Patent classifications
B29C65/1403
Heat bonding of low energy surface substrates
A method comprising providing a polymeric substrate having a melting point of from about 130 C. to about 190 C., and locating a material layer onto the substrate, wherein the material layer comprises one or more polymeric materials that liquefy upon exposure to temperatures of at least about 100 C., to blend with a softened portion of the polymeric substrate. Upon exposure of one or more of the substrate and the material layer to a stimulus, the temperature is increased in a predetermined temperature zone of one or more of the substrate and material layer to cause blending of the one or more polymeric materials of the material layer with the softened portion of the polymeric substrate.
Repair method for a workpiece of a plastics material, repair apparatus
A repair method for a workpiece of a plastics material is provided, wherein an induction heating apparatus is positioned at a repair region of the workpiece. The induction heating apparatus comprises a magnetic field generating device and a heat source. The heat source is arranged between the magnetic field generating device and the repair region. A repair material is positioned on the repair region and heated by way of the heat source. The heat source is inductively heated by the magnetic field generating device. A temperature (T) is measured by which an application of heat to the repair material by the heat source is characterized. The temperature (T) is controlled by means of a control device. The control of the temperature (T) by the control device occurs according to a temperature profile specification, which has a heating region and a working region following the heating region.
INTEGRATED CIRCUIT HANDLING PROCESS AND APPARATUS
The invention relates to a process and apparatus for selectively changing adhesion strength between a flexible substrate and a carrier at specific locations in order to facilitate shipping and subsequent removal of the flexible substrate from the carrier, the process comprising the steps of:
providing a flexible substrate comprising a plurality of integrated circuits thereon;
providing a carrier for the flexible substrate and adhering the flexible substrate to the carrier by creating an interface between the flexible substrate and the carrier;
changing the adhesion force between the flexible substrate and the carrier at selected locations by non-uniform treatment of the interface between the flexible substrate and the carrier with an electromagnetic radiation source (e.g. a laser, flashlamp, high powered LED, an infrared radiation source or the like) so as to decrease or increase the adhesion force between a portion of the flexible substrate and the carrier at the selected location.
Flexible bearing assemblies, rocket motors including such assemblies, and methods of forming flexible bearings
A flexible bearing assembly includes at least one metal end ring, a flexible bearing core having a plurality of layers of a resilient material between layers of a reinforcement material, and a phenolic composite material between and bonded to each of the at least one metal end ring and the flexible bearing core. A rocket motor assembly includes a chamber configured to contain a propellant and a movable thrust nozzle coupled to the chamber. The movable thrust nozzle includes a phenolic composite material between and bonded to each of a metal end ring and a flexible bearing core. Methods of forming a flexible bearing assembly include bonding a phenolic composite material to at least one metal end ring and bonding a flexible bearing core to the phenolic composite material. The flexible bearing core includes a plurality of layers of a resilient material between layers of a reinforcement material.
Curing a heat-curable material in an embedded curing zone
The present disclosure relates to a method for curing a heat-curable material (1) in an embedded curing zone (2) and an assembly resulting from such method. The method comprises providing a heat-conducting strip (3) partially arranged between a component (9) and a substrate (10) that form the embedded curing zone (2) therein between. The heat-conducting strip (3) extends from the embedded curing zone (2) to a radiation-accessible zone (7) that is distanced from the embedded curing zone (2) and at least partially free of the component (9) and the substrate (10). The method further comprises irradiating the heat-conducting strip (3) in the radiation-accessible zone (7) by means of electromagnetic radiation (6). Heat (4a) generated by absorption of the electromagnetic radiation (6) in the heat-conducting strip (3) is conducted from the radiation-accessible zone (7) along a length of the heat-conducting strip (3) to the embedded curing zone (2) to cure the heat-curable material (1) by conducted heat (4b) emanating from the heat-conducting strip (3) into the embedded curing zone (2).
WELDING METHOD
A method for welding a first hose end at a joint with a second hose end in a seam that extends on a circumference of the first hose end, the method comprising the steps: applying a protective layer at the joint to an inside of the first hose end; pushing the second hose end beyond the joint over the first hose end; pressing the first hose end and the second hose end together flat at the joint between two first damping jaws that are moved towards each other; welding the first hose end and the second hose end together by two first partial seams while pressed together, wherein the protective layer prevents a welding of the inside of the first hose end; releasing the first hose end and the second hose end from the two first clamping jaws after welding the two first partial seams.
Watercraft with shape chamber
An additional chamber to watercraft that adds both volume and curvature to other compartments or components of the watercraft that are essentially flat is described. The additional chamber provides for modular construction of watercraft for creating volumetric space as well as a curved surface to the outer portion of the watercraft. The chamber advantageously increases the aesthetic appeal of the watercraft as well as provides a surface on which water is discouraged from pooling or collecting on. Various watercrafts having such a chamber are also described.
Surfacing Device Tether End Component
The present invention relates to, in a first aspect, a surfing tether end component comprising an end component body having one or more end component body layers, a tether connector for connecting the surfing tether end component to a surfing device tether, and a fastening means. A second and third aspect, comprising methods of forming a surfing tether end component, are also provided.
ELECTRIC HEATING PAD WITH ELECTROSURGICAL GROUNDING
An electric heating pad with electrosurgical grounding comprising a heated underbody support, heated mattress or heated mattress overlay. In an illustrative embodiment the heating pad with electrosurgical grounding may include a flexible sheet-like heating element including an upper edge, a lower edge, and at least two side edges and a flexible sheet-like grounding electrode including an upper edge, a lower edge, and at least two side edges. A shell covering the heating element and grounding electrode and comprising at least two sheets (e.g., may be one sheet of material folded over to form two sheets) of flexible material, and a weld coupling the two sheets of flexible material together about the edges of the heating element and grounding electrode, wherein the weld is one of a RF weld, ultrasonic weld, or a heat bond, wherein the two sheets comprise PVC or urethane.
Molded article and method for production thereof
Disclosed is a molded article including a modified fibroin and a water resistance-imparting material. The modified fibroin and the water resistance-imparting material may be covalently bonded.