Aspects of the disclosure relate to techniques for manufacturing a balloon envelope including a duct for high altitude balloons. In one example, a first sheet of material may be provided. A premade duct may be arranged at least partially on the first sheet of material. The duct may include a first substance on an internal surface. A second sheet of material may be arranged over at least a portion of the duct. A heat sealing device may be applied to the second sheet of material to heat seal the first sheet of material to the second sheet of material. The heat sealing device may be applied over at least a portion of the duct in order to seal external surfaces of the duct to each of the first and second sheets of material and form a balloon gore. The first substance may keep the duct from being sealed to itself.

Aspects of the disclosure relate to manufacturing a balloon envelope for use in a stratospheric balloon system. For instance, a stream of polyethylene mixture is extruded through an extruder in order to orient molecules of polymer chains of polyethylene and to provide an oriented film. The oriented film is passed through an electron beam and thereby crosslinking the polymer chains to provide a cross-linked film. The cross-linked film is heat sealed to form the balloon envelope.

An assembly for manufacturing a balloon envelope includes a table component and a sealing component. The table component may include a first platform, a second platform, a third platform, and a lateral opening between the first and second platforms. The first and second platforms can receive a first sheet of material that forms a first gore of the balloon envelope and a second sheet of material that forms a second gore of the balloon envelope. At least a portion of the first platform may move relative to the third platform so as to allow for the tendon and the portion of the second sheet attached to the tendon to move toward the third platform. The sealing component may be configured to bond the first sheet to the second sheet in order to join the first and the second gores of the balloon envelope.

Aspects of the disclosure relate to manufacturing balloon envelopes for use in high-altitude mesh networks for packet-data communications. As an example, a gore portion may be placed on a table such that the gore portion overlies a groove within the table. A tendon may be placed on the gore portion and within the groove. A portion of tubing may be placed over the tendon. The tubing may have one or more surface openings. Restraining tape is applied over the one or more surface openings in the tubing. A constant force roller is applied to secure the tendon to the gore portion and to secure the tendon to the tubing. As an alternative or in addition to the surface openings, double-sided restraining tape may be placed between the tendon and the tubing. The tubing and restraining tape may prevent undesired lateral and longitudinal movement of the tendon during deployment.

The invention relates to a stamp-sealing unit comprising a punch designed as a sonotrode (8), and a die (5), said die (5) having an opening (15) and the punch being able to be moved in and out of the opening (15) in the stamping direction. The invention also relates to an ultrasonic processing device for stamping stamped parts out of a stamping material (2) and for sealing the stamped parts to unprocessed products (21).

A device and a method for manufacturing an emblem of thermoplastic synthetic resin with an incorporated IC chip by high frequency dielectric heating without damaging the IC chip, the device including: an upper metal mold having with a fusion cutting blade; a support frame along the perimeter and upper surface of the table; a slide board on top of the table that is slidable in axial directions relative to the table; a metal plate on the upper surface of the slide board; wherein pressing the upper layer material with the mold from above and subjecting the material to high frequency dielectric heating, the IC chip is placed in an upper position of the recessed section, then the slide board is driven to slide below the mold and subsequently the heating operation is executed without any risk of applying pressure onto the IC chip.

A heat sealing machine and method form blister packages. A backing material web extends between a nesting tray assembly and a seal and cut tooling assembly and a blister tray is resident within a blister nest of the nesting tray assembly. The backing material web is clamped between a clamping gasket support shoulder of the nesting tray assembly and a clamping shoulder of the seal and cut tooling assembly, and between a sealing gasket support shoulder of the nesting tray assembly and a heat seal shoulder of a heater assembly. A knife of the seal and cut tooling assembly extends between the clamping gasket support shoulder and the sealing gasket support shoulder to cut a backing sheet from the backing material web that is heat sealed to an attachment surface of the blister tray to form the blister package.

In an example embodiment, a doser assembly includes a hopper assembly configured to receive plant material, a bracket assembly connected to the hopper assembly, and a roller in a hopper opening defined by the hopper assembly extending through the hopper assembly. An interior surface of the hopper assembly may define the hopper opening. The bracket assembly may include a shaft extending across a portion of the hopper opening. The roller may be in the portion of the hopper opening of the hopper assembly and may extend between a first part and a second part of the interior surface of the hopper assembly. The roller may be connected to the shaft and may be configured to rotate with rotation of the shaft.

A vertical form fill and seal system supports a sheet of material having material segments and a tube sized for drawing edges of the elongated sheet of material together in an overlapping configuration to form the sheet into a substantially tube shape. The VFFS also includes a sealer that seals the edges of the material to one another and a gusseting mechanism sized for forming a gusseted tuck in each of a left panel portion of the material and a right panel portion of the material. A cutting mechanism removes a first portion and a second portion of a first segment of the material segments in order to form a first cut and a second cut in the first segment and a sealing mechanism folds and seals the first segment at the first cut and at the second cut to provide an end wall with a substantially flat, rectangular-shaped footprint.

A protective guard for a hand, finger or thumb includes a first thermoplastic layer heat welded to second thermoplastic layer. The second thermoplastic layer has a thickness that is greater than the thickness of the first thermoplastic layer.