An in-mold vibratile injection compression molding method and molding apparatus thereof are described. While performing a filling stage, a first piezoelectric actuator and a second piezoelectric actuator are use to vibrate the molding material along at least two directions for precisely filling the molding material into the micro-structure by adjusting the filling flow velocity of the molding material associated with the proper molding material temperature and by maintaining a molding material temperature of a skin solidified layer in the cavity between a glass transition temperature and a melting temperature in order to avoid the form error, to increase the groove filling rate and to improve the residual stress.

Disclosed is a method of locating and holding one or more sheets of air permeable media within an injection mold tool and holding the location until the mold tool engaged and holds media sheets, as well as molding a support frames encapsulating the media sheets to form a unitary encapsulated filtration product.

Disclosed is a method of locating and holding one or more sheets of air permeable media within an injection mold tool and holding the location until the mold tool engaged and holds media sheets, as well as molding a support frames encapsulating the media sheets to form a unitary encapsulated filtration product.

An apparatus includes a mold. The mold has a first mold part with a first interior surface and a second mold part with a second interior surface. The apparatus additionally includes a movable member disposed proximate the mold. The movable member is movable between a first position and a second position. In the first position the movable member cooperates with the first interior surface and second interior surface to define a first mold cavity, and in the second position the movable member cooperates with the first interior surface and second interior surface to define a second mold cavity. The second mold cavity has a shape distinct from the first mold cavity.

A device for molding a semiconductor package including an upper mold configured to retain a substrate thereon, the substrate having semiconductor chips thereon, a lower mold defining a cavity and including a plurality of moving blocks, a bottom surface of the cavity defined by the moving blocks, the cavity configured to contain a molding resin, the moving blocks movably arranged under the cavity, a driving unit configured to movably drive the moving blocks, and a controller configured to control an raising order of the moving blocks by controlling the driving unit may be provided.

A device for molding a semiconductor package including an upper mold configured to retain a substrate thereon, the substrate having semiconductor chips thereon, a lower mold defining a cavity and including a plurality of moving blocks, a bottom surface of the cavity defined by the moving blocks, the cavity configured to contain a molding resin, the moving blocks movably arranged under the cavity, a driving unit configured to movably drive the moving blocks, and a controller configured to control an raising order of the moving blocks by controlling the driving unit may be provided.

A cable includes a lead having at least one wire, and a connector having at least one contact and a liquid-tight dielectric housing. The at least one contact is electrically connected to the at least one wire such that an electric current is conductible from the at least one wire into the at least one contact. A temperature-sensitive measuring resistor is contained in the housing and is electrically connected to the at least one wire such that at least a portion of the electrical current that is conductible into the at least one contact flows through the measuring resistor. A metallic element is disposed on the housing and thermally connected to the measuring resistor.

The present invention provides a method for efficiently manufacturing a molded foam product having excellent heat insulation, and a molded foam product obtained by such a method. The method of the present invention is a method for manufacturing a molded foam product, including the steps of: melting a resin composition containing a polyolefin and a polylactic acid and impregnating the resin composition with a fluid in a supercritical state to prepare a molten resin, and injecting the molten resin into a cavity formed in a mold and moving a portion of the mold to increase the volume of the cavity before the molten resin injected into the cavity completely solidifies, the fluid impregnated into the resin composition being a fluid of 0.05 to 4.0 wt % inert gas, the molded foam product at least partially having a five-layer cross-sectional structure of a first unfoamed layer, a first foamed layer, a hollow space, a second foamed layer, and a second unfoamed layer included in the given order.

The present invention provides a method for efficiently manufacturing a molded foam product having excellent heat insulation, and a molded foam product obtained by such a method. The method of the present invention is a method for manufacturing a molded foam product, including the steps of: melting a resin composition containing a polyolefin and a polylactic acid and impregnating the resin composition with a fluid in a supercritical state to prepare a molten resin, and injecting the molten resin into a cavity formed in a mold and moving a portion of the mold to increase the volume of the cavity before the molten resin injected into the cavity completely solidifies, the fluid impregnated into the resin composition being a fluid of 0.05 to 4.0 wt % inert gas, the molded foam product at least partially having a five-layer cross-sectional structure of a first unfoamed layer, a first foamed layer, a hollow space, a second foamed layer, and a second unfoamed layer included in the given order.

The present invention provides a method for manufacturing a molded foam product which can reduce blisters on the surface and foaming failure in injection molding of a molten resin containing a fluid in a supercritical state even in the case of manufacturing a molded product designed to have a small thickness, thereby giving a molded foam product having excellent heat insulation. The method of the present invention is a method for manufacturing a molded foam product through injection molding of a molten resin containing a fluid in a supercritical state, the method including a step of injecting the molten resin into a cavity formed in a mold and moving a portion of the mold to increase the volume of the cavity before the molten resin injected into the cavity completely solidifies, the cavity being communicated only with a single resin injection port, the mold having a dimple which has a substantially hemispherical shape and is situated to face the resin injection port, the mold having a minimum gap size of 0.2 mm or greater in the cavity during injection of the molten resin.