Device for limiting or keeping constant a quantity of fluid flowing therethrough, comprising: a housing which comprises a front chamber and a rear chamber, a partition arranged in the housing and provided with two or more openings; and a flow limiting element arranged in one or both openings, the flow limiting element comprises the following: a housing provided with an inlet, an outlet and a throughflow opening; and a resilient plate-like valve element which is mounted in the housing and which can substantially close the throughflow opening by resilient movement in the direction of a valve seat arranged in the housing adjacently of the throughflow opening, wherein the valve element is fixed on one side and the valve element can move resiliently on the opposite side in the direction of the valve seat. Mould for producing one or more injection-moulded products, wherein at least a part of the mould is movable and adjustable from the outer side such that the size and/or the shape of the mould cavity is adjustable. The injection moulded product is a flow limiter for limiting the force of the flow of a fluid flowing therethrough, comprising: a housing provided with an inlet, an outlet and a throughflow opening; and a resilient plate-like valve element which is mounted in the housing and which can substantially close the throughflow opening by resilient movement in the direction of a valve seat arranged adjacency of the throughflow opening in the housing, wherein the valve element is fixed on one side and the valve element can move resiliently on the opposite side in the direction of the valve seat.

The present invention relates to a mould half for a mould for transfer moulding encapsulating electronic components mounted on a carrier, where the mould part to support the carrier has a contact surface that includes a primary carrier support surface and a the primary carrier support surface surrounding secondary surface, which surrounding secondary surface is supported by a drive for height adjustment of the secondary surface relative to the height of the primary carrier support surface. Such mould half may be used for transfer moulding of electronic components while relatively easy providing a levelled support for the carrier and compensating for any thickness variations in the carrier. The invention also provides a mould with at least two mould parts and a method for transfer moulding encapsulating electronic components mounted on a carrier using such a mould.

The present invention relates to a mould half for a mould for transfer moulding encapsulating electronic components mounted on a carrier, where the mould part to support the carrier has a contact surface that includes a primary carrier support surface and a the primary carrier support surface surrounding secondary surface, which surrounding secondary surface is supported by a drive for height adjustment of the secondary surface relative to the height of the primary carrier support surface. Such mould half may be used for transfer moulding of electronic components while relatively easy providing a levelled support for the carrier and compensating for any thickness variations in the carrier. The invention also provides a mould with at least two mould parts and a method for transfer moulding encapsulating electronic components mounted on a carrier using such a mould.

Provided are a method with which a spectacle lens molding mold having a minute recess can be made with high accuracy, and the like. A method for producing a molding mold 12 for molding a spectacle lens 1 in which a minute protrusion 6 is formed on at least one surface thereof includes a first molding mold preparation step of preparing a first mold 14 that includes a base material 26 and a coating portion 28, the coating portion being made of a nickel alloy, coating the base material, and having a surface formed into a shape corresponding to the shape of one surface of the spectacle lens; and a cutting step of cutting a recess 28A corresponding to the protrusion into the surface of the coating portion of the first mold.

A mold for injection molding processes and a molding process that uses the mold. The mold has, at at least one part of the surface of its cavity raised portions which are longitudinally extended, are arranged side by side and are oriented substantially in the direction of the flow of the melted plastic material that is injected. During the process, the surface of the cavity of the mold is kept at a temperature that is lower than the glass transition temperature, in the case of molding of plastic material constituted by amorphous polymers, and lower than the crystallization temperature, in the case of molding of plastic material constituted by semicrystalline polymers.

A mold for injection molding processes and a molding process that uses the mold. The mold has, at at least one part of the surface of its cavity raised portions which are longitudinally extended, are arranged side by side and are oriented substantially in the direction of the flow of the melted plastic material that is injected. During the process, the surface of the cavity of the mold is kept at a temperature that is lower than the glass transition temperature, in the case of molding of plastic material constituted by amorphous polymers, and lower than the crystallization temperature, in the case of molding of plastic material constituted by semicrystalline polymers.

According to the embodiment, a toilet seat including: a bottom plate; a top plate including a sidewall part and a seating part; and a bonding member bonding the bottom plate and the sidewall part and having an exposed surface, the sidewall part including a sidewall base, a first hanging part extending downward from a lower end of the sidewall base, and a second hanging part provided to be separated from the first hanging part at the lower end of the sidewall base to provide a recess recessed upward between the first and second hanging parts, the second hanging part being disposed at a position not overlapping the bottom plate in a vertical direction, the bonding member being provided in the recess, the exposed surface being disposed between the second hanging part and the bottom plate, a width of the second hanging part decreasing downward from the sidewall base.

A semiconductor package includes a flat plate-shaped terminal integrally formed with a housing portion for a semiconductor chip and a rod-shaped terminal pin that penetrates through a through-hole of the plate-shaped terminal. On a surface of the plate-shaped terminal, a resin guide portion for guiding the terminal pin to the through-hole of the plate-shaped terminal is provided. The resin guide portion is a portion of the housing portion and has a through-hole that is continuous with the through-hole of the plate-shaped terminal. During assembly of the semiconductor package, the terminal pin is inserted into the through-hole of the plate-shaped terminal, via the through-hole of the resin guide portion. A sidewall of the through-hole of the resin guide portion and a sidewall of the through-hole of the plate-shaped terminal have a same slope and form a single continuous surface; a border between the through-hole of the resin guide portion and the through-hole of the plate-shaped terminal is free of any step.

A semiconductor package includes a flat plate-shaped terminal integrally formed with a housing portion for a semiconductor chip and a rod-shaped terminal pin that penetrates through a through-hole of the plate-shaped terminal. On a surface of the plate-shaped terminal, a resin guide portion for guiding the terminal pin to the through-hole of the plate-shaped terminal is provided. The resin guide portion is a portion of the housing portion and has a through-hole that is continuous with the through-hole of the plate-shaped terminal. During assembly of the semiconductor package, the terminal pin is inserted into the through-hole of the plate-shaped terminal, via the through-hole of the resin guide portion. A sidewall of the through-hole of the resin guide portion and a sidewall of the through-hole of the plate-shaped terminal have a same slope and form a single continuous surface; a border between the through-hole of the resin guide portion and the through-hole of the plate-shaped terminal is free of any step.

The present disclosure provides a marbled molded product obtained by injection-molding, in a mold cavity, a mixture including: a thermoplastic resin including one selected from the group of polycarbonate, acrylonitrile-butadiene-styrene, polybutylene terephthalate, polypropylene, and combinations thereof; and fine pigment particles, where a pattern forming a texture is formed on the surface of the injection-molded product. The present disclosure also provides a system for evaluating a marble color effect of a marbled molded product, the system including: a light source unit, an image-capturing unit, an image processing unit and an evaluation factor determination unit.