B29C2945/76765

Computer-implemented simulation method for injection-molding process

A computer-implemented simulation method for use in a molding process by a computer process is disclosed. The method includes steps of specifying a simulating domain comprising a mold cavity and a barrel of an injection machine, wherein the barrel is configured to connect to the mold cavity; creating at least one mesh by dividing at least part of the simulating domain; specifying boundary conditions of the mesh by taking into consideration at least one motion of a screw in the barrel; and simulating a first injection-molding process of a molding material by using the boundary conditions to generate a plurality of molding conditions.

SEMICONDUCTOR DIE CARRIER STRUCTURE

An apparatus having a first portion including a first front wall, a first rear wall, and a bottom wall integrally coupled to the first front wall and the first rear wall, and pivotal pin structures integrally coupled to and extending from the first rear wall. The apparatus includes a second portion having a second front wall, a second rear wall, and a top wall integrally coupled to the second front wall and the second rear wall, and pin holders integrally coupled to and extending from the second rear wall and at an offset angle with reference to the top wall. The pivotal pin structure includes a base support connected to the first rear wall and a shaft connected to the base support, and the pin holder defines an opening sized and shaped to accept the shaft. The first and second portions are sized and shaped to be pivotally movable between open and closed configurations.

Reinforced thermoplastic and fabric injection overmolding
20210016519 · 2021-01-21 ·

An LWRT plus fabric injection overmolding process for the direct injection molding of thermoplastic features onto the B-side of a formed, finished Light Weight Reinforced Thermoplastic panel. The panel having an A-side finish cloth, non-woven, TPO, Vinyl or similar material placed into the injection molding press and injection molding tool, and then the features are injection molded onto the panel without damaging the A-side finish.

METHODS FOR CONTROLLING CO-INJECTION PLASTIC PRESSURE RATIO BETWEEN INDIVIDUAL FLOW FRONT LAYERS

A method and system for co-injection molding of two molten plastic materials that allows monitoring and utilization of injection pressure and optionally melt pressure and/or flow front pressure during an injection run. A controller alters the injection pressure so as to achieve and maintain optimal or desired ratios of injection pressure, and optionally melt pressure and/or flow front pressure, of the two molten plastic materials. This allows for more precise part manufacture, including reducing the thickness of a skin or shell layer compared to a core layer of a molded part.

COMPUTER-IMPLEMENTED SIMULATION METHOD FOR INJECTION-MOLDING PROCESS

A computer-implemented simulation method for use in a molding process by a computer process is disclosed. The method includes steps of specifying a simulating domain comprising a mold cavity and a barrel of an injection machine, wherein the barrel is configured to connect to the mold cavity; creating at least one mesh by dividing at least part of the simulating domain; specifying boundary conditions of the mesh by taking into consideration at least one motion of a screw in the barrel; and simulating a first injection-molding process of a molding material by using the boundary conditions to generate a plurality of molding conditions.

Semiconductor die carrier structure

An apparatus having a first portion including a first front wall, a first rear wall, and a bottom wall integrally coupled to the first front wall and the first rear wall, and pivotal pin structures integrally coupled to and extending from the first rear wall. The apparatus includes a second portion having a second front wall, a second rear wall, and a top wall integrally coupled to the second front wall and the second rear wall, and pin holders integrally coupled to and extending from the second rear wall and at an offset angle with reference to the top wall. The pivotal pin structure includes a base support connected to the first rear wall and a shaft connected to the base support, and the pin holder defines an opening sized and shaped to accept the shaft. The first and second portions are sized and shaped to be pivotally movable between open and closed configurations.

METHOD AND APPARATUS FOR MANUFACTURING IRON CORE PRODUCT

According to one embodiment, a method for manufacturing an iron core product includes providing an iron core body which includes a magnet insertion hole in which a permanent magnet is disposed, injecting a molten resin into the magnet insertion hole of the iron core body at a first pressure, and setting a pressure applied to the molten resin to a second pressure lower than the first pressure after the molten resin is injected into the magnet insertion hole and before the molten resin is cured.

SEMICONDUCTOR DIE CARRIER STRUCTURE

An apparatus having a first portion including first front wall, first rear wall, and bottom wall integrally coupled to the first front wall and the first rear wall, and pivotal pin structures integrally coupled to and extending from the first rear wall. The apparatus includes a second portion having second front wall, second rear wall, and top wall integrally coupled to the second front wall and the second rear wall, and pin holders integrally coupled to and extending from the second rear wall and at an offset angle with reference to the top wall. The pivotal pin structure includes a base support connected to the first rear wall and a shaft connected to the base support, and the pin holder defines an opening sized and shaped to accept the shaft. The first and second portions are sized and shaped to be pivotally movable between an open and closed configurations.

SEMICONDUCTOR DIE CARRIER STRUCTURE

An apparatus having a first portion including a first front wall, a first rear wall, and a bottom wall integrally coupled to the first front wall and the first rear wall, and pivotal pin structures integrally coupled to and extending from the first rear wall. The apparatus includes a second portion having a second front wall, a second rear wall, and a top wall integrally coupled to the second front wall and the second rear wall, and pin holders integrally coupled to and extending from the second rear wall and at an offset angle with reference to the top wall. The pivotal pin structure includes a base support connected to the first rear wall and a shaft connected to the base support, and the pin holder defines an opening sized and shaped to accept the shaft. The first and second portions are sized and shaped to be pivotally movable between open and closed configurations.

METHOD FOR SIMULTANEOUS CLOSED LOOP CONTROL OF GAS ASSIST AND GAS COUNTER PRESSURE IN AN INJECTION MOLDING PROCESS RELATIVE TO PLASTIC MELT PRESSURE AND PLASTIC MELT FLOW POSITION

A controller for an injection molding system is in communication with a melt flow control unit, a gas assist control unit, and a gas counter pressure control unit. The controller can effect real-time adjustments to gas assist pressure and/or gas counter pressure as a function of melt pressure or flow front position.