Provided is a curable silicone composition and applications thereof. The curable silicone composition has low modulus and flexibility even at high temperature of a cured product formed therefrom, and superior stress relaxation properties, so that the cured product does not readily warp or become defective when integrally molded with a base material, and has superior demolding property (e.g. mold release) of the cured product after transfer molding. A curable silicone composition for transfer molding, where (1) the maximum torque measured from a molding temperature of room temperature through 200° C. using a moving die rheometer (MDR) is less than 50 dN-m, and (2) the loss tangent (tans) expressed by the ratio of stored torque value/lost torque value is less than 0.2.

An injection molding machine uses a native controller and a retrofit controller to effectively control its operation. The controllers may determine and/or receive information regarding the machine's maximum load capacity, and may also determine a current operational load value of the machine. The retrofit controller may cause the machine to operate at any number of combinations of settings of operational parameters which result in the machine operating at or below the maximum load value by adjusting any number of machine parameters associated with the injection molding machine based on feedback sensors measuring real-time operating conditions of the machine.

Provided is an injection molding system that uses an identification code, collectively manages the specifications and combinations of an injection molding machine and peripheral devices, and secures a suitable production state for a combination of a wide variety of specifications. An injection molding system include: an injection molding machine; a plurality of peripheral devices; an identification code attached to the injection molding machine and each of the plurality of peripheral devices, and having identification information of the injection molding machine and each of the plurality of peripheral devices; a code reader that reads the identification code; and a management unit including a storage unit that stores a correct combination of the identification code of the injection molding machine and the plurality of peripheral devices, and a confirmation determination unit for confirming whether the correct combination stored in the storage unit matches the identification code read by the code reader.

A method of molding a thermosetting resin, in particular of the epoxy resin type, in which a first mold is filled with the resin while causing the temperature of the resin to vary in application of a first temperature program, without exceeding the Tg of the resin. After the first mold has been filled, the resin is put under pressure while causing the temperature of the resin to vary in application of a second temperature program, without exceeding Tg, and a drop in the pressure exerted by the resin on the mold is detected with the instant at which this pressure presents a break of slope being identified as the instant t1. A second mold is filled with the thermosetting resin in application of the first temperature program. After the second mold has been filled, the resin is put under pressure in application of the second temperature program until an instant t2 close to t1. As from t2, the temperature of the resin is increased to exceed Tg.

Provided is an injection molding die capable of adjusting a size of a support member, preventing bending of a mold, and preventing occurrence of burrs without removing the mold and making the support member again. The present invention provides an injection molding die including a fixed mold and a movable mold that face each other, the fixed mold and the movable mold being clamped to form a cavity for molding a molded product, the injection molding die further including at least one support member that is provided to abut on a surface opposite to a surface on which the cavity is formed in either or both of the fixed mold and the movable mold, the at least one support member being a stretchable support member in a direction of the cavity.

A system, method and apparatus for controlling an injection unit to transfer a material to a mold cavity includes a first actuator and a second actuator, and a controller that is operatively connected to the first actuator and the second actuator. The first and second actuators are coupled to a ram of the injection unit. The first actuator rotates the ram within the barrel, and the second actuator translates the ram within the barrel. During a material fill stage of an injection cycle, the controller controls the first actuator to rotate the ram within the barrel. The controller also controls the second actuator to translate the ram within the barrel, and controls the second actuator to retract the ram away from a nozzle of the injection unit while exerting a compression force on the ram towards the nozzle.

Disclosed herein is an injection molding method for making optical thermoplastic lenses using 3D—printed functional wafers. The method employs a variable injection molding cavity temperature that is heated to at least wafer Tg—10° C.

A device for molding a semiconductor package including an upper mold configured to retain a substrate thereon, the substrate having semiconductor chips thereon, a lower mold defining a cavity and including a plurality of moving blocks, a bottom surface of the cavity defined by the moving blocks, the cavity configured to contain a molding resin, the moving blocks movably arranged under the cavity, a driving unit configured to movably drive the moving blocks, and a controller configured to control an raising order of the moving blocks by controlling the driving unit may be provided.

A method of temperature control of a shaping tool or components of a shaping working machine is performed by a temperature control medium disposed in at least one temperature control branch of a temperature control system. A previously ascertained relationship between geometrical data of the at least one temperature control branch and through-flow amounts of the temperature control medium is provided, and a reference through-flow amount is set by the previously ascertained relationship for the geometrical data of the at least one temperature control branch.

A hot runner injection molding apparatus includes a hot runner nozzle and a first heater coupled to the nozzle body of the nozzle. A separate mold gate insert surrounds a nozzle tip area of the nozzle. The mold gate insert is heated by a second heater that is separate and independent from the nozzle body heater. The temperature generated by the first and second heaters is measured by a first thermocouple and a second thermocouple, respectively. A controller is used to adjust at any time the temperature of the first and second heaters independently. The second heater is used to either i) melt, and thus enable a faster removal of, a colder molten material accumulated around the nozzle tip during a color change procedure or ii) to reduce or increase the temperature of the nozzle tip differently from one nozzle to the next.