An LED display device includes a substrate and an LED encapsulation unit disposed on a side of the substrate, the LED encapsulation unit includes an LED stent and an LED chip encapsulated in the LED stent, a epoxy resin encapsulates the side of the substrate on which the LED encapsulation unit is disposed and the LED encapsulation unit to form a protection layer shielding the LED encapsulation unit. The epoxy resin completely encapsulates the substrate and the LED encapsulation unit to protect effectively the substrate and the LED encapsulation unit, which is sufficient to resist severe environment. Compared with the prior art, the service life of the LED display device is effectively prolonged, cost is reduced. The invention also provides a molding module for preparing the LED display device, and a preparation method thereof.

An LED display device includes a substrate and an LED encapsulation unit disposed on a side of the substrate, the LED encapsulation unit includes an LED stent and an LED chip encapsulated in the LED stent, a epoxy resin encapsulates the side of the substrate on which the LED encapsulation unit is disposed and the LED encapsulation unit to form a protection layer shielding the LED encapsulation unit. The epoxy resin completely encapsulates the substrate and the LED encapsulation unit to protect effectively the substrate and the LED encapsulation unit, which is sufficient to resist severe environment. Compared with the prior art, the service life of the LED display device is effectively prolonged, cost is reduced. The invention also provides a molding module for preparing the LED display device, and a preparation method thereof.

As an injection screw 2 applies pressure, a holding pressure plunger 22 is moved backward under the pressure of a resin to flow the resin into a holding pressure path 9, and the resin in a resin path 6 is pressurized (primary holding pressure process). A shutoff plunger 12 is closed, and the resin in the resin path 6 and the holding pressure path 9 is pressurized by the holding pressure plunger 22 (secondary holding pressure process). Further, the shutoff plunger 12 is opened, and the holding pressure plunger 22 is moved forward until its tip projects into the resin path 6 to discharge all the resin in the holding pressure path 9 to the resin path 6, whereby the resin beside the injection screw 2 as compared with the shutoff plunger 12 is held with respect to the holding pressure path 9.

As an injection screw 2 applies pressure, a holding pressure plunger 22 is moved backward under the pressure of a resin to flow the resin into a holding pressure path 9, and the resin in a resin path 6 is pressurized (primary holding pressure process). A shutoff plunger 12 is closed, and the resin in the resin path 6 and the holding pressure path 9 is pressurized by the holding pressure plunger 22 (secondary holding pressure process). Further, the shutoff plunger 12 is opened, and the holding pressure plunger 22 is moved forward until its tip projects into the resin path 6 to discharge all the resin in the holding pressure path 9 to the resin path 6, whereby the resin beside the injection screw 2 as compared with the shutoff plunger 12 is held with respect to the holding pressure path 9.

Silicone is placed between an upper die and an injection-pressing rubber-lid upper die, and the silicone injection passage is pressurized by the injection-pressing rubber-lid upper die. With this, the silicone is caused to flow into an injection port through the silicone injection passage. Then, sequentially through the injection port and the disc silicone-flow passage, the silicone is caused to flow toward an inner periphery of a silicone injection space. Further, the silicone flows between both circumferential sides of the silicone-flow deflection region. In this way, the silicone flows in a peculiar manner in conformity with a shape of the silicone-flow deflection region.

Silicone is placed between an upper die and an injection-pressing rubber-lid upper die, and the silicone injection passage is pressurized by the injection-pressing rubber-lid upper die. With this, the silicone is caused to flow into an injection port through the silicone injection passage. Then, sequentially through the injection port and the disc silicone-flow passage, the silicone is caused to flow toward an inner periphery of a silicone injection space. Further, the silicone flows between both circumferential sides of the silicone-flow deflection region. In this way, the silicone flows in a peculiar manner in conformity with a shape of the silicone-flow deflection region.

A molding method for the production of articles molded by injecting plastic material into a mold cavity by a plurality of injectors electrically sequentially actuated under an electronic control according to a cycle providing for a step for filling the mold cavity, followed by a step for packing the plastic material in the mold cavity. Each injector, regardless of both its position with respect to the mold cavity and its opening speed, is controlled in at least one of the following control modes: i) partially closing the injector from a maximum open condition to a less opened condition in the filling step, ii) setting the injector in a partially open condition and then opening the injector to a more opened condition, in the packing step.

A molding method for the production of articles molded by injecting plastic material into a mold cavity by a plurality of injectors electrically sequentially actuated under an electronic control according to a cycle providing for a step for filling the mold cavity, followed by a step for packing the plastic material in the mold cavity. Each injector, regardless of both its position with respect to the mold cavity and its opening speed, is controlled in at least one of the following control modes: i) partially closing the injector from a maximum open condition to a less opened condition in the filling step, ii) setting the injector in a partially open condition and then opening the injector to a more opened condition, in the packing step.

An LED display device includes a substrate and an LED encapsulation unit disposed on a side of the substrate, the LED encapsulation unit includes an LED stent and an LED chip encapsulated in the LED stent, a epoxy resin encapsulates the side of the substrate on which the LED encapsulation unit is disposed and the LED encapsulation unit to form a protection layer shielding the LED encapsulation unit. The epoxy resin completely encapsulates the substrate and the LED encapsulation unit to protect effectively the substrate and the LED encapsulation unit, which is sufficient to resist severe environment. Compared with the prior art, the service life of the LED display device is effectively prolonged, cost is reduced. The invention also provides a molding module for preparing the LED display device, and a preparation method thereof.

An LED display device includes a substrate and an LED encapsulation unit disposed on a side of the substrate, the LED encapsulation unit includes an LED stent and an LED chip encapsulated in the LED stent, a epoxy resin encapsulates the side of the substrate on which the LED encapsulation unit is disposed and the LED encapsulation unit to form a protection layer shielding the LED encapsulation unit. The epoxy resin completely encapsulates the substrate and the LED encapsulation unit to protect effectively the substrate and the LED encapsulation unit, which is sufficient to resist severe environment. Compared with the prior art, the service life of the LED display device is effectively prolonged, cost is reduced. The invention also provides a molding module for preparing the LED display device, and a preparation method thereof.