An injection molding apparatus comprising: an injection molding machine, a heated manifold, a nozzle, the downstream end of the nozzle comprising an inner tubular member having a central flow channel and an outer circumferential surface and an outer tubular member having an inner tubular surface, the outer tubular member forming a seal surrounding the gate, the inner and outer tubular members being adapted to form a sealed circumferential gap, the inner tubular member including one or apertures extending radially through the inner tubular member to route flow radially from the fluid flow channel into the circumferential gap.

A method and apparatus for injection molding of plastic material into a cavity of a mold by means of at least one injector whose opening and closing occurs through an electronic control unit and wherein an undesired opening of the mold caused by any overpressure of the plastic material injected into the cavity of the mold is detected by means of transducers and corrected by means of the electronic control unit. The transducers are arranged outside the cavity of the mold.

A technique for providing assistance in setting the time to increase the clamping force is provided. A control device of an injection molding machine includes a clamping control part and a monitoring part. The clamping control part is configured to change, in a filling step of filling the inside of a mold device with a molding material during clamping, a set value of clamping force from a first set value to a second set value that is larger than the first set value, at a predetermined pressurizing timing in the middle of the filling step. The monitoring part is configured to monitor changes in the actual value of the clamping force due to changes in the set value of the clamping force.

An operation setting device includes a first step of inputting an operation sequence and an operation position of the ejector by touching a desired point in a graph displayed on the setting display screen, a second step of inputting operation parameters including an operation speed, an operation position, an operation time, and an operation pattern of the ejector on the basis of the operation position thus input, and a third step of displaying in the graph and numerically displaying in a numerical value display part of the setting display screen the operation position and the operation parameters thus input. The operation position and operation parameters for each operation set in the first step to the third step are displayed in the graph and numerically displayed in the numerical value display part.

A method and apparatus for injection molding of plastic material into a cavity of a mold by means of at least one injector whose opening and closing occurs through an electronic control unit and wherein an undesired opening of the mold caused by any overpressure of the plastic material injected into the cavity of the mold is detected by means of transducers and corrected by means of the electronic control unit. The transducers are arranged outside the cavity of the mold.

The invention relates to a system for controlling a shutter (110) slidably arranged in a plastic material injection nozzle (11), comprising a rotary electric motor (M) and a mechanism adapted to couple said motor (M) to the shutter to slidably drive it between a closing position of the nozzle and a maximum opening position of the nozzle, characterised in that said mechanism comprises: an eccentric (21) integral with an output shaft (20) of the motor so as to be rotationally driven by said output shaft, comprising a crank pin (22) parallel to the output shaft but non-coaxial with said shaft (20), a slide (23) adapted to be made integral with one end of the shutter (110), and a connecting rod (25), a first end of which is articulated on the crank pin (22) of the eccentric (21) and a second end is articulated on an axis (25b) of the slide (23) such that the rotation of the eccentric causes sliding of the oscillating shutter between the closing position and the maximum opening position.

A device for molding a semiconductor package including an upper mold configured to retain a substrate thereon, the substrate having semiconductor chips thereon, a lower mold defining a cavity and including a plurality of moving blocks, a bottom surface of the cavity defined by the moving blocks, the cavity configured to contain a molding resin, the moving blocks movably arranged under the cavity, a driving unit configured to movably drive the moving blocks, and a controller configured to control an raising order of the moving blocks by controlling the driving unit may be provided.

A method for injection molding of plastic material by means of at least one injector whose pin valve can be displaced between a fully closed position and a maximum open position in a controlled fashion according to a position and speed of the pin valve. During displacement of the pin valve from the fully closed position to the maximum open position, and/or vice versa, the pin valve is stopped in intermediate positions and the displacement speed thereof is uniform and constant. An initial opening step at maximum speed and one or more steps of inversion of the motion of the pin valve can be provided for.

According to one embodiment, a mold includes a substrate clamping surface, a cavity, a suction part, a vent, an intermediate cavity, and an opening/closing part. The substrate clamping surface contacts a surface of a processing substrate. The cavity is recessed from the substrate clamping surface. The suction part is recessed from the substrate clamping surface. The vent is provided on a path between the cavity and the suction part, communicates with the cavity, is recessed from the substrate clamping surface to a vent depth. The intermediate cavity is provided between the vent and the suction part on the path, communicates with the vent, and is recessed from the substrate clamping surface to an intermediate cavity depth deeper than the vent depth. The opening/closing part opens and closes the path and is provided between the intermediate cavity and the suction part on the path.

There is provided a structure for positioning a first mold part of a mold on a mold mounting face in an injection molding machine. The structure comprises a positioner configured to connect the first mold part to part of the injection molding machine, wherein the positioner is adjustable to position the first mold part on the mold mounting face. The structure further comprises controller executable instructions executable in a controller with which to resolve an alignment parameter of the mold using a feedback signal from a sensor. Further provided is a method of operating an injection molding machine which method comprises the steps of positioning a first mold part of a mold on a mold mounting face using a positioner and appreciating an alignment parameter of the mold with reference to a feedback signal from a sensor.