Methods and apparatuses are provided for manufacturing a transaction card. The disclosed methods and apparatuses may be used to form a transaction card frame within a mold. The transaction card frame may include one or more recessed portions formed within a first surface of the transaction card frame. The one or more recessed portions may be configured for affixing one or more electronic components.

In a mold die, a tip-end surface of each push-up pin provided on the rear surface side of a lower die cavity block and a part of the rear surface of the lower die cavity block with which the tip-end surface of each push-up pin is contacted are inclined in such a manner that a distance to a top surface of the lower die cavity block becomes longer towards the pot side where mold resin is supplied. When the lower die cavity block is returned to the initial position, the lower die cavity block is lifted while being slightly moved towards the pot block side. No gap is formed between a side surface of the pot block and a side surface of the lower die cavity block.

In a mold die, a tip-end surface of each push-up pin provided on the rear surface side of a lower die cavity block and a part of the rear surface of the lower die cavity block with which the tip-end surface of each push-up pin is contacted are inclined in such a manner that a distance to a top surface of the lower die cavity block becomes longer towards the pot side where mold resin is supplied. When the lower die cavity block is returned to the initial position, the lower die cavity block is lifted while being slightly moved towards the pot block side. No gap is formed between a side surface of the pot block and a side surface of the lower die cavity block.

Wings are provided on mold components and linear ways are provided below these wings. A pad rides on each linear way below each wing. A force generator, such as a spring, is disposed between each wing and underlying pad. In this way the weight of the mold components is borne, at least in part, by the linear ways so that the weight on components that might otherwise sag is lessened.

Technique to provide a molding die which can easily release a minute optical element in a state of favorable surface accuracy, while bending or rupture of a gate portion attached to the optical element is prevented. By making a first outer circumferential transfer surface 21A of a fixed die 20 and a first gate-forming surface 31A flush with each other, a notch shape is not formed on a portion M1 connecting an outer circumferential portion FL on the fixed die 20 side and a gate portion GP. Furthermore, by pushing out the runner portion RP at the same angle as a taper angle of a side-surface transfer surface 23A on a second gate-forming surface 32A side, bending deformation or the like of the gate portion GP which can occur when being pushed out to a direction perpendicular to a mold mating surface PL1 can be prevented.

The invention is a valvular closure element (5), in particular for dispensing a liquid from a container, the valvular closure element (5) comprising a support element (10) having an annular shape and a valve insert (12) having a side wall and a cover portion made of a resilient material and abutting to an internal surface of the support element (10) by its side wall. The cover portion (17) is formed with slits (14) defining valve flaps (15), wherein each valve flap (15) has an adjoining periphery connected to the side wall. In the valvular closure element (5) the side wall has a cylindrical shape, and the slits (14) are formed radially, and a projection (18) is formed on the external periphery of the support element (10) for each valve flap (15) at the middle of the adjoining periphery corresponding to the respective valve flap (15). The invention is, furthermore, a closure cap comprising the valvular closure element (5), and a method and an apparatus for manufacturing the valvular closure element (5). The invention also relates to another valvular closure element.

A method for forming a part in an injection mold includes heating a polymer material to a temperature greater than or equal to a polymer glass transition temperature; injecting the polymer material into the injection molding apparatus of any of the preceding claims while pressing together the stationary half mold surface and the moving half mold surface to form the molding cavity; cooling a surface of the molding cavity with the cooling system; separating the stationary half mold surface and the moving half mold surface; and moving the ejection block relative to the stationary half thereby pushing the part away from the stationary half molding surface and ejecting the part from the injection molding apparatus.

An apparatus for molding plastic elements includes a device for injection molding elements made of plastics and a device for unloading the molded plastic elements from the molding device. The molding device is associated with an extraction plate adapted to move, on command, at least one part of the molding device in order to allow the unloading of the plastic elements. The extraction plate is connected functionally, by way of posts to an actuation element and an abutment body and further actuation elements are provided which act between the abutment body and the actuation element and are adapted to move, substantially parallel to the direction of extension of the posts, the actuation element with respect to the abutment body. The abutment body is arranged between the extraction plate and the actuation element.

A carrier assembly for injection molding a parison with internal threads. The carrier assembly may be used with an injection stretch blow molding machine that includes a core rod. The carrier assembly comprises a carrier insert surrounding a portion of the core rod. The carrier insert includes a thread-forming portion presenting an interior radial surface and an exterior radial surface. The interior radial surface is configured to be positioned adjacent to the core rod, and the exterior radial surface includes a threaded protrusion configured to extend away from the core rod. The carrier assembly also includes a pinion insert surrounding at least a portion of the threaded protrusion of the thread-forming portion of the carrier insert. The pinion insert is spaced apart from the thread-forming portion of the carrier insert so as to present a thread-forming cavity between the pinion insert and the carrier insert.

An object of the present invention is to improve the reliability and productivity of a semiconductor device by suppressing generation of a resin burr in a molding process. In a mold die, a tip-end surface of each push-up pin provided on the rear surface side of a lower die cavity block and a part of the rear surface of the lower die cavity block with which the tip-end surface of each push-up pin is contacted are inclined in such a manner that a distance to a top surface of the lower die cavity block becomes longer towards the pot side where mold resin is supplied. Accordingly, when the lower die cavity block is returned to the initial position, the lower die cavity block is lifted while being slightly moved towards the pot block side. Thus, no gap is formed between a side surface of the pot block and a side surface of the lower die cavity block.