A fencing material includes a border material including a first polymer and having an interior surface; and a mesh material having a front and a back, a portion of at least one of the front and the back being bonded to the interior surface of the border material.

A method for surface preparation of a composite substrate prior to adhesive bonding. The surface preparation method includes applying a resin-containing peel ply onto a composite substrate, followed by co-curing. The resin-containing peel ply contains a non-removable textile carrier and a removable woven fabric embedded therein. After co-curing, the peel ply is removed from the composite substrate such that the removable woven fabric is removed but the non-removable textile carrier and a film of residual resin remain on the composite substrate, thereby creating a modified, bondable surface on the composite substrate. The composite substrate with the modified surface can be bonded to another composite substrate, whereby the textile carrier remains an integrated part of the final bonded structure.

A method of activating a surface of a plastics substrate formed from: (a) polyaryletherketone such as polyether ether ketone (PEEK) polyether ketone ketone (PEKK), polyether ketone (PEK); polyether ether ketone ketone (PEEKK); or polyether ketone ether ketone ketone (PEKEKK); (b) a polymer containing a phenyl group directly attached to a carbonyl group, for example polybutadiene terephthalate (PBT) optionally wherein the carbonyl group is part of an amide group, such as polyarylamide (PARA); (c) polyphenylene sulfide (PPS); or (d) polyetherimide (PEI); for subsequent bonding,
the method comprising the step of exposing the surface to actinic radiation wherein the actinic radiation: includes radiation with wavelength in the range from about 10 nm to about 1000 nm; the energy of the actinic radiation to which the surface is exposed is in the range from about 0.5 J/cm.sup.2 to about 300 J/cm.sup.2.

Hard to bond substrates are then more easily subsequently bonded for example using acrylic, epoxy or anaerobic adhesive.

An object of the present invention is to provide a thin volume hologram sheet to be embedded sufficiently resistant to a mechanical stress such as a stress including a tensile stress, a shear stress and a compression stress at the time of processing even under a heating condition, a forgery prevention paper and a card using the same. The object is achieved by providing a volume hologram sheet to be embedded comprising a volume hologram layer, and a substrate disposed only on one side surface of the volume hologram layer using an adhesion means, wherein a peeling strength of the volume hologram layer and the substrate is 25 gf/25 mm or more.

The disclosure presents a wind turbine blade and a method of manufacturing a wind turbine blade, wherein the wind turbine blade is manufactured as a composite structure comprising a reinforcement material embedded in a polymer matrix, the method comprising: providing a first blade mould with a first blade shell part having a leading edge, a trailing edge, and a first leading edge glue surface at the leading edge, the first blade mould comprising a first leading edge flange; providing a second blade mould with a second blade shell part having a leading edge, a trailing edge, and a second leading edge glue surface at the leading edge, the second blade mould comprising a second leading edge flange; applying glue to a leading edge glue surface; providing one or more leading edge spacer elements at a leading edge flange; arranging the second blade mould on the first blade mould, such that the one or more leading edge spacer elements are arranged between the first leading edge flange and the second leading edge flange; applying a pressure to the second blade shell part; and curing the glue.

Aspects of the present disclosure generally describe polyarylether ketones and methods of use. In some aspects, a composition includes one or more polymers of formula (IV): ##STR00001##

A foam assembly system is provided. The system is configured to heat a surface of foam. After the heating of the foam, an adhesive is applied, typically a high solids adhesive. The foam is then bonded to another foam surface. It has been found that the pre-heating of the foam before adhesive application greatly enhances the bond strength between the foam and the second foam surface to which it is adhered.

A method for manufacturing a multilayer member that provides excellent adhesiveness without using a primer. An embodiment of the present invention provides a method for manufacturing a multilayer member including a first member containing a crystalline thermoplastic resin, an adhesion layer, and a second member in this order, the method including a surface treatment step of performing dry treatment on a surface of the first member containing a crystalline thermoplastic resin, satisfying the following condition A, an adhesive application step of forming an adhesive layer in a surface subjected to the dry treatment of the first member by applying an adhesive to the surface subjected to the dry treatment of the first member without interposing a primer composition, and an adhering step of making the second member adhere onto the adhesive layer.

A method of activating a surface of a plastics substrate formed from: (a) polyaryletherketone such as polyether ether ketone (PEEK) polyether ketone ketone (PEKK), polyether ketone (PEK); polyether ether ketone ketone (PEEKK); or polyether ketone ether ketone ketone (PEKEKK); (b) a polymer containing a phenyl group directly attached to a carbonyl group, for example polybutadiene terephthalate (PBT) optionally wherein the carbonyl group is part of an amide group, such as polyarylamide (PARA); (c) polyphenylene sulfide (PPS); or (d) polyetherimide (PEI); for subsequent bonding, the method comprising the step of exposing the surface to actinic radiation wherein the actinic radiation: includes radiation with wavelength in the range from about 10 nm to about 1000 nm; the energy of the actinic radiation to which the surface is exposed is in the range from about 0.5 J/cm.sup.2 to about 300 J/cm.sup.2.

Hard to bond substrates are then more easily subsequently bonded for example using acrylic, epoxy or anaerobic adhesive.

A method for connecting at least two structural parts of an orthopedic component, wherein the structural parts are retained in an orienting device while oriented in relation to each other, and an intermediate space thus being formed between the structural parts. The orienting device and the structural parts together form a cavity, which has a flow connection to at least one feed connection, via which an adhesive for adhesively bonding the structural parts is introduced into the cavity.