A lens array unit includes a lens array including a plurality of lenses, a first side plate, and a second side plate, the first side plate and the second side plate being configured to hold the plurality of lenses therebetween, and a frame made of resin and including a first supporting portion and a second supporting portion, the first supporting portion being in contact with an outside surface of the first side plate, the second supporting portion being in contact with an outside surface of the second side plate, the first supporting portion and the second supporting portion being configured to hold the lens array therebetween and support the lens array. The outside surface of the first side plate includes a plurality of first concave portions spaced from each other in an array direction of the lenses and configured to fit with the first supporting portion.

Implementations of semiconductor devices may include: a microlens array formed of a plurality of microlenses. Each of the plurality of microlenses may have a first side and a second side. A layer of polymer may be formed over the second side of each of the plurality of microlenses and a low index box may be between adjacent microlenses of the plurality of microlenses.

Implementations of a microlens system may include a first layer including a first refractive index, the first layer including one or more substantially hemispherical elements formed therein; a second layer including a second refractive index coupled over the substantially hemispherical elements of the first layer; and a third layer including a third refractive index coupled over the second layer. A value of the first refractive index may be larger than a value of the third refractive index and a value of the second refractive index and the value of the second refractive index may be less than a value of the third refractive index.

Silicone-containing light fixture optics. A method for manufacturing an optical component may include mixing two precursors of silicone, opening a first gate of an optic forming device, moving the silicone mixture from the extrusion machine into the optic forming device, cooling the silicone mixture as it enters the optic forming device, filling a mold within the optic forming device with the silicone mixture, closing the first gate, and heating the silicone mixture in the mold to at least partially cure the silicone. Alternatively, a method for manufacturing an optical component may include depositing a layer of heat cured silicone optical material to an optical structure, arranging one or more at least partially cured silicone optics on the layer of heat cured silicone optical material, and heating the heat cured silicone optical material to permanently adhere the one or more at least partially cured silicone optics to the optical structure.

Manufacturing opto-electronic modules (1) includes providing a substrate wafer (PW) on which detecting members (D) are arranged; providing a spacer wafer (SW); providing an optics wafer (OW), the optics wafer comprising transparent portions (t) transparent for light generally detectable by the detecting members and at least one blocking portion (b) for substantially attenuating or blocking incident light generally detectable by the detecting members; and preparing a wafer stack (2) in which the spacer wafer (SW) is arranged between the substrate wafer (PW) and the optics wafer (OW) such that the detecting members (D) are arranged between the substrate wafer and the optics wafer. Emission members (E) for emitting light generally detectable by the detecting members (D) can be arranged on the substrate wafer (PW). Single modules (1) can be obtained by separating the wafer stack (2) into separate modules.

A device for the laser-assisted processing of a material adhering to a substrate or a body that is associated with, or free of, a substrate or of its surface, in particular by TPA/MPA and/or by treatment with an ultrashort pulse laser. A sample holder of a positioning system holds the material to be processed. A laser source emits laser pulses or laser pulse sequences. Focusing optics shape the laser pulses or laser pulse sequences to impinge in a focal point or a focal volume in the region of the material or body to be processed so that a 2- or multi-photon polymerization can take place there, or in that they impinge in a focal point or in a focal volume in the region of the body in such a way that material located there or focal volume is subjected to the desired chemical and/or physical changes.

The invention relates to a method of manufacturing a microprojector for a projection display, wherein the microprojector comprises a support on which a projector lens array with a plurality of projector lenses is arranged, wherein on a side of the support facing away from the projector lens array, an object structure array with a plurality of e.g. identical object structures is arranged, wherein at least one projector lens is associated with one object structure such that the projections of the object structures superpose through the projector lenses to form a full image, wherein e.g. the distance between a projector lens and the associated object structures corresponds to the focal length of the respective projector lens, wherein on the object structure array, a condenser lens array is arranged such that in case of an illumination of the condenser lens array, a Köhler illumination of the object structures or projector lens associated with the respective condenser lenses is permitted.

Manufacturing a pre-molded stack of one or more lenses to be installable on a curved substrate such as a vehicle windshield includes placing a moldable stack of one or more lenses and adhesive layer(s) on a mold, applying heat and pressure to the moldable stack to produce a pre-molded stack of one or more lenses from the moldable stack, and removing the pre-molded stack from the mold. The pre-molded stack may have a compound curvature, which may match a curvature of the curved substrate. The mold may be formed using three-dimensional shape data derived from the curved substrate, such as by optically scanning the curved substrate.

A wafer lens array includes a wafer lens formed by arranging a plurality of plate members on a plane, each plate member including a first window configured to allow light for forming an optical image to pass through, a first light-shielding portion formed on an outer circumference of the first window and a second window formed on an outer circumferential side of the first light-shielding portion and configured to allow illumination light to pass through, and the wafer lens in plurality are coaxially layered and the layered wafer lenses are bonded and fixed together in a region of the second window.

Techniques related to optics formation using pick-up tools are disclosed. Optical elements are formed by pressing a pick-up tool (PUT) against elastomeric material deposited on a light-outputting side of light-emitting diode (LED) devices. Pressing the PUT against the elastomeric material causes a molded shape of the PUT to be transferred to the elastomeric material. This forms the optical elements in the elastomeric material.