A cooling mold for cooling a resin preform that has a gate portion protruding outward from a center of a bottom portion, in which an accommodating space that accommodates the preform is formed in the cooling mold, a bottom region facing the bottom portion of the preform in the accommodating space has a shape following the bottom portion of the preform, and an air sucking hole for sucking air is formed in the bottom region at a position shifted from the center of the bottom portion of the preform. In the accommodating space, a region facing a body portion of the perform and a bottom region facing the bottom portion of the perform are formed as a single member.