B29C65/483

System and method for handling a component

A system for handling a first component includes: a main-device and a module-device, the module-device having a pressing section arranged to form an outer surface of the module-device, the module-device configured to releasably receive the first component, such that a connection section of the first component is attachable to the pressing section of the module-device. The module-device is releasably connected to a second component, wherein the main-device includes a grabbing unit adapted for releasably connecting the module-device, such that the pressing section is arranged to form a first outer surface section of the main-device, and wherein the main-device includes a connector for connecting to a handling-unit for arranging the main-device at the second component, such that the connection section of the first component, if attached to the pressing section of the module-device, is at least indirectly attachable to a front surface of the second component.

ACTIVATING SURFACES FOR SUBSEQUENT BONDING
20200239655 · 2020-07-30 ·

A method of activating a surface of a plastics substrate formed from: (a) polyaryletherketone such as polyether ether ketone (PEEK) polyether ketone ketone (PEKK), polyether ketone (PEK); polyether ether ketone ketone (PEEKK); or polyether ketone ether ketone ketone (PEKEKK); (b) a polymer containing a phenyl group directly attached to a carbonyl group, optionally wherein the carbonyl group is part of an amide group, such as polyarylamide (PARA); (c) polyphenylene sulfide (PPS); or (d) polyetherimide (PEI); for subsequent bonding, the method comprising the step of exposing the surface to actinic radiation wherein the actinic radiation: includes radiation with wavelength in the range from about 10 nm to about 1000 nm; the energy of the actinic radiation to which the surface is exposed is in the range from about 0.5 J/cm.sup.2 to about 300 J/cm.sup.2.

Hard to bond substrates are then more easily subsequently bonded for example using acrylic, epoxy or anaerobic adhesive.

METHOD FOR PRODUCING A MICROCHANNEL BUNDLE HEAT EXCHANGER
20200238450 · 2020-07-30 ·

A method for producing a microchannel bundle heat exchanger (1) includes providing a multiplicity of tubular microchannels (2); incorporating the microchannels (2) in a weaving device; interweaving the tubular microchannels (2) with a plurality of warp wires (3) in the weaving device, and generating at least one heat exchanger mat (4) from the tubular microchannels (2) which are connected to one another by means of the warp wires (3); shaping at least one heat exchanger pack (8) from the at least one heat exchanger mat (4), in particular by folding and/or rolling up the heat exchanger mat (4); and adhesively bonding the tubular microchannels (2) at two mutually opposite end sides (9, 10) of the heat exchanger pack (8).

METHOD FOR CONNECTING AT LEAST TWO STRUCTURAL PARTS OF AN ORTHOPEDIC COMPONENT AND ORTHOPEDIC COMPONENT HAVING AT LEAST TWO STRUCTURAL PARTS

A method for connecting at least two structural parts of an orthopedic component, wherein the structural parts are retained in an orienting device while oriented in relation to each other, and an intermediate space thus being formed between the structural parts. The orienting device and the structural parts together form a cavity, which has a flow connection to at least one feed connection, via which an adhesive for adhesively bonding the structural parts is introduced into the cavity.

Selectively activated frangible bonding system

An intentionally activated frangible bonding system comprises a frangible adhesive, adhesive primer, composite material matrix, and/or the like, having a polydispersion of at least one additive spread throughout the frangible bonding material. The additive degrades a bond provided by the frangible bonding material, upon application of a specific energy to the frangible bonding material. An energy emitter is configured to selectively direct the specific energy toward a structure or assembly comprising components bonded by the frangible bonding material to degrade the frangible bonding material bonding the components for disassembly.

COMPOSITE MATERIAL WITH ADHESION PROMOTER LAYER BASED ON SI, C AND O

A composite material includes: a substrate and a polymer layer which are interconnected by an adhesion promoter layer. The adhesion promoter layer is obtainable by plasma-enhanced chemical vapor deposition (PE-CVD) at least partially using a mixture of precursor compounds containing an unsaturated hydrocarbon and an organosilicon compound. In an embodiment, the substrate includes a metal substrate or a polymer substrate.

Hydrophilic AIOL with bonding

An accommodating intraocular lens comprises a first lens component, a second lens component, and an adhesive between portions of the two lens components. The cured adhesive bonds the lens components to form a fluid chamber. The lens components are bonded to one another along a seam which extends circumferentially along at least a portion of the lens components. The lens components may comprise the same polymer material. The cured adhesive also comprises the polymer or a prepolymer of the polymer to provide increased strength. The polymer is hydratable such that the lens components and the cured adhesive therebetween can swell together to inhibit stresses between the lens components and the cured adhesive.

Rotor blade mold assembly and method for forming rotor blade

Methods for forming rotor blades, rotor blade mold assemblies, and cores for rotor blade mold assemblies are disclosed. A method includes providing a first shell substrate on a first mold, providing a generally hollow core on the first shell substrate, providing a second shell substrate on the generally hollow core, and providing a second mold on the second shell substrate. The method further includes flowing a resin into a mold interior defined between the first mold and the second mold.

Foam heating system

A foam assembly system is provided. The system is configured to heat a surface of foam. After the heating of the foam, an adhesive is applied, typically a high solids adhesive. The foam is then bonded to another foam surface. It has been found that the pre-heating of the foam before adhesive application greatly enhances the bond strength between the foam and the second foam surface to which it is adhered.

COMPONENT MOUNTING ON STORAGE TANKS
20200189209 · 2020-06-18 ·

A tank (e.g., an underground storage tank), and manufacturing methods therefore, may include a tank body having an exterior surface. A component is mounted on at least a non-planar portion of the exterior surface of the tank body using an adhesive (e.g., an MMA adhesive). For example, the component may be positioned on the non-planar portion of the exterior surface of the tank body after application of adhesive and pressure may be applied to maintain the position of the component on the non-planar portion of the exterior surface of the tank body as the adhesive is cured. The pressure may be removed upon curing of the adhesive and formation of a structural bond may occur at the adhesive interface between the mounting surface of the component and the non-planar portion of the exterior surface of the tank body.