In an embodiment a transfer tool includes an adhesive stamp having an adhesive surface configured to pick up a semiconductor chip and a device configured to adjust a surface area of the adhesive surface, wherein the adhesive stamp is deformable, wherein the adhesive surface is formed by a part of an outer surface of the adhesive stamp, wherein the surface area of the adhesive surface is adjustable by deformation of the adhesive stamp, and wherein the adhesive surface is free of interruptions.

3-D printers include an intermediate transfer surface that transfers a layer of material to a platen each time the platen contacts the intermediate transfer surface to successively form a freestanding stack of layers of the material on the platen. A sensor detects the thickness of the layer on the platen after a fusing station fuses the layer. A feedback loop is electrically connected to the sensor and a development station (that includes a photoreceptor, a charging station providing a static charge to the photoreceptor, a laser device exposing the photoreceptor, and a development device supplying the material to the photoreceptor). The exposure device adjusts the intensity of light exposed on the photoreceptor, based on a layer thickness measurement from the sensor through the feedback loop, to control the thickness of subsequent ones of the layers transferred from the intermediate transfer surface to the freestanding stack on the platen.

An electrostatic tacking membrane assembly includes a membrane made of an elastic material, a plurality of electrostatic pads disposed on the membrane, one or more tacking elements disposed on the membrane, and a plurality of electrical leads disposed within or on the membrane and connected with the electrostatic pads and the one or more tacking elements. The electrostatic tacking membrane assembly may be positioned with the tacking elements disposed near or in contact with an overlapped or abutted area of two or more layers of material, and the tacking elements may be electrified and heated so as to bond together the two or more layers proximate the overlapped or abutted area.

A device for producing a packaged electrode having an electrode sandwiched between a pair of separators includes: a conveyance unit configured to sequentially overlay the electrode and the pair of separators from a front end side in a conveying direction while conveying the electrode and the pair of separators; a joining unit configured to join lateral edges of the pair of separators together, the lateral edges being positioned in a direction intersecting the conveying direction; and a controller configured to control operations of the conveyance unit and the joining unit. The controller is configured to repeatedly perform joining a plurality of times from the front end side in the conveying direction, each of the joining being performed while moving the joining unit so that a speed of the joining unit relative to a conveyance speed of a workpiece approaches zero.

A laminating device includes: a plurality of laminating heads that each holds a unit laminated body; a drum section in which the plurality of laminating heads are arranged, which holds each laminating head swingably via a support shaft, and which rotates to advance each laminating head to a laminating position facing a lamination stage; a cam section which is in contact with each laminating head and which causes each laminating head to swing around the support shaft in association with a movement of each laminating head caused by a rotation of the drum section; and a biasing member that biases each laminating head in a radial direction of the drum section.