A resin composition for laser welding contains: relative to 100 mass parts of (A) a thermoplastic polyester resin material that contains a polybutylene terephthalate homopolymer and at least one of a polybutylene terephthalate copolymer, a polyethylene terephthalate resin, and a polycarbonate resin, 0.0005 to 0.5 mass parts of (B) nigrosine; and 0.01 to 2 mass parts of (C) a colorant containing at least an anthraquinone dye C1 having a maximum absorption wavelength in a range of 590 to 635 nm, a perinone dye C2 having a maximum absorption wavelength in a range of 460 to 480 nm, and an anthraquinone dye C3 having a maximum absorption wavelength in a range of 435 to 455 nm, at C1: C2:C3=24 to 41:24 to 39:22 to 46 as the mass ratio relative to 100 mass parts for a total of C1, C2, and C3.

Encrypted markers that are not readily detectable can be revealed by treatment with a specific reagent used as a developer to reveal a readily detectable physical property of the marker, such as a characteristic fluorescence emission after excitation with a particular excitation wavelength, or to reveal a visible color. The encrypted marker can be developed in situ, or a sample can be removed by brushing, scraping, swabbing or scratching the marked object or item and developing the encrypted marker or a sample thereof with the appropriate developer to reveal an overt marker or optical signal. The encrypted marker may include a DNA taggant.

Encrypted markers that are not readily detectable can be revealed by treatment with a specific reagent used as a developer to reveal a readily detectable physical property of the marker, such as a characteristic fluorescence emission after excitation with a particular excitation wavelength, or to reveal a visible color. The encrypted marker can be developed in situ, or a sample can be removed by brushing, scraping, swabbing or scratching the marked object or item and developing the encrypted marker or a sample thereof with the appropriate developer to reveal an overt marker or optical signal. The marker can be revealed by exposure of the encrypted marker or a sample thereof to the developer in any suitable form, such as a solution, a slurry, a swab, a solid (such as in granular form), or a gas or a vapor that includes a developer.

An infrared apparatus includes a case, and an infrared device to input and/or output infrared rays. In the infrared apparatus in which the infrared device is received in the case, the case has an infrared transmitting window part which transmits only infrared light and which does not transmit visible light. Of a light transmitting resin through which near-infrared laser used for near-infrared laser welding passes and a light absorbing resin which emits heat and melts when receiving the near-infrared laser, the infrared transmitting window part is made of the light transmitting resin.

A method of illumating an item is disclosed. The method includes applying adhesive to the item, interspersing a taggant in the adhesive, illuminating the item with an excitation signal, sensing luminescence emitted by the taggant in response to illumination by the excitation signal, and determining the authenticity of the item based on the sensed emitted luminescence. The item can include any item benefited by authentication, and can include a postage stamp. A method of customizing an item is disclosed. This can include the steps of preparing a substrate, applying a security feature to the substrate, printing non-customized information on the substrate, receiving image information, and printing the image information on the substrate.

An object of the present invention is to provide a thin volume hologram sheet to be embedded sufficiently resistant to a mechanical stress such as a stress including a tensile stress, a shear stress and a compression stress at the time of processing even under a heating condition, a forgery prevention paper and a card using the same. The object is achieved by providing a volume hologram sheet to be embedded comprising a volume hologram layer, and a substrate disposed only on one side surface of the volume hologram layer using an adhesion means, wherein a peeling strength of the volume hologram layer and the substrate is 25 gf/25 mm or more.

A manufacturing apparatus of a display device includes a first jig configured to hold a first member; a second jig located under the first jig and coupled to or separated from the first jig such that the first member is locatable between the first jig and the second jig; fixing parts located at both ends of the second jig and configured to hold a second member between the first member and the second jig, the second jig including a pad; and a stage located under the pad and provided with a groove formed therethrough and having an area smaller than an area of the pad when viewed in a plan view, wherein one portion of the pad, which faces the stage, is configured to be within the groove.

A method of sealing a container and a lid by melt adhesion by laser. Either the container or the lid has a thermoplastic resin that permits the laser beam to transmit through and the other one has a resin composition of the thermoplastic resin containing a heat-generating substance. Further, the laser beam applies a rectangular beam having a uniform intensity distribution. The upper-limit of temperature is not lower than a melting point of the thermoplastic resin but lower than a thermal decomposition start temperature thereof in the melt adhesion interface between the container and the lid, and the temperature reaches the upper-limit in a heating time t (msec) represented by the following formula (1),
t (msec)=L/S(1)
where L is the length (mm) of the rectangular beam in the scanning direction, and S is the rate of laser scanning (mm/msec) of not higher than 1.65 mm/msec.

A resin molded product is configured by bonding a first resin member and a second resin member by radiation of a laser light. The first resin member has a laser light permeability to be permeable to the laser light, and the second resin member has a laser light absorbing property to absorb the laser light. The resin molded product includes a protrusion portion and a recess portion. The protrusion portion is provided in the second resin member, the protrusion portion bonded to the first resin member by melting of the protrusion portion via the radiation of the laser light. The recess portion is provided in the first or second resin member so as to be located on both sides of the protrusion portion, the recess portion accommodating at least a part of the protrusion portion melted by the radiation of the laser light.