A composite structure is fabricated using a preform comprising a stack of unidirectional prepreg plies that are stitched together. During curing of the prepreg, the stitches melt and dissolve.

Provided are circuit board excellent in interlayer adhesion and solder heat resistance, and production method thereof. The circuit board is produced by a method including: preparing a plurality of at least one kind of thermoplastic liquid crystal polymer (TLCP) films, forming a conductor layer on one side or both sides of a film in at least one of the films to obtain a unit circuit board, laminating the films containing the unit circuit board to obtain a stacked material, conducting thermo-compression-bonding of the stacked material under pressurization to a first temperature giving an interlayer adhesion to integrate the stacked material, carrying out structure-controlling thermal treatment by heating the integrated stacked material at a second temperature which is lower than the first temperature and is lower than a melting point of a TLCP having a lowest melting point out of the plurality of TLCP films.

Disclosed are a method for producing a laminate including a step of laminating a resin impregnated fiber reinforced composition layer on a metal member, wherein the method includes a step of forming a resin coating on the metal member and a step of laminating a resin impregnated fiber reinforced composition layer containing a resin impregnated fiber reinforced composition containing (I) 20 to 80% by mass of a polymer having a melting point and/or a glass transition temperature of 50 to 300° C., and (C) 20 to 80% by mass of a reinforcing fiber
(provided that the sum of the component (I) and the component (C) is taken as 100% by mass) via the above resin coating; and a laminate obtained by the method.

A method for manufacturing a metal-resin joint 30 according to the present disclosure is a method for manufacturing the metal-resin joint 30 in which a synthetic resin member 10 made of thermoplastic resin and a metal member 20 made of metal are bonded to each other, the method including: a first process of exposing a surface 12 of the synthetic resin member 10 molded into a predetermined shape, to air heated to a first temperature T1 equal to or higher than a deflection temperature under load Tf of the thermoplastic resin when a load of 1.8 MPa is applied; and a second process of bonding the surface 12 of the synthetic resin member 10 and a surface 22 of the metal member 20 to each other. Accordingly, it is possible to improve the bonding strength between the metal member 20 and the synthetic resin member 10.

An internal tensioning structure for use in an inflatable product fulfills the basic function of maintaining two adjacent inflatable surfaces in a desired geometric arrangement when the inflatable product is pressurized. The tensioning structure is formed by connecting a pair of plastic strips sheets via spaced-apart strands, such as strings or wires. When pulled taut, the strands provide a high tensile strength between the two opposed plastic strips. At the same time, the plastic strips facilitate a strong, long-lasting weld between the tensioning structure and the inflatable product.

A composite material formed by combining a polyurethane material with an unclickable foam layer and a scrim layer through roll and flat form technology. The composite material is embossed to form pillowlike chambers or cells delineated by a network of emboss pattern lines formed by the bonding between these layers.

The invention first relates to a method for welding at least two parts comprising a thermoplastic material and having respective surfaces to be welded, comprising: inserting an insert between the surfaces to be welded of the two parts; generating heat via said insert; wherein the insert moves in relation to the parts to be welded in a welding direction. The invention also relates to an installation adapted for implementation of this method.

A floor may include a substrate having a top side and a bottom side. A top layer may be provided on the substrate. The top layer may consist of a printed thermoplastic film and a thermoplastic transparent or translucent layer provided on the printed thermoplastic film. The top layer may be directly adhered to the substrate by heat welding the printed thermoplastic film and the top side of the substrate, in the absence of a glue layer. The substrate may be a synthetic material board including a filler. The substrate at least at two opposite edges may include coupling means provided in the synthetic material board. The thermoplastic transparent or translucent layer may be provided with a structure.

A method of adhesively bonding a first substrate on a second substrate in an adhesive bonding zone by an adhesive joint integrating a support mesh, wherein surplus adhesive joint is folded over onto one or the other of the first or second substrates so that the support mesh is present over the entire adhesively bonded zone after curing.

The present application relates to an electronic wetness-sensing absorbent article and related methods. The electronic wetness-sensing absorbent article includes a flexible waterproof thin film; at least two mutually separated and insulated flexible electrodes disposed on one surface of the flexible waterproof thin film; a water-permeable braided fabric layer; and an absorbent layer disposed on the other surface of the flexible waterproof thin film, located between the flexible waterproof thin film and the water-permeable braided fabric layer, and adapted to absorb a liquid entering from the water-permeable braided fabric layer. The flexible waterproof thin film, the flexible electrodes, and the liquid contained in the absorbent layer form a non-polar variable electrolytic capacitor. The wetness state of the electronic wetness-sensing absorbent article is obtained by detecting the capacitance value of the variable electrolytic capacitor and change thereof.