A method of bonding materials may comprise defining a bond interface between two materials in a cure zone on a surface of an object, and non-conductively heating the bond interface without directly heating the surface outside of the cure zone. Non-conductively heating the bond interface may involve applying microwave radiation to the bond interface.

The machine (1) comprises at least one main welding device (3) of a first profiled element (4) and a second profiled element (5) which extend along their respective longitudinal directions and are each provided with at least one extremal area to be welded (6), the main welding device (3) comprising: main retaining means (18, 19) of the profiled elements (4, 5); main heating means (20) adapted to heat the extremal areas to be welded (6); main displacement means (21) of the main retaining means (18, 19) adapted to displace the profiled elements (4, 5) between a mutual spacing away position and a mutual approaching position;
wherein the main heating means (20) comprise two heating plates (27), each of which can be placed in contact with a respective extremal area to be welded (6) and arranged substantially parallel to each other at a predefined distance to define a free volume (V) positioned between them.

A dual edge binder machine and operating method. The dual edge binder machine includes a heat device configured to deliver heat adjacent to an interface between an upper roller and a lower roller. The dual edge binder machine further includes at least one motor rotationally coupled to the upper roller and the lower roller, respectively.

Provided is a resin profile joining method of joining a pair of resin profiles. The method includes: holding one resin profile and another resin profile of the pair of resin profiles with a first mold and a second mold, respectively; heating the end surfaces of the pair of resin profiles in no contact with the end surfaces of the pair of resin profiles to melt the pair of resin profiles; after the heating, moving each of the first mold and the second mold relative to the pair of resin profiles in a longitudinal direction of a corresponding resin profile of the pair of resin profiles; and crimping the end surfaces of the pair of resin profiles to each other while keeping the first mold and the second mold in contact with the surfaces of the pair of resin profiles.