A method of making an array of vapor cells for an array of magnetometers includes providing a plurality of separate vapor cell elements, each vapor cell element including at least one vapor cell; arranging the vapor cell elements in an alignment jig to produce a selected arrangement of the vapor cells; attaching at least one alignment-maintaining film onto the vapor cell elements in the alignment jig; transferring the vapor cells elements and the at least one alignment-maintaining film from the alignment jig to a mold; injecting a bonding material into the mold and between the vapor cell elements to bond the vapor cell elements in the selected arrangement; removing the at least one alignment maintaining film from the vapor cell elements; and removing the bonded vapor cells elements in the selected arrangement from the mold to provide the array of vapor.

A method of making a modular wind turbine blade is described. The modular blade comprises first and second blade modules connected together by a scarf joint between tapered spar caps of the respective blade modules. According to the method, first and second blade modules are laid up in the same mould assembly. A separating layer is arranged between the layups of the first and second module in a joint region of the mould. The separating layer has a thickness corresponding to a required bond thickness in the scarf joint when the modules are bonded together.

Techniques and mechanisms for bonding a first wafer to a second wafer in the presence of a fluid, the viscosity of which is greater than a viscosity of air at standard ambient temperature and pressure. In an embodiment, a first surface of the first wafer is brought into close proximity to a second surface of the second wafer. The fluid is provided between the first surface and the second surface when a first region of the first surface is made to contact a second region of the second surface to form a bond. The viscosity of the fluid mitigates a rate of propagation of the bond along a wafer surface, which in turn mitigates wafer deformation and/or stress between wafers. In another embodiment, the viscosity of the fluid is changed dynamically while the bond propagates between the first surface and the second surface.

A method of arranging, in particular thermoplastic, semi-finished products by using an electronically controlled or regulated placing device for the semi-finished products. The method includes detecting at least one part of an outline of a semi-finished product to be placed, wherein the detecting is carried out by a detection device, determining a target position for the semi-finished product and/or for the placing device for placing the semi-finished product by matching the at least one part of the outline with a placing edge occurring on an underlying surface, and placing the semi-finished product by the placing device using the target position.

A joining structure includes a first member, a second member of a material different from that of the first member, and a separation mechanism provided between the first member and the second member and that separates the first member and the second member from each other, wherein a resin is filled into the space between the edge of at least one member among the first member and the second member, and the other member.

Systems and methods are provided for designing composite parts. One embodiment is a method for fabricating a composite part. The method includes receiving a design that defines a stacking sequence for a composite charge comprising plies that have different fiber orientations, defining a splice zone within the design, modifying the design by splicing plies in a manner that accommodates ply slippage when the composite charge is formed to a contour, and fabricating a composite part based on the design that was modified.

The containers are thermoformed in groups, filled, and closed. Then, the containers are separated, and placed adjacent to one another in such a manner that segments of their respective rims face each other and define between them a line of separation. On said line, at least one spot weld is formed that forms a breakable connection between the facing rim segments.

A production method for a heat insulation bag with a more regular shape and less heat transfer, the method includes preparing a bag cover, an inner bag and an outer bag; placing a heat insulation layer between the inner bag and the outer bag; and then welding the heat insulation layer, the inner bag and the outer bag together. Improvements of the present invention include the steps of first preparing an inner bag periphery before preparing the inner bag, then welding an inner bag top sheet, welding an inner bag enclosure, cutting off the middle portion of the inner bag top sheet, and then welding a bottom surface of the inner bag, thereby forming an inner bag platform in the inner bag. Thus, heat transfer between the bag cover and the bag body after the production of the heat insulation bag is reduced and the heat insulation effect is improved.

A method for connecting plastic profile parts (2) brings into contact at least one profile part (2) and a heating surface (34) of a heating, element (36) so that the profile part (2) begins to melt in its welding area before it is joined together with the other profile part (2). A delimiting element (7) regulates the flow and deformation of the melt material. The delimiting element (7) has at least one contact element (21) and a molded part (22), which are movable both in relation to one another and in relation to the profile part (2). During the melting of the at least one profile part (2), the contact element (21) is movedtogether with the molded part (22)relative to the at least one profile part (2) and relative to the heating element (36) out of, a resting position in the direction of a working position, whereby at least the molded part (22) is kept in contact with the heating surface (34) and the contact element element (21) is, kept in contact with a profile surface (9). When a changeover is made from melting to compressing, the relatively movable contact element (21) is moved together with the molded part (22) in the direction of its working position so that the delimiting element (7) projects beyond a free front edge (4) of the at least one profile part (2) and creates a holding plane (37).

A microfluidic circuit element comprising a microfluidic main channel and nano interstices is disclosed. The nano interstices are formed at both sides of the main channel and are in fluid communication with the main channel. The nano interstices have a height less than that of the main channel, gives more driving force of the microfluidic channel and provides stable flow of a fluid. The microfluidic circuit element may be made from a plastic material having a contact angle of 90 degrees or less. The microfluidic circuit element is particularly useful when filling a liquid sample to the channel which is empty or filled with air and shows greatly improved a storage stability.