A method for nanoimprinting a pattern on an organic polymer substrate, comprising: (a) preparing a soft operational mold, the operational mold comprising a pattern to be replicated to the substrate; (b) soaking the operational mold in a solvent to produce diffusion of solvent to the mold; (c) removing the operational mold from the solvent, and placing it on a surface of the organic polymer substrate to form a structure, and simultaneously (i) heating the structure to a temperature T<Tg, where Tg is the glass transition temperature of the organic polymer; and (ii) applying controlled pressure in a range of 20-300 psi on the mold to effect a penetration into the surface of the organic polymer substrate, thereby to replicate the pattern of the mold to the surface of the substrate; and (d) separating the operational mold from the patterned substrate.

An article including a composite including a subsurface structure and a second phase of material forming a coating on the subsurface structure. The coating includes a first region defining a first plurality of microtextures in an outer surface of the coating, where the first plurality of microtextures include an average bore width of less than about 250 micrometers (μm) and a first average bore depth, and a second region positioned adjacent to the first region wherein the coating defines a second plurality of microtextures on the outer surface of the coating, where the second plurality of microtextures include an average bore width of less than about 250 μm and a second average bore depth less than the first average bore depth.

Described herein is a process for producing a structured article (A1M1) in which a material (M1) including at least one micro- and/or nanostructured surface (SU1) containing a plurality of micro-scale and/or nano-scale surface elements is covered with an at least partially cured coating layer (C2) to provide a composite (M1C2), said composite (M1C2) is attached to an object (A1) and the coating layer (C2) is at least partially peeled off to provide the structured article (A1M1). Also described herein is a composite (M1C2) in which the surface elements of the material (M1) are covered by a protective coating layer (C2).

Disclosed herein is a method for transferring an embossed structure to at least a part of a surface of a coating composition (C2a) using a composite (S1C1) including a substrate (S1) and an at least partially embossed and at least partially cured coating (C1) upon following steps (1), (2-i) and (3-i) or (2-ii) and (3-ii), and also at least step (4) and optionally step (5-i) or (5-ii), where the coating composition (C1a) is a radiation-curable coating composition of defined constitution and the composite (S1C1) is used as embossing mold (e2) of an embossing tool (E2).

The present invention provides a metal mold and the method of making the metal mold for casting directional gecko-inspired adhesives that require deep, slanted features and an undercut wedge structure. The durable metal mold can be used for high quantities. In one example, compression molding is used to mass produce the adhesives. What normally takes 24 hours to produce now with compressing molding takes 5 minutes. Compression molding allows us to increase daily production from 1 adhesive patch to thousands per day.

An imprinting apparatus includes an imprinting platform, an imprinting roller, a transfer module and a lifting and pressing mechanism. The imprinting roller is disposed above the imprinting platform. The transfer module includes a transfer film, wherein the transfer film is located between the imprinting roller and the imprinting platform. The lifting and pressing mechanism is linked with the imprinting roller, wherein the lifting and pressing mechanism drives the imprinting roller to move along a normal direction of the imprinting platform and selectively pressurizes the imprinting roller.

A device for producing microstructures, particularly microneedles and more particularly microneedle arrays, including a female mold that has, on a top side, at least one in particular conical depressed portion for producing a microstructure. The female mold is, for example, in the form of a silicone cap and is connected to a hollow cylinder in particular via a holding element. A plunger is disposed movably inside the hollow cylinder.

A transfer object comprises a substrate having one or more fine concave portions formed on a surface thereof. At least one of a sidewall and a bottom of each fine concave portion has an oscillation waveform satisfying at least one of the following oscillation waveform conditions: the oscillation waveform is continuous; the oscillation waveform is a composite waveform of a plurality of oscillation waveforms, and the plurality of oscillation waveforms are in phase with each other; fine concave portions of a plurality of rows are formed on the substrate, and oscillation waveforms of adjacent fine concave portions are in phase with each other; and fine concave portions of a plurality of rows are formed on the substrate, and oscillation waveforms of the fine concave portions are in phase with each other for every two pitches.

A film for laminated glass, the film including a surface embossing pattern formed on at least a portion of one side of the film, wherein the surface embossing pattern comprises convexities, and concavities separating the convexities from one another, each of the convexities is surrounded by some of the concavities, and an average area of the convexities is 0.01 mm.sup.2 to 4.00 mm.sup.2.

The present disclose provides methods for forming a microfluidic device. Methods for forming a microfluidic device may comprise providing a microfluidic structure and a film, treating a surface of the microfluidic structure, a surface of the film, or both with a solvent, subsequently pressing the microfluidic structure together with the film under a first heating condition to form the microfluidic device comprising the solvent, and applying a negative pressure to the microfluidic device under a second heating condition, which negative pressure is applied for a time period greater than 30 minutes or at a pressure less than 20 kilopascals (kPa) to remove at least a portion of the solvent. In some aspects, the present disclosure provides devices consistent with the methods herein.