B29C73/12

ROBOT TAPING SYSTEM AND METHOD OF TAPING
20190070732 · 2019-03-07 ·

A robot taping system for applying a sticky tape onto of an object; the robot taping system comprising: a scanner to scan the object; a computer to generate a 3D model of the object from a scan of the object obtained by the scanner, the computer allowing a user to define a selected area and the computer generating a taping path for covering the selected area with the tape; a programmable robotic arm configured to move along a trajectory corresponding to the taping path; a taping tool attached to a free end of the robotic arm and comprising a tape holder rod to support a roll of the tape thereabout and from where the tape is dispensed; and a taping roller to contact a non-sticky side of the tape and to press the sticky side of a tape onto the selected area during movement of the robotic arm along the trajectory.

ROBOT TAPING SYSTEM AND METHOD OF TAPING
20190070732 · 2019-03-07 ·

A robot taping system for applying a sticky tape onto of an object; the robot taping system comprising: a scanner to scan the object; a computer to generate a 3D model of the object from a scan of the object obtained by the scanner, the computer allowing a user to define a selected area and the computer generating a taping path for covering the selected area with the tape; a programmable robotic arm configured to move along a trajectory corresponding to the taping path; a taping tool attached to a free end of the robotic arm and comprising a tape holder rod to support a roll of the tape thereabout and from where the tape is dispensed; and a taping roller to contact a non-sticky side of the tape and to press the sticky side of a tape onto the selected area during movement of the robotic arm along the trajectory.

Method and assembly for inspecting a partially cured repair patch prior to installation

A method and assembly are provided in order to inspect a partially cured repair patch prior to installation. For example, an assembly for inspecting a repair patch is provided that includes a partially cured repair patch comprised of a composite material. The assembly also includes an acoustic facilitation layer disposed proximate of the surface of the repair patch through which ultrasonic signals will be introduced. The assembly further includes a vacuum bag surrounding the repair patch and the acoustic facilitation layer. The acoustic facilitation layer has an acoustic impedance that is closer to the respective acoustic impedances of the repair patch and the vacuum bag than the acoustic impedance of air is to the respective acoustic impedances of the repair patch and the vacuum bag.

Method and assembly for inspecting a partially cured repair patch prior to installation

A method and assembly are provided in order to inspect a partially cured repair patch prior to installation. For example, an assembly for inspecting a repair patch is provided that includes a partially cured repair patch comprised of a composite material. The assembly also includes an acoustic facilitation layer disposed proximate of the surface of the repair patch through which ultrasonic signals will be introduced. The assembly further includes a vacuum bag surrounding the repair patch and the acoustic facilitation layer. The acoustic facilitation layer has an acoustic impedance that is closer to the respective acoustic impedances of the repair patch and the vacuum bag than the acoustic impedance of air is to the respective acoustic impedances of the repair patch and the vacuum bag.

Multipoint Temperature Profiling and Monitoring System for Composite Repair

A sensing system that will accurately monitor cold and hot spots and verify the appropriate area temperature for composite structure repair and where IR LED is being activated. Various embodiments of this invention may include: miniaturized thermocouples that can be embedded into the sensing system, distributed temperature sensing (DTS) system and software for heat modeling, and/or printed thermocouple circuits on thermo pads. The sensing system may be a grid of sensors that is either a standalone layer, such as a sheet or blanket, or integrated with any of the layers already common in composite repair, i.e. printed circuitry or over-molded circuitry. Additionally, the sensing system generates the temperature profile of a heated area during a fuselage repair and pin-points and identifies hot and cold problem areas on a complex fuselage section.

Multipoint Temperature Profiling and Monitoring System for Composite Repair

A sensing system that will accurately monitor cold and hot spots and verify the appropriate area temperature for composite structure repair and where IR LED is being activated. Various embodiments of this invention may include: miniaturized thermocouples that can be embedded into the sensing system, distributed temperature sensing (DTS) system and software for heat modeling, and/or printed thermocouple circuits on thermo pads. The sensing system may be a grid of sensors that is either a standalone layer, such as a sheet or blanket, or integrated with any of the layers already common in composite repair, i.e. printed circuitry or over-molded circuitry. Additionally, the sensing system generates the temperature profile of a heated area during a fuselage repair and pin-points and identifies hot and cold problem areas on a complex fuselage section.

System and method for thermal management guidance

The present disclosure describes one or more systems, methods, routines and/or techniques for thermal management. One or more systems, methods, routines and/or techniques may provide advice or guidance (e.g., to a repair technician) regarding how to perform a hot bond repair, for example, on an aircraft component that has been damaged. The thermal management advisor may provide advice or guidance regarding how to prepare a repair field prior to running a thermal survey. For example, thermal management advisor may recommend a particular heat blanket, a configuration of the heat blanket, placement of various temperature sensors and other preparation guidance. The thermal management advisor may provide advice or guidance regarding how to alter or manage the repair setup during a thermal survey and during the actual curing process. For example, thermal management advisor may recommend particular temperature sensors or areas of the repair field that should be insulated.

System and method for thermal management guidance

The present disclosure describes one or more systems, methods, routines and/or techniques for thermal management. One or more systems, methods, routines and/or techniques may provide advice or guidance (e.g., to a repair technician) regarding how to perform a hot bond repair, for example, on an aircraft component that has been damaged. The thermal management advisor may provide advice or guidance regarding how to prepare a repair field prior to running a thermal survey. For example, thermal management advisor may recommend a particular heat blanket, a configuration of the heat blanket, placement of various temperature sensors and other preparation guidance. The thermal management advisor may provide advice or guidance regarding how to alter or manage the repair setup during a thermal survey and during the actual curing process. For example, thermal management advisor may recommend particular temperature sensors or areas of the repair field that should be insulated.

Methods and apparatus for repairing composite materials
10213964 · 2019-02-26 · ·

A method of bonding materials may comprise defining a bond interface between two materials in a cure zone on a surface of an object and heating the bond interface with sound waves. Heating the bond interface may include applying ultrasonic sound waves to the bond interface.

Methods and apparatus for repairing composite materials
10213964 · 2019-02-26 · ·

A method of bonding materials may comprise defining a bond interface between two materials in a cure zone on a surface of an object and heating the bond interface with sound waves. Heating the bond interface may include applying ultrasonic sound waves to the bond interface.