultaneously defined into the top surface. The textured relief provides adequate frictional force to an item being placed on the tray so as to substantially prevent its lateral movement. The tray also includes an inner support structure disposed on its inner surface. The inner support structure provides an upward facing edge which allows a plurality of trays to be easily and efficiently stacked or nested on one another.

A serving tray comprised of at least one synthetic material and an insert which provides a non-slip top surface of the serving tray. The textured relief is preferably made of thermoplastic polyurethane (TPU) which allows a glass or other item to be placed on the serving tray without the item sliding or slipping while the tray is in motion. As the tray is being fabricated, the TPU is mechanically bonded with the top surface of the tray while a textured relief is simultaneously defined into the top surface. The textured relief provides adequate frictional force to an item being placed on the tray so as to substantially prevent its lateral movement. The tray also includes an inner support structure disposed on its inner surface. The inner support structure provides an upward facing edge which allows a plurality of trays to be easily and efficiently stacked or nested on one another.

Disclosed a photosensitive assembly, an imaging module, a smart terminal, and a method and a mould for manufacturing the photosensitive assembly. The photosensitive assembly comprises: a circuit board having a rectangular-shaped rigid board region and comprising a flexible board extension portion extending from the rigid board region, wherein the rigid board region has a lamination side and a non-lamination side, and the rigid board region has a lamination region on the lamination side; a photosensitive element mounted in the rigid board region of the circuit board; and a molded portion formed on the rigid board region, surrounding the photosensitive element, and extending towards the photosensitive element and coming into contact with the photosensitive element, the molded portion having an inner side surface, an outer side surface and a top surface, the molded portion not covering the lamination region of the rigid board region, and the top surface having a flat portion, wherein the top surface of a part of the molded portion on the lamination side has a descending portion, the descending portion is located between the flat portion and the outer side surface of the molded portion and is lower than the flat portion, and the outer side surface of a part of the molded portion on the non-lamination side is perpendicular to the flat portion.

Disclosed a photosensitive assembly, an imaging module, a smart terminal, and a method and a mould for manufacturing the photosensitive assembly. The photosensitive assembly comprises: a circuit board having a rectangular-shaped rigid board region and comprising a flexible board extension portion extending from the rigid board region, wherein the rigid board region has a lamination side and a non-lamination side, and the rigid board region has a lamination region on the lamination side; a photosensitive element mounted in the rigid board region of the circuit board; and a molded portion formed on the rigid board region, surrounding the photosensitive element, and extending towards the photosensitive element and coming into contact with the photosensitive element, the molded portion having an inner side surface, an outer side surface and a top surface, the molded portion not covering the lamination region of the rigid board region, and the top surface having a flat portion, wherein the top surface of a part of the molded portion on the lamination side has a descending portion, the descending portion is located between the flat portion and the outer side surface of the molded portion and is lower than the flat portion, and the outer side surface of a part of the molded portion on the non-lamination side is perpendicular to the flat portion.

Methods and apparatuses are provided for manufacturing a transaction card. The disclosed methods and apparatuses may be used to form a transaction card frame within a mold. The transaction card frame may include one or more recessed portions formed within a first surface of the transaction card frame. The one or more recessed portions may be configured for affixing one or more electronic components.

Methods and apparatuses are provided for manufacturing a transaction card. The disclosed methods and apparatuses may be used to form a transaction card frame within a mold. The transaction card frame may include one or more recessed portions formed within a first surface of the transaction card frame. The one or more recessed portions may be configured for affixing one or more electronic components.

Methods and systems for designing and manufacturing a mathematically fair N-sided die are disclosed. An example method can comprise selecting an irregular polyhedron to serve as a die, and determining a center of mass of the selected irregular polyhedron die. In an aspect, a size of each face of the irregular polyhedron can be selected such that a solid angle subtended by each face from the center of mass of the selected irregular polyhedron can be equal. In an aspect a system comprising an injection molding apparatus can be used to form the die.

Methods and systems for designing and manufacturing a mathematically fair N-sided die are disclosed. An example method can comprise selecting an irregular polyhedron to serve as a die, and determining a center of mass of the selected irregular polyhedron die. In an aspect, a size of each face of the irregular polyhedron can be selected such that a solid angle subtended by each face from the center of mass of the selected irregular polyhedron can be equal. In an aspect a system comprising an injection molding apparatus can be used to form the die.

A core side of a plastic injection molding tooling set for use in conjunction with a cavity side of the tooling set is disclosed. The core side may have the following composition in percent by weight: 0.25-0.55% carbon, 0.70-1.50% manganese, a maximum of 0.80% silicon, 1.40-2.00% chromium, 0.10-0.55% molybdenum, a maximum of 0.040% aluminum, a maximum of 0.025% phosphorous, a maximum of 0.20% sulfur, a balance of iron, and incidental impurities.

A core side of a plastic injection molding tooling set for use in conjunction with a cavity side of the tooling set is disclosed. The core side may have the following composition in percent by weight: 0.25-0.55% carbon, 0.70-1.50% manganese, a maximum of 0.80% silicon, 1.40-2.00% chromium, 0.10-0.55% molybdenum, a maximum of 0.040% aluminum, a maximum of 0.025% phosphorous, a maximum of 0.20% sulfur, a balance of iron, and incidental impurities.