Patent classifications
B29C65/8223
Bonding Apparatus and Method
The present disclosure relates to methods and apparatuses for mechanically bonding substrates together. The apparatuses may include a pattern roll having three or more pattern elements protruding radially outward, wherein each pattern element includes a pattern surface. The pattern surfaces are also separated from each other by gaps having minimum widths. The pattern roll may be adjacent an anvil roll to define a nip between the pattern surfaces and the anvil roll, wherein the pattern roll is biased toward the anvil roll to define a nip pressure between pattern surfaces and the anvil roll. As substrates advance between the pattern roll and anvil roll, the substrates are compressed between the anvil roll and the pattern surfaces to form a discrete bond region between the substrates. During the bonding process, some of yielded substrate material also flows from under the pattern surfaces and into the gaps to form gap grommet regions.
Method of production of fabric bags or containers using heat fused seams
A method of producing flexible polypropylene fabric bags with heat fused seams comprising providing fabric pieces, wherein each fabric piece has a coated side and an uncoated side; positioning fabric pieces so that a coated side of one fabric piece faces a coated side of another fabric piece; selecting an area of fabric to be joined for forming a seam or joint; applying heat to the area to be joined that is less than the melting point of the fabrics, for forming one or more seams or joints and wherein the heat fused seams or joints of a resulting polypropylene bag retains at least 85% of the fabric strength without using sewing machines.
Peel ply, method of surface preparation and bonding composite structures using the same
A resin-rich peel ply that does not leave behind residual fibers after peeling and can work well with different resin-based composite substrates. The resin-rich peel ply is composed of a woven fabric impregnated with a resin matrix different from the resin matrix of the composite substrate. The peel ply is designed such that, upon manual removal of the peel ply from the composite substrate's surface, a thin film of the peel ply resin remains on the composite substrate's surface to create a bondable surface capable of bonding with another composite substrate, but no fibrous material from the woven fabric remains on the same surface.
Device for the manufacture of sporting goods
Described are methods for the manufacture of sporting goods, in particular a shoe, sporting goods manufactured by such methods, for example a shoe, as well as a device for performing such methods. The method for the manufacture of sporting goods, in particular a shoe, is provided, wherein the sporting goods has a first component with a first connection surface and a second component with a second connection surface. The method includes activating at least one portion of the first connection surface by providing heat energy without contact, and connecting the first component with the second component by joining the first connection surface and the second connection surface.
FLEXIBLE CONTAINERS AND RELATED METHODS
A flexible container incorporating flexible front and rear sheets with a perimeter seal in which at least one length or section of the perimeter seal can include a seal weld that has both a permanent seal section and a pressure absorbing seal section. The pressure absorbing seal section is configured to peel, fail, or split when the flexible container, filled with a solution or liquid, is dropped onto a hard surface to thereby absorb the impact of the drop. The flexible container can be provided with one or more dispensing and/or additive ports or without any port. The flexible container may include more than one compartments with a peelable seal separating two adjoining compartments of the flexible container.
Bonding apparatus and method
The present disclosure relates to methods and apparatuses for mechanically bonding substrates together. The apparatuses may include a pattern roll having three or more pattern elements protruding radially outward, wherein each pattern element includes a pattern surface. The pattern surfaces are also separated from each other by gaps having minimum widths. The pattern roll may be adjacent an anvil roll to define a nip between the pattern surfaces and the anvil roll, wherein the pattern roll is biased toward the anvil roll to define a nip pressure between pattern surfaces and the anvil roll. As substrates advance between the pattern roll and anvil roll, the substrates are compressed between the anvil roll and the pattern surfaces to form a discrete bond region between the substrates. During the bonding process, some of yielded substrate material also flows from under the pattern surfaces and into the gaps to form gap grommet regions.
Bonding Apparatus and Method
The present disclosure relates to methods and apparatuses for mechanically bonding substrates together. The apparatuses may include a pattern roll including a pattern element protruding radially outward. The pattern element includes a pattern surface and includes one or more channels adjacent the pattern surface. The pattern roll may be positioned adjacent an anvil roll to define a nip between the pattern surface and the anvil roll, wherein the pattern roll is biased toward the anvil roll to define a nip pressure between pattern surface and the anvil roll. As substrates advance between the pattern roll and anvil roll, the substrates are compressed between the anvil roll and the pattern surface to form a discrete bond region between the first and second substrates. As such, during the bonding process, some yielded substrate material flows from under the pattern surface and into the channel to form a channel grommet region.
MULTILAYER FLUIDIC DEVICES AND METHODS FOR THEIR FABRICATION
A fluidic device including an inorganic solid support attached to an organic solid support by a bonding layer, wherein the inorganic solid support has a rigid structure and wherein the bonding layer includes a material that absorbs radiation at a wavelength that is transmitted by the inorganic solid support or the organic solid support; and a channel formed by the inorganic solid support and the organic solid support, wherein the bonding layer that attaches the inorganic solid support to the organic solid support provides a seal against liquid flow. Methods for making fluidic devices, such as this, are also provided.
Bonding apparatus and method
The present disclosure relates to methods and apparatuses for mechanically bonding substrates together. The apparatuses may include a pattern roll including a pattern element protruding radially outward. The pattern element includes a pattern surface and includes one or more channels adjacent the pattern surface. The pattern roll may be positioned adjacent an anvil roll to define a nip between the pattern surface and the anvil roll, wherein the pattern roll is biased toward the anvil roll to define a nip pressure between pattern surface and the anvil roll. As substrates advance between the pattern roll and anvil roll, the substrates are compressed between the anvil roll and the pattern surface to form a discrete bond region between the first and second substrates. As such, during the bonding process, some yielded substrate material flows from under the pattern surface and into the channel to form a channel grommet region.
MULTILAYER FLUIDIC DEVICES AND METHODS FOR THEIR FABRICATION
A fluidic device including an inorganic solid support attached to an organic solid support by a bonding layer, wherein the inorganic solid support has a rigid structure and wherein the bonding layer includes a material that absorbs radiation at a wavelength that is transmitted by the inorganic solid support or the organic solid support; and a channel formed by the inorganic solid support and the organic solid support, wherein the bonding layer that attaches the inorganic solid support to the organic solid support provides a seal against liquid flow. Methods for making fluidic devices, such as this, are also provided.